Generally, speckle noise is regarded as unavoidable in holographic projection, and it results from unexpected high spatial frequency components of diffracted light at the sharp edge of pixel openings in a spatial light modulator. Speckle noise typica...
Flexible interconnection transformation of a distribution network using all-control power electronics technology will help to overcome the technical bottleneck of distributed generation (DG) penetration and high-quality power supply in the traditiona...
In the transient analysis of an engineering power electronics device, the order of its equivalent circuit model is excessive large. To eliminate this issue, some model order reduction (MOR) methods are proposed in the literature. Compared to other MO...
As the demand for high-density, high-performance technologies in semiconductor systems increases, efforts are being made to mitigate and optimize the issues of high current density and heat generation within interconnects to ensure reliability. While...
Electronic textiles (e-textiles) merge textiles and electronics to monitor physiological and environmental changes. Innovations in textile functionalities and diverse applications have propelled e-textiles’ popularity. However, challenges like...
A novel and flexible interconnecting framework for microgrids and corresponding energy management strategies are presented, in response to the situation of increasing renewable-energy penetration and the need to alleviate dependency on energy storage...
In this paper, we first build the 3D model of coaxial TSV(CTSV), RDL, and bump of the CTSV interconnect, and extract the equivalent circuit model of each part. Then, we get the S-parameters of the 3D and equivalent circuit model of the CTSV interconn...
The Qinghai–Tibet power grid interconnection project is the first power transmission project with the highest altitude, longest transmission lines, longest distance running across the plateau frozen ground, and highest iron tower in the world. The ri...
Aluminum–copper alloy (AlCu) is commonly utilized as interconnect material in low-power devices. However, as the size of electronic devices continues to decrease and current density increases, electromigration (EM) has emerged as a significant...
Low-temperature solid oxide fuel cells permit the possibility of metallic interconnects over conventional ceramic interconnects. Among various metallic interconnects, the ferritic interconnects are the most promising. However, chromium poisoning in t...
As distributed energy resources (DERs) become increasingly integrated into distribution systems, ensuring safe and reliable interconnection has become a critical challenge. This study explores the use of an Advanced Distribution Management System (AD...
The detector array chips can be used to capture the transient space-time signal of the pulse radiation field. It is mainly composed of a photoelectric array detector and a readout circuit. However, the metal leads used to connect the detector and the...
Three-dimensional (3D) interconnection technology based on glass through vias (TGVs) has been used to integrate passive devices, and optoelectronic devices due to its superior electrical qualities, outstanding mechanical stability, and lower cost. Ne...
In bare-die integration based on low-temperature co-fired ceramic (LTCC) multilayer interconnects, broadband signal transmission is often limited by impedance mismatch, parasitic effects introduced by gold-wire bonding, and discontinuities in interla...
Modern automotive systems must satisfy strict reliability requirements. Most real vehicle systems and safety-critical networks have complex interconnections. The sensitivities and probabilistic uncertainties of the reliability of systems with complex...
The model-scale tunnel is used in this investigation to analyze the maximum smoke temperature rise of the interconnected tunnel for various longitudinal ventilation velocities, blockage ratios, and heat release rates where the fire is at the confluen...
This paper proposes a model predictive control (MPC) method based on an interconnected model to maximize the ocean wave energy extracted by a wave-energy converter (WEC) array. In the proposed method, a formally uniform interconnected model is applie...
The ongoing energy transition has caused a paradigm shift in the architecture of power systems, increasing their sustainability with the installation of renewable energy sources (RES). In most cases, the efficient utilization of renewable energy requ...
This paper proposes a distributed robust dispatch approach to solve the economic dispatch problem of the interconnected systems with a high proportion of wind power penetration. First of all, the basic principle of synchronous alternating direction m...
With the increasing demand for multi-function and highly integrated space-borne microwave products, a three-dimensional heterogeneous integration based on special substrates and other systems-in-package has difficulty with meeting the requirements of...
The ultra-low-k dielectric material replacing the conventional SiO2 dielectric medium in coupled multilayer graphene nanoribbon (MLGNR) interconnects is presented. An equivalent distributed transmission line model of coupled MLGNR interconnects is es...
Flexible and stretchable electronic yarn containing electronic components (i.e., hybrid electronic yarn) are essential for manufacturing smart textile garments or fabrics. Due to their low stretchability and easy interconnection fracture, previously...
Distributed interconnected systems are complex dynamic systems where every single subsystem has an impact on other subsystems. Actuators are key components in interconnected dynamic systems, which are prone to faults due to age and unexpected conditi...
Networked interconnected systems are often deployed in infrastructures with resource allocation using isolated virtual environments. The technological implementation of such systems varies significantly, making it difficult to accurately estimate the...
The interconnection network represents an interconnected structure of processors that strongly determines the performance quality of a parallel processing system. The shuffle-exchange permutation (SEP) network with three degrees has high fault tolera...
Carbon allotropes have generated much interest among different scientific communities due to their peculiar properties and potential applications in a variety of fields. Carbon nanotubes and more recently graphene have shown very interesting electric...
In an increasingly interconnected health care system, laboratory medicine can facilitate diagnosis and treatment of patients effectively. This article describes necessary changes and points to potential challenges on a technical, content, and organiz...
Following Moore’s law, the density of integrated circuits is increasing in all dimensions, for instance, in 3D stacked chip networks. Amongst other electro-optic solutions, multimode optical interconnects on a silicon interposer promise to enab...
Efficient data movement in multi-node systems is a crucial issue at the crossroads of scientific computing, big data, and high-performance computing, impacting demanding data acquisition applications from high-energy physics to astronomy, where dedic...
Interconnecting nanodevices with the aim of assembling quantum computing architectures is one of the current outstanding challenges. At the nanoscale, the quantum interconnects become comparable in complexity with the active devices and should be tre...
In this article, resonance phenomena of high-speed interconnects and power delivery networks in glass packages are measured and analyzed. The resonances are generated in the interconnection by the physical dimension, cancelation of reactance componen...
In order to effectively employ through-glass vias (TGVs) for high-frequency software package design, it is crucial to accurately characterize the S-parameters of vertical interconnection structures in 3D glass packaging. A methodology is proposed for...
In this work, an adaptive fixed-time dynamic triggered control issue for interconnected power systems under Denial-of-Service (DoS) attacks is investigated. Such attacks would impede the transmission of sensor signals in interconnected power systems,...
With the huge requirement of high frequency, multi-function and high reliability, the quality of microwave circuit interconnection has become an important factor that significantly affects the improvement of microwave electronic system performance. T...
Designing battery packs is a trade-off between power capability and capacity. Often, high power is only desired for short periods; otherwise, high capacities are preferred. To meet these requirements, hybrid packs comprising high-power and high-energ...
The advance of semiconductor technology not only enables integrated circuits with higher density and better performance but also increases their vulnerability to various aging mechanisms which occur from front-end to back-end. Analysis on the impact...
Partial shading conditions can cause low output power, hotspots, and a reduced lifespan in photovoltaic arrays. Interconnection (IC) and differential power processing (DPP) can be used to mitigate these effects. When individually applied to an array,...
Metal interconnects with a vertical wavy structure have been studied to realize high-density and low-electric-resistance stretchable interconnects. This study proposed a new method for fabricating vertical wavy structured metal interconnects that com...
A novel energy-regenerative hydraulically interconnected ISD (inerter–spring–damper) suspension system (ER-HIISDS) is proposed by incorporating a fluid inerter into the hydraulic interconnection architecture, with the objective of simulta...
Local renewable energy microgrids in remote regions are typically characterized by high renewable energy penetration and weak grid-interconnection channels. These features lead to insufficient inertia and poor stability in both the microgrid and the...
This study clarifies the conditions for the bridging and conduction of a gap on a metal interconnect using copper microparticles dispersed with silicon oil. An AC voltage applied to a metal interconnect with a gap covered by a dispersion of metal mic...
Interconnection networks provide an effective means by which components of a system such as processors and memory modules communicate to provide reliable connectivity. This facilitates the realization of a highly efficient network design suitable for...
The deployment of isolated microgrids has witnessed exponential growth globally, especially in the light of prevailing challenges faced by many larger power grids. However, these isolated microgrids remain separate entities, thus limiting their poten...
In this study, an interconnected metamaterial was proposed to suppress flexural vibration. The interconnected metamaterial can improve the manufacturing and installation processes in terms of convenience because it can be fabricated in the form of a...
This work suggests a method for obtaining heat-resistant protective coatings for 08Kh17T stainless steel that can be used as interconnect material for solid oxide fuel cells. The suggested approach is based on the layer-by-layer precipitation of nick...
To enhance the quality of output power from regional interconnected power grid and strengthen the stability of overall system, a hybrid energy storage system (HESS) is applied to traditional multi-area interconnected power system to improve the perfo...
Islands face unique challenges on their journey towards achieving carbon neutrality by the mid-century, due to the lack of energy interconnections, limited domestic energy resources, extensive fossil fuel dependence, and high load variance requiring...
Rapid increases in distributed photovoltaic (PV) penetration have brought additional challenges to distribution network planning and operation. Meanwhile, flexible interconnection devices such as soft open point integrated with battery energy storage...
The growing demand for high-efficiency photovoltaic (PV) technologies has intensified interest in advanced cell architectures, including hybrid passivated back contact (HPBC) solar cells. Conventional solder-based interconnection processes require hi...
With the integration of large-scale wind power into the power grid, the impact on system stability, especially the issue of low-frequency oscillations caused by small disturbances, is becoming increasingly prominent. Therefore, this paper proposes a...
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