Micromachines

To address the pressing need for compact and highly reliable perception systems in autonomous mobile robots, a compact bandpass filter (BPF) integrating slot-line resonator with substrate-integrated waveguide (SIW) technology for robotic millimeter-wave radar front ends was proposed. By integrating slot-line resonators between adjacent SIW cavities, the proposed design effectively increases the filtering order without increasing the layout area. This approach not only generates extra transmission poles but also creates a sharp transmission zero at the upper stopband, thereby significantly enhancing out-of-band rejection. This characteristic is crucial for robotic radar operating in complex and dynamic environments, as it effectively suppresses out-of-band interference and improves the system signal-to-noise ratio and detection reliability. To validate the performance, a prototype filter operating in the 24.25–27.5 GHz passband was fabricated. The measured results show good agreement with simulations, demonstrating low insertion loss, compact size, and wide stopband. Finally, to validate its compatibility with robotic radar modules, the chip was assembled onto a PCB using surface-mount technology. The responses of the bare die and the packaged module were then compared to evaluate the impact of integration on the overall RF performance. The proposed design offers a key filtering solution for next-generation high-performance, miniaturized robotic perception platforms.

Bond wire degradation represents the predominant failure mechanism in IGBT modules, accounting for approximately 70% of power converter failures and posing significant reliability challenges in modern power electronic systems. Existing monitoring techniques face inherent trade-offs between measurement accuracy, implementation complexity, and electromagnetic compatibility. This paper proposes a physics-constrained ensemble learning framework for non-intrusive bond wire health assessment via $V_{\mathrm{ce}-\mathrm{on}}$ prediction. The methodological innovation lies in the synergistic integration of multidimensional feature engineering, adaptive ensemble fusion, and domain-informed regularization. A comprehensive 16-dimensional feature vector is constructed from multi-physical measurements, including electrical, thermal, and aging parameters, with novel interaction terms explicitly modeling electro-thermal stress coupling. A dynamic weighting mechanism then adaptively fuses three specialized gradient boosting models (CatBoost for high-current, LightGBM for thermal-stress, and XGBoost for late-life conditions) based on context-aware performance assessment. Finally, the meta-learner incorporates a physics-based regularization term that enforces fundamental semiconductor properties, ensuring thermodynamic consistency. Experimental validation demonstrates that the proposed framework achieves a mean absolute error of 0.0066 V and R² of 0.9998 in predicting $V_{\mathrm{ce}-\mathrm{on}}$, representing a 48.4% improvement over individual base models while maintaining 99.1% physical constraint compliance. These results establish a paradigm-shifting approach that harmonizes data-driven learning with physical principles, enabling accurate, robust, and practical health monitoring for next-generation power electronic systems.

With the rapid development of semiconductor manufacturing technology, methods to effectively control the production process, reduce variation in the manufacturing process, and improve the yield rate represent important competitive factors for wafer factories. Wafer bin maps, a method for characterizing wafer defect patterns, provide valuable information for engineers to quickly identify potential root causes through accurate pattern recognition. Vision-based deep learning approaches rely on visual patterns to achieve robust performance. However, they rarely exploit the rich semantic information embedded in defect descriptions, limiting interpretability and generalization. To address this gap, we propose YOLO-LA, a lightweight prototype-based vision–language alignment framework that integrates a pretrained frozen YOLO backbone with a frozen text encoder to enhance wafer defect recognition. A learnable projection head is introduced to map visual features into a shared embedding space, enabling classification through cosine similarity Experimental results on the WM-811K dataset demonstrate that YOLO-LA consistently improves classification accuracy across different backbones while introducing minimal additional parameters. In particular, YOLOv12 achieves the fastest speed while maintaining competitive accuracy, whereas YOLOv10 benefits most from semantic prototype alignment. The proposed framework is lightweight and suitable for real-time industrial wafer inspection systems.