Journal Description
Micromachines
Micromachines
is a peer-reviewed, open access journal on the science and technology of small structures, devices and systems, published monthly online by MDPI. The Chinese Society of Micro-Nano Technology (CSMNT) and AES Electrophoresis Society are affiliated with Micromachines and their members receive a discount on the article processing charges.
- Open Access— free for readers, with article processing charges (APC) paid by authors or their institutions.
- High Visibility: indexed within Scopus, SCIE (Web of Science), PubMed, PMC, Ei Compendex, dblp, and other databases.
- Journal Rank: JCR - Q2 (Instruments and Instrumentation) / CiteScore - Q1 (Mechanical Engineering)
- Rapid Publication: manuscripts are peer-reviewed and a first decision is provided to authors approximately 16.6 days after submission; acceptance to publication is undertaken in 2.6 days (median values for papers published in this journal in the first half of 2026).
- Recognition of Reviewers: reviewers who provide timely, thorough peer-review reports receive vouchers entitling them to a discount on the APC of their next publication in any MDPI journal, in appreciation of the work done.
- Testimonials: See what our editors and authors say about Micromachines.
- Companion journal: Micro.
- Journal Cluster of Instruments and Instrumentation: Actuators, AI Sensors, Instruments, Metrology, Micromachines and Sensors.
Impact Factor:
3.5 (2025);
5-Year Impact Factor:
3.5 (2025)
Latest Articles
Editorial for Special Issue “High-Reliability Semiconductor Devices and Integrated Circuits, 3rd Edition”
Micromachines 2026, 17(7), 841; https://doi.org/10.3390/mi17070841 (registering DOI) - 15 Jul 2026
Abstract
Semiconductor devices and integrated circuits are increasingly deployed in automobiles, avionics, aerospace platforms, radiation-monitoring systems, high-power optoelectronics, and other safety- or mission-critical applications [...]
Full article
(This article belongs to the Special Issue High-Reliability Semiconductor Devices and Integrated Circuits, 3rd Edition)
Open AccessArticle
Data-Driven MOX Chemosensing for Beer Discrimination: Towards Rapid Food Quality Screening
by
Luca Manini, Elisabetta Poeta, Estefanía Núñez-Carmona and Veronica Sberveglieri
Micromachines 2026, 17(7), 840; https://doi.org/10.3390/mi17070840 (registering DOI) - 15 Jul 2026
Abstract
Beer quality assessment increasingly requires rapid and scalable analytical tools for product discrimination and authenticity control. In this study, a data-driven metal oxide semiconductor (MOX) chemosensing approach was investigated for the discrimination of commercial lager beers with different alcohol contents and brands. Alcoholic
[...] Read more.
Beer quality assessment increasingly requires rapid and scalable analytical tools for product discrimination and authenticity control. In this study, a data-driven metal oxide semiconductor (MOX) chemosensing approach was investigated for the discrimination of commercial lager beers with different alcohol contents and brands. Alcoholic and alcohol-free beer samples from four commercial brands were analyzed using a six-element SnO2-based MOX sensor array, and the resulting response patterns were classified using supervised machine-learning algorithms. Headspace solid-phase microextraction gas chromatography–mass spectrometry (HS-SPME-GC–MS) was employed as a reference technique to characterize volatile organic compound profiles and support the interpretation of sensor-based fingerprints. GC–MS analysis highlighted a shared volatile backbone dominated by fermentation-related compounds, while also revealing brand- and category-dependent differences in VOC distribution. The MOX sensor array captured these differences as multidimensional volatile fingerprints. Machine-learning models achieved high classification performance in brand-matched alcoholic versus alcohol-free comparisons, with balanced accuracy ranging from 0.937 to 1.000, while brand discrimination within the same category reached balanced accuracy values of 0.875 (alcoholic) and 0.933 (alcohol-free). These results highlight MOX-based chemosensing combined with data-driven analysis as a rapid, portable platform for beer discrimination, with applications in food quality screening, authenticity assessment, and at-line monitoring.
Full article
(This article belongs to the Special Issue Portable Sensing Systems in Biological and Chemical Analysis)
►▼
Show Figures

Figure 1
Open AccessArticle
A Self-Centering, Blade-Assisted, Electrowetting-Enabled Strategy for Precise Droplet Splitting on Open Digital Microfluidic Platforms
by
Hao Liang, Liang Chen, Haifeng Zhang and Xiaowei Liu
Micromachines 2026, 17(7), 839; https://doi.org/10.3390/mi17070839 (registering DOI) - 15 Jul 2026
Abstract
Droplet splitting technology on open digital microfluidic platforms still faces significant challenges in terms of process complexity, the degree of automation, and operating conditions, which hinder its further development. This study proposes a fully automated method for precise droplet splitting based on printed
[...] Read more.
Droplet splitting technology on open digital microfluidic platforms still faces significant challenges in terms of process complexity, the degree of automation, and operating conditions, which hinder its further development. This study proposes a fully automated method for precise droplet splitting based on printed circuit boards with open-coplanar asymmetric electrodes and a slippery liquid-infused porous surface. This method uses simple square electrodes arranged in a 3 × 5 array, combined with low-adhesion blade-assisted cutting and electrowetting-on-dielectric to drive droplet splitting, enabling accurate, stable, and repeatable automated droplet splitting on an open digital microfluidic platform. It has the advantages of a simple method, easy maintenance and integration, and high automation. This study systematically investigated the effects of droplet volume, applied voltage, blade thickness, cutting speed, and electrode shape on droplet splitting performance. We developed an active droplet position calibration method based on a simple 3 × 3 square electrode array combined with an enveloping voltage configuration strategy. For droplets with a volume of 10 μL, the positioning error can be controlled to within 0.06 mm, representing a reduction of more than 95% compared to the conventional EWOD free drive method. The experimental results show that to achieve stable and approximately equal-volume droplet splitting, the cutting speed needs to exceed the critical value related to the blade thickness. Among the square, zigzag, and hexagonal electrode shapes tested, the square electrode required the lowest splitting voltage. When the blade thickness is 0.3 mm, the droplets can be successfully split at a minimum voltage of 165 V. After increasing the splitting voltage to 400 V, the droplet splitting time was reduced from 5.57 s to 0.27 s, with a reduction of 95.2%, which significantly improves droplet splitting efficiency. This method provides a practical, stable, automated, and precise droplet splitting method for sample preparation, biochemical reactions, and portable droplet analysis systems.
Full article
(This article belongs to the Special Issue Advanced Biosensors: Nanomaterials, Micro/Nano Devices and Applications)
►▼
Show Figures

Figure 1
Open AccessReview
Advances in FPGA-Based Laser Frequency Stabilization Techniques
by
Zhilin Yan, Wenqiang Fan, Longjie Zhang, Wanxiao Gao, Cunwei Zhang, Jiaming Zhang, Tie Li, Yancheng Guo, Yulei Wang, Zhiwei Lu, Qiunan Yang and Zhenxu Bai
Micromachines 2026, 17(7), 838; https://doi.org/10.3390/mi17070838 - 14 Jul 2026
Abstract
Laser frequency stabilization underpins precision metrology, optical atomic clocks, quantum optics, and laser spectroscopy. In recent years, field-programmable gate arrays (FPGAs) have become attractive for this task because signal generation, phase-sensitive detection, digital filtering, feedback control, lock monitoring, and automatic re-locking can be
[...] Read more.
Laser frequency stabilization underpins precision metrology, optical atomic clocks, quantum optics, and laser spectroscopy. In recent years, field-programmable gate arrays (FPGAs) have become attractive for this task because signal generation, phase-sensitive detection, digital filtering, feedback control, lock monitoring, and automatic re-locking can be integrated on compact and reconfigurable platforms. This review examines recent progress in FPGA-based laser frequency stabilization from four linked perspectives: stabilization principles, digital implementation, system architecture, and intelligent control. We first summarize representative error-signal generation methods, including Pound–Drever–Hall locking, saturation absorption spectroscopy, frequency modulation spectroscopy, and modulation transfer spectroscopy. We then discuss the FPGA functions that determine practical performance, such as data acquisition, direct digital synthesis, digital demodulation, proportional-integral-derivative (PID)/infinite impulse response (IIR) filtering, latency management, and lock-state monitoring. Mixed-signal, all-digital, distributed, and machine-learning-assisted systems are compared to show how bandwidth, latency, stability, integration, cost, and automation are balanced in different designs. This review closes by identifying remaining challenges in analog-to-digital converter/digital-to-analog converter (ADC/DAC) resolution, converter noise, loop latency, actuator bandwidth, long-term robustness, and algorithm portability, and by outlining future directions toward low-latency, software-defined, and intelligent stabilization platforms.
Full article
(This article belongs to the Topic Collaborative Innovation of Optical Fiber Communication, Optical Sensors, and Lasers: New Trends and Technologies)
►▼
Show Figures

Figure 1
Open AccessArticle
Enhancing Aluminum Cutting Quality Through XGBoost-Assisted Optimization of Ultrafast Femtosecond Laser Processing
by
Hyunbin Kang, Eunyeop Ji, Vassilia Zorba, Dongkyoung Lee and Minok Park
Micromachines 2026, 17(7), 837; https://doi.org/10.3390/mi17070837 - 14 Jul 2026
Abstract
The slitting of aluminum (Al) foil is a critical process in secondary battery manufacturing, where cut quality directly affects electrode uniformity and production yield. Although femtosecond (fs) laser processing has emerged as a promising approach for high-precision foil cutting, residual debris generated during
[...] Read more.
The slitting of aluminum (Al) foil is a critical process in secondary battery manufacturing, where cut quality directly affects electrode uniformity and production yield. Although femtosecond (fs) laser processing has emerged as a promising approach for high-precision foil cutting, residual debris generated during material removal can degrade product quality and requires accurate process evaluation. In this study, a hybrid framework combining adaptive computer vision and eXtreme Gradient Boosting (XGBoost) was developed for automated debris quantification, quality classification, and process optimization of fs laser-processed Al foils. The image processing algorithm automatically detects debris boundaries from scanning electron microscopy images and extracts key geometrical descriptors, which are subsequently used as input features for XGBoost models. The developed framework successfully distinguished acceptable and defective processing conditions and accurately predicted residual debris sizes. Experimental validation under previously unseen processing conditions confirmed excellent agreement between predicted and measured debris sizes. By enabling automated and interpretable quality assessment, the proposed framework provides a scalable foundation for defect quantification and machine-learning-assisted process optimization in advanced laser manufacturing.
Full article
(This article belongs to the Special Issue Research Progress of Ultra-Precision Micro-Nano Machining, Second Edition)
►▼
Show Figures

Figure 1
Open AccessFeature PaperArticle
Microscopic Mechanism of Glass Surface Activation, Annealing and Etching on Glass–Ti/Cu Interfacial Adhesion
by
Tailong Shi, Wending Yang, Qi Li, Jingxuan Yang, Zhonghao Li, Hua Hong, Zhong Zhang, Guodong Zhang and Andrew C. Chang
Micromachines 2026, 17(7), 836; https://doi.org/10.3390/mi17070836 - 14 Jul 2026
Abstract
Due to its excellent electrical and thermal performance, glass packaging demonstrates significant potential in heterogeneous integration of chiplets advanced packaging system, but limited by its poor interfacial adhesion strength between glass and metals. This article studies the mechanisms of glass–metal bonding interface at
[...] Read more.
Due to its excellent electrical and thermal performance, glass packaging demonstrates significant potential in heterogeneous integration of chiplets advanced packaging system, but limited by its poor interfacial adhesion strength between glass and metals. This article studies the mechanisms of glass–metal bonding interface at the microscale level, and the adhesion strength at the macroscale level. In detail, the changes of the adhesion strength after glass surface activation, annealing and micro-etching processes were characterized, and the correlation between the microscale mechanisms and the macroscale adhesion variations of each process was studied. X-ray photoelectron spectroscopy (XPS) results indicate that the increase in Si-OH bond is the key to glass surface activation. Fourier transform infrared spectroscopy (FTIR) was applied to quantitatively correlate the dynamic evolution of surface polar hydroxyl groups on glass substrates with the subsequent glass–metal interfacial bonding strength, and verified the conclusion above. The adhesion strength increased by 2.3 times after surface activation, and by 4.1 times after annealing, while it decreased slightly after etching. Furthermore, the glass–Ti seed layer interface was studied at the atomic level to better analyze the changes in macroscopic adhesion. XPS depth profiling confirmed the formation of Si-O-Ti bonds at the glass–Ti interface, which may contribute to the enhanced adhesion. After annealing, X-ray diffractometer (XRD) characterization revealed the great change in grain structure caused a reduction in residual stress within the plated layer.
Full article
(This article belongs to the Special Issue Electronic and Photonic Device Integration and Packaging)
►▼
Show Figures

Figure 1
Open AccessArticle
An Open-Access Dialysis Membrane-Integrated Microfluidic Device for Generating Drug Exposure Profiles Through Molecular-Weight-Dependent Transport
by
Hajime Miyashita, Kenta Shinha, Hiroko Nakamura, Moeno Kadoguchi, Hiroshi Arakawa and Hiroshi Kimura
Micromachines 2026, 17(7), 835; https://doi.org/10.3390/mi17070835 - 14 Jul 2026
Abstract
Conventional in vitro assays and many microphysiological systems struggle to generate time-dependent drug exposure profiles because medium replacement simultaneously removes or re-adds drugs in the culture compartment. Here, we developed an Open-access Dialysis Membrane-integrated Microfluidic Device (O-DMiMD) that uses molecular weight-dependent transport across
[...] Read more.
Conventional in vitro assays and many microphysiological systems struggle to generate time-dependent drug exposure profiles because medium replacement simultaneously removes or re-adds drugs in the culture compartment. Here, we developed an Open-access Dialysis Membrane-integrated Microfluidic Device (O-DMiMD) that uses molecular weight-dependent transport across a dialysis membrane to decouple nutrient supply from drug exposure control. The device comprises a cell culture compartment (CCC) and a donor compartment (DC) separated by a dialysis membrane. Transport functions were evaluated using Lucifer Yellow, FITC-dextran, and glucose, followed by drug-response studies using SN-38 and T-DM1 under different medium change conditions. Lucifer Yellow and glucose permeated through the dialysis membrane, whereas FITC-dextran was retained. DC medium change supplied glucose to the CCC and maintained A549/HepG2 co-culture proliferation comparably to direct CCC medium replacement. For SN-38, partial transport to the DC and retention in the CCC generated time-dependent exposure profiles; in A549/HepaRG co-culture, medium change conditions altered A549 viability. For T-DM1, conditions with or without re-addition to the CCC produced different SK-BR-3 responses, suggesting exposure-dependent effects for high-molecular-weight drugs. The O-DMiMD provides an open-access in vitro platform for evaluating drug responses under exposure profiles governed by molecular weights, protein binding, medium changes, and metabolic cell contexts.
Full article
(This article belongs to the Special Issue Microfluidics for Cells and Other Organisms, 4th Edition)
►▼
Show Figures

Figure 1
Open AccessArticle
Reconfigurable Cilia-Based Magnetic Millirobots for Cooperative Particle Manipulation Through Programmable Assembly in Microfluidics
by
Dineshkumar Loganathan and Chia-Yuan Chen
Micromachines 2026, 17(7), 834; https://doi.org/10.3390/mi17070834 - 13 Jul 2026
Abstract
Reconfigurable robotic systems have emerged as platforms for particle manipulation owing to their adaptability and capability to alter structural configurations according to task requirements. However, achieving programmable particle capture, transportation, and release through cooperative interactions among untethered robots within microfluidic environments remains challenging.
[...] Read more.
Reconfigurable robotic systems have emerged as platforms for particle manipulation owing to their adaptability and capability to alter structural configurations according to task requirements. However, achieving programmable particle capture, transportation, and release through cooperative interactions among untethered robots within microfluidic environments remains challenging. In the present study, reconfigurable cilia-based magnetic millirobots (CMMRs) were developed for cooperative particle manipulation through programmable assembly. The platform consisted of multiple CMMRs that were independently actuated using an electromagnetic coil array and assembled into a cooperative structure possessing a central cavity for particle confinement. Through sequential electromagnetic coil activation and pulse-width modulation-based control, programmable assembly, transportation, and disassembly of the CMMRs were achieved. During assembly, self-organization analysis demonstrated that the constituent CMMRs converged toward this configuration, enabling formation of the cooperative structure needed. Subsequently, particle transportation experiments demonstrated the confinement and transportation of particles along predefined trajectories, with trajectory deviations maintained below 5%. Furthermore, μPIV characterization revealed that the assembled structure generated a directional transport corridor with a flow velocity of 4.5 mm s−1, providing a hydrodynamic environment for particle transportation compared with individual CMMRs. The demonstrated capabilities can serve as a foundation for reconfigurable untethered robotic systems capable of microhandling operations in lab-on-a-chip environments.
Full article
(This article belongs to the Special Issue Biomedical Micro/Nanorobots: Design, Fabrication and Applications)
Open AccessArticle
Study on Chemical Mechanical Polishing of Single-Crystal Diamond with a Novel Nicotinic Acid–Hydrogen Peroxide Green Slurry
by
Jixiang Yi, Longxing Liao and Yiming Fang
Micromachines 2026, 17(7), 833; https://doi.org/10.3390/mi17070833 - 13 Jul 2026
Abstract
Single-crystal diamond (SCD) has the characteristics of a hard surface and stable chemical properties, making it difficult to achieve ultra-smooth and ultra-low-damage surface polishing using conventional polishing slurries. In this study, a novel green chemical mechanical polishing (CMP) slurry containing only hydrogen peroxide,
[...] Read more.
Single-crystal diamond (SCD) has the characteristics of a hard surface and stable chemical properties, making it difficult to achieve ultra-smooth and ultra-low-damage surface polishing using conventional polishing slurries. In this study, a novel green chemical mechanical polishing (CMP) slurry containing only hydrogen peroxide, nicotinic acid, silica (SiO2) abrasive particles and deionized water was developed to achieve ultra-smooth, ultra-low-damage (0.5 nm) and atomic-scale surface roughness (Ra 0.473 ± 0.035 nm) polishing of SCD. Additionally, the influence of diamond, silicon carbide and SiO2 abrasive particles on the surface quality of SCD after CMP was investigated by single-factor experiments. Based on XPS characterization, the mechanism of SCD CMP was revealed: the SCD surface was first oxidized to form C-O and C=O groups, and then these groups were removed under the mechanical action of SiO2 abrasives, ultimately achieving atomic-scale removal of the material.
Full article
(This article belongs to the Special Issue Future Trends in Ultra-Precision Machining, Second Edition)
►▼
Show Figures

Figure 1
Open AccessArticle
Study of the Orbital Circular Cutting in Quartz Wafers Using Electrochemical Discharge Machining with Micro-Electrodes
by
A-Cheng Wang, Jung-Chou Hung, Yu-Lun Tsai and Hai-Ping Tsui
Micromachines 2026, 17(7), 832; https://doi.org/10.3390/mi17070832 - 12 Jul 2026
Abstract
Quartz wafer dicing technologies primarily rely on mechanical cutting and etching processes. Mechanical cutting is easy to generate the micro-cracks along the wafer edges, which compromises component precision. Furthermore, etching processes are associated with long processing times, high manufacturing costs, and environmental concerns.
[...] Read more.
Quartz wafer dicing technologies primarily rely on mechanical cutting and etching processes. Mechanical cutting is easy to generate the micro-cracks along the wafer edges, which compromises component precision. Furthermore, etching processes are associated with long processing times, high manufacturing costs, and environmental concerns. To address these limitations, this study proposes an electrochemical discharge cutting machining (ECDCM) method using a micro-tungsten carbide helical electrode performing orbital circular cutting (OCC) to evaluate the feasibility and optimization of quartz wafer dicing. Experimental studies were conducted to evaluate the effects of applied voltage, pulse duration, Z-axis feed rate, and duty factor on slot width, slot depth, slot surface quality and tool electrode wear. The results demonstrate that employing an OCC of micro-electrode facilitates the efficient flow of electrolyte into the machining zone, thereby enhancing discharge stability and slot quality. Compared to circular path cutting (CPC) with a rotating electrode, the proposed method reduces machining time by nearly four times and decreases material loss during circular quartz wafer cutting by approximately 50%. These findings indicate that the proposed machining approach provides high efficiency and high-quality quartz wafer cutting.
Full article
(This article belongs to the Special Issue Electrochemical Microdevices and Microsystems: Design, Fabrication, and Applications)
►▼
Show Figures

Figure 1
Open AccessFeature PaperArticle
The Influence of Gap Angle on the Transport Characteristics of Split-Gate AlGaN/GaN Heterostructure Field-Effect Transistors
by
Ying Kang, Xiaojia Zhang, Guangyuan Jiang, Chen Fu, Zhenfei Hou, Guangyuan Zhang, Caina Luan and Yang Liu
Micromachines 2026, 17(7), 831; https://doi.org/10.3390/mi17070831 - 11 Jul 2026
Abstract
In this work, split-gate (SG) AlGaN/GaN heterostructure field-effect transistors (HFETs) with different gap angles were fabricated. The effect of the gap angle on the transport characteristics of these SG devices was investigated via measurement and analysis of their direct-current electrical properties. The results
[...] Read more.
In this work, split-gate (SG) AlGaN/GaN heterostructure field-effect transistors (HFETs) with different gap angles were fabricated. The effect of the gap angle on the transport characteristics of these SG devices was investigated via measurement and analysis of their direct-current electrical properties. The results show that varying the gap angle significantly influences the channel current and further modulates the turn-off voltage of the devices. Theoretical analysis indicated that a change in gap angle directly alters the length of the gap region and affects the conduction channel effective width (Weff) through geometric effects, thereby modifying the channel current. In addition, the gap angle affects the total amount and distribution of additional polarization charges underneath the gate, which influences the polarization Coulomb field (PCF) scattering intensity and thus modulates the electron mobility of the devices. These findings provide a new direction for the structural optimization of SG AlGaN/GaN HFETs and offer a valuable reference for further improving the performance of SG devices.
Full article
(This article belongs to the Section D1: Semiconductor Devices)
►▼
Show Figures

Figure 1
Open AccessFeature PaperArticle
An Ultra-Compact ARCL-Based MEMS Radar Filter for Mobile Robotic Platforms
by
Yan Ding, Ruiqi Zhang, Xing Fan, Wenyu Chen and Zhe Yang
Micromachines 2026, 17(7), 830; https://doi.org/10.3390/mi17070830 - 11 Jul 2026
Abstract
►▼
Show Figures
To address the stringent requirements for miniaturization and high reliability in the perception systems of mobile robotic platforms, this article presents an ultra-compact bandpass filter based on air core recta-coax lines using micro-electro-mechanical systems technology. The proposed filter features an air-filled cavity structure
[...] Read more.
To address the stringent requirements for miniaturization and high reliability in the perception systems of mobile robotic platforms, this article presents an ultra-compact bandpass filter based on air core recta-coax lines using micro-electro-mechanical systems technology. The proposed filter features an air-filled cavity structure with internal coupled lines and a fully enclosed metal shield, which effectively minimizes dielectric and radiation losses while achieving a highly compact footprint. This compactness is particularly critical for robotic radar front-ends, where limited payload capacity demands high integration density. By leveraging classical filter synthesis theory, the design achieves a high-order response within a minimized volume. Furthermore, the inherent high-Q characteristic of the air cavity significantly improves out-of-band rejection, thereby effectively suppressing interference in complex electromagnetic environments and enhancing the signal-to-noise ratio for robotic detection. A prototype operating at 75 GHz was fabricated and measured. The experimental results demonstrate a low insertion loss of 1.5 dB and a compact size of 0.875 mm3, showing reasonable agreement with simulations. The proposed design offers a promising solution for next-generation, high-performance sensing units in autonomous robotics.
Full article

Figure 1
Open AccessFeature PaperArticle
Analysis and Design of Sensor-Driver-Aware Integral Nonsingular Terminal Sliding Mode Control for Buck Converter Power Interfaces in Actuator Systems
by
Weiqi Zhang, Fan Ping, Yingbo Han, Kai Song and Chuanyu Sun
Micromachines 2026, 17(7), 829; https://doi.org/10.3390/mi17070829 - 11 Jul 2026
Abstract
Buck converter power interfaces are commonly used as local voltage regulation units in compact actuator-driven microsystems, where the regulated voltage needs to remain stable under input, load, and circuit-level disturbances. In practical control loops, passive-parameter variations, external perturbations, and non-ideal sensor-driver dynamics may
[...] Read more.
Buck converter power interfaces are commonly used as local voltage regulation units in compact actuator-driven microsystems, where the regulated voltage needs to remain stable under input, load, and circuit-level disturbances. In practical control loops, passive-parameter variations, external perturbations, and non-ideal sensor-driver dynamics may distort feedback signals, delay effective duty-cycle action, and degrade the transient response of conventional robust controllers. Motivated by this issue, this paper presents the analysis and design of a sensor-driver-aware integral nonsingular terminal sliding mode control (INTSMC) method for a buck converter power interface under multi-source disturbances. A control-oriented averaged model is first constructed by incorporating converter parameter perturbations, load-side disturbances, Hall sensor dynamics, and isolated driver characteristics into a unified representation. Based on this model, an integral nonsingular terminal sliding surface is designed to improve voltage tracking performance while avoiding singularity in the reaching process. The corresponding control law is further arranged in a pulse-width modulation-realizable duty-cycle form, making it suitable for digital converter control. In addition, a phase-trajectory-based response-time estimation method is introduced to analyze the influence of initial states, disturbance levels, and hardware dynamic parameters on the closed-loop reaching behavior. Simulation studies under different operating conditions are carried out to evaluate the proposed controller. Simulation and experimental results show that the proposed method achieves a settling time within 33 ms, a steady-state voltage error within 0.01 V, and a measured efficiency of 83.5%~88.9%, indicating its feasibility for robust power regulation in micro-actuator-oriented microsystems where sensor-driver dynamics cannot be ignored.
Full article
(This article belongs to the Special Issue Advanced Micro-Integrated Power Devices and Gate Driving Technologies)
►▼
Show Figures

Figure 1
Open AccessArticle
Time-Domain Simulation and Optimization of the Memory Window for HZO-Based FeFETs Using the NLS Model
by
Shangda Han, Weifeng Lü, Yekun Liang and Tianyu Dai
Micromachines 2026, 17(7), 828; https://doi.org/10.3390/mi17070828 - 10 Jul 2026
Abstract
Hafnium-zirconium oxide (HZO)-based ferroelectric field-effect transistors (FeFETs) are expected to become core devices for new embedded memory and compute-in-memory systems. However, existing simulations rely on finite-element-based TCAD tools, which are computationally intensive and time-consuming, and they struggle to account for the dynamic flipping
[...] Read more.
Hafnium-zirconium oxide (HZO)-based ferroelectric field-effect transistors (FeFETs) are expected to become core devices for new embedded memory and compute-in-memory systems. However, existing simulations rely on finite-element-based TCAD tools, which are computationally intensive and time-consuming, and they struggle to account for the dynamic flipping of ferroelectric domains. This paper utilizes a time-domain simulation framework based on the nucleation-limited switching (NLS) model coupled with the surface potential of a MOSFET, enabling a self-consistent solution for polarization and electrical characteristics; a Monte Carlo method is employed to simulate device variability, and Shmoo plots are used to identify optimal programming and erasure process windows; an integrated solution is proposed for 22 nm FDSOI devices, addressing geometric scaling, modification of the Landau–Khalatnikov (L-K) dynamic model for ultrathin ferroelectric layers, and suppression of short-channel effects. Model validation is limited to selected operating metrics, and predictive accuracy outside the calibrated cases requires additional independent datasets. This method enables end-to-end simulation of FeFETs, from material polarization and device electrical characteristics to performance optimization, thereby providing model-based analytical and design support for the development of advanced, ultra-low-power FeFETs.
Full article
(This article belongs to the Special Issue Fabrication, Reliability, Simulation, and Protection of Advanced Semiconductor Devices and Integrated Circuits: Enabled by Emerging Semiconductor Materials)
►▼
Show Figures

Figure 1
Open AccessArticle
Thermal/Mechanical Characteristics Simulation Analysis of Solder Layer Damage in IGBT Modules
by
Jianbo Zhou, Jibing Chen, Liang He, Hui Tang and Xiaohu Wu
Micromachines 2026, 17(7), 827; https://doi.org/10.3390/mi17070827 - 10 Jul 2026
Abstract
The insulated gate bipolar transistor (IGBT) is widely applied in industrial fields such as rail transit, wind power generation, smart grids, and renewable energy. The temperature distribution, stress variation patterns, thermal performance, and modeling damage in the solder layer of IGBT modules under
[...] Read more.
The insulated gate bipolar transistor (IGBT) is widely applied in industrial fields such as rail transit, wind power generation, smart grids, and renewable energy. The temperature distribution, stress variation patterns, thermal performance, and modeling damage in the solder layer of IGBT modules under thermal and stress loadings have rarely been studied. This study first established a three-dimensional geometric model based on the actual dimensions of the IGBT module. A finite element model was successfully constructed for thermal/mechanical multi-physics coupled simulation based on the ANSYS Workbench platform to simulate the temperature, deformation trends, and stress distribution patterns of the solder layer in the IGBT module. Secondly, the solder layer defects of the IGBT module were categorized into five major types, and 37 sets of 3D models of IGBT with damaged solder layers were designed, followed by thermal/mechanical coupled simulation analysis for each. Finally, the influence of the void positions, sizes, and distribution types in the solder layer on the module temperature, heat dissipation path, and thermal stress was simulated during thermal cycling. The results showed that the highest stress at the edge of the solder layer is 6.2504 × 107 Pa, the lowest junction temperature is 70.79 °C, and the average thermal stress is 1.2388 (m/m). The highest junction temperature reached 72.562 °C under central solder layer damage states as determined by a thermal/mechanical coupled simulation analysis of four different types of solder layer defects. This research provides a theoretical basis and reliable technical support for the anti-damage and failure of IGBT modules and high-power devices.
Full article
(This article belongs to the Special Issue Advances in Semiconductor Power Devices)
►▼
Show Figures

Figure 1
Open AccessArticle
An Adaptive Gate-Side Feedback Active Gate Driver for GaN Devices with Optimized Switching Performance
by
Yuxin Zhang, Baoqiang Huang, Tiantian Wu, Zhe Wang, Qiao Zhang, Desheng Zhang, Jianming Lei, Run Min and Qiaoling Tong
Micromachines 2026, 17(7), 826; https://doi.org/10.3390/mi17070826 - 10 Jul 2026
Abstract
Gallium Nitride High Electron Mobility Transistors (GaN HEMT) are widely used in high-frequency applications owing to their fast-switching speed and low switching loss. However, the large dVDS/dt transients can cause severe crosstalk, current overshoot, and EMI issues. While conventional gate drivers
[...] Read more.
Gallium Nitride High Electron Mobility Transistors (GaN HEMT) are widely used in high-frequency applications owing to their fast-switching speed and low switching loss. However, the large dVDS/dt transients can cause severe crosstalk, current overshoot, and EMI issues. While conventional gate drivers can mitigate these issues by slowing down the switching process, the switching loss is significantly increased. To reduce the switching loss under dVDS/dt limitation, this paper proposes a gate-side feedback active gate driver (AGD) to adaptively regulate the switching transient by providing three-stage driving currents. Switching points of the three-stage driving currents are determined by detecting the start of the Miller plateau through gate voltage slope and identifying its termination when the gate voltage exceeds the Miller plateau voltage. With the detected signal, the gate driving current during the Miller plateau is reduced to suppress dVDS/dt and mitigate current overshoot. Under 400 V/20 A conditions, experimental results show that the proposed driver can effectively control dVDS/dt and suppress current overshoot, while reducing the dVDS/dt-related switching interval by 68.13% and switching loss by 51.8%, thereby confirming its effectiveness.
Full article
(This article belongs to the Special Issue Advanced Micro-Integrated Power Devices and Gate Driving Technologies)
►▼
Show Figures

Figure 1
Open AccessReview
Microfluidic and Paper-Based Recombinase Polymerase Amplification Systems for Decentralized Diagnostics and Biosurveillance
by
Hsing-Meng Wang, Sheng-Zhuo Lee and Lung-Ming Fu
Micromachines 2026, 17(7), 825; https://doi.org/10.3390/mi17070825 - 10 Jul 2026
Abstract
Recombinase polymerase amplification (RPA) has become a central amplification strategy for decentralized molecular diagnostics because it operates rapidly at mild temperatures and requires far less thermal control than PCR. Its analytical value increases substantially when paired with microfluidic and paper-based platforms, where sample
[...] Read more.
Recombinase polymerase amplification (RPA) has become a central amplification strategy for decentralized molecular diagnostics because it operates rapidly at mild temperatures and requires far less thermal control than PCR. Its analytical value increases substantially when paired with microfluidic and paper-based platforms, where sample handling, reagent delivery, amplification, and signal readout can be organized within compact, low-power, and field-compatible formats. This review examines recent progress in microfluidic and paper-based RPA systems across biomedical diagnostics, food safety testing, environmental monitoring, and One Health biosurveillance. Particular attention is given to integrated device architectures, including centrifugal chips, capillary-driven platforms, microfluidic paper-based analysis devices (μPADs), electrochemical biosensors, CRISPR-assisted assays, digital microfluidic systems, and sample-to-answer cartridges. Biomedical applications now span respiratory viruses, reproductive and emerging infections, bacterial and parasitic diseases, pharmacogenomic markers, and cancer-related biomarkers. RPA-enabled platforms are moving steadily into food safety and environmental surveillance, covering pathogen detection, seafood and dairy monitoring, agricultural disease control, antimicrobial-resistance tracking, and airborne pathogen screening. At the same time, the field is shifting toward more intelligent diagnostic formats. Smartphone imaging, artificial intelligence (AI)-assisted interpretation, digital partitioning, cloud connectivity, and automated quality control are increasingly being built into rapid testing workflows, giving these systems greater portability, consistency, and decision-making value. Despite this progress, practical deployment still depends on robust sample preparation, multiplex stability, quantitative reliability, reagent storage, scalable fabrication, and regulatory validation. Continued convergence of RPA chemistry with microfluidics, paper devices, CRISPR recognition, electrochemical readout, and data-assisted interpretation is expected to support more robust and accessible molecular diagnostic workflows.
Full article
(This article belongs to the Special Issue Microfluidics in Biomedical Research)
►▼
Show Figures

Figure 1
Open AccessArticle
DynamiGraph: A Specialized, Runtime-Aware FPGA Overlay for Ultra Low-Latency GNN Inference on Edge Devices
by
Haoran Sun and Likai Liang
Micromachines 2026, 17(7), 824; https://doi.org/10.3390/mi17070824 - 10 Jul 2026
Abstract
►▼
Show Figures
Graph Neural Networks (GNNs) have become essential for analyzing graph-structured data, yet their deployment on resource-constrained edge devices is severely limited by high computational complexity and irregular memory access patterns. Here, we introduce DynamiGraph, a specialized FPGA-based overlay accelerator engineered for ultra-low-latency GNN
[...] Read more.
Graph Neural Networks (GNNs) have become essential for analyzing graph-structured data, yet their deployment on resource-constrained edge devices is severely limited by high computational complexity and irregular memory access patterns. Here, we introduce DynamiGraph, a specialized FPGA-based overlay accelerator engineered for ultra-low-latency GNN inference in edge computing scenarios. Unlike general-purpose accelerators that incur high resource overhead to support a broad range of operators, DynamiGraph adopts a streamlined architecture focusing exclusively on essential General Matrix Multiplication (GEMM) and Sparse–Dense Matrix Multiplication (SpDMM) kernels. We implement a hardware-native runtime optimization mechanism that dynamically exploits graph sparsity via an edge-centric execution flow, eliminating redundant computations without requiring complex static preprocessing. Experimental results on an AXU2CGA edge platform demonstrate that DynamiGraph achieves sub-millisecond inference latencies on small-scale benchmarks (e.g., Cora) and a peak throughput of 1467 inferences per second. Furthermore, our runtime sparsity exploitation yields over 2000× reductions in floating-point operations compared to dense equivalents. These findings indicate that trading off model generality for architectural specialization and runtime awareness offers an efficient architectural alternative for enabling real-time graph intelligence in power- and bandwidth-limited edge environments.
Full article

Figure 1
Open AccessArticle
Single and Repetitive Surge Reliability of 1200 V Asymmetric Trench SiC MOSFETs Under Various Gate Biases
by
Menglin Yan, Zhizhe Wang, Dazheng Chen, Yuncong Li, Yongle Zhong, Yuansheng Li, Jun Luo and Hao Xia
Micromachines 2026, 17(7), 823; https://doi.org/10.3390/mi17070823 - 10 Jul 2026
Abstract
The parameter degradation and failure mechanisms of 1200 V asymmetric trench-type (AT) silicon carbide (SiC) metal oxide semiconductor field-effect transistors (MOSFETs) under various single and repetitive surge currents, with various gate bias voltages (VGS) of 0 V, −5 V, and −10
[...] Read more.
The parameter degradation and failure mechanisms of 1200 V asymmetric trench-type (AT) silicon carbide (SiC) metal oxide semiconductor field-effect transistors (MOSFETs) under various single and repetitive surge currents, with various gate bias voltages (VGS) of 0 V, −5 V, and −10 V, are systematically investigated in this work. It is indicated that VGS has no impact on the single surge reliability, with the same maximum single surge current (SSCmax) under different VGS. However, during repetitive surge stress (90% and 60% SSCmax), the maximum surge cycles have increased as VGS increases from −10 V to 0 V. It may be caused by the enhancement of channel-assisted leakage conduction, allowing more surge current to flow through the channel. It is concluded from gate capacitance (Cg-Vg) and low-frequency noise (LFN) characterizations that lower VGS increases SiC/SiO2 interface defect density, accelerating parameter degradation during single and repetitive surge stress. Both chip and package failures are observed for single and repetitive surge stress. For single surge stress, the device failure has resulted from the melted source Al as the metal erodes and penetrates through the interlayer dielectric and the ohmic contact layer between the source metal and the SiC-doped region, respectively, leading to a three-terminal short circuit. For repetitive surge stress, the device failure has been caused by the penetration of Al metal into the interlayer dielectric, leading to a gate-source short circuit. This comprehensive research provides valuable guidance for enhancing the surge reliability of SiC MOSFETs.
Full article
(This article belongs to the Special Issue Emerging Technologies and Applications for Semiconductor Industry)
►▼
Show Figures

Figure 1
Open AccessArticle
The Signal-Integrity Control Strategy of a TSV Array for a Chiplet-Based System
by
Bosen Wang, Hongjian Su, Shengqi Zhang, Di Li, Dongdong Chen and Yintang Yang
Micromachines 2026, 17(7), 822; https://doi.org/10.3390/mi17070822 - 10 Jul 2026
Abstract
In this research, a signal-integrity control strategy of a through-silicon via (TSV) array for a Chiplet-based system is developed, based on the backpropagation neural network (BP-NN) model and particle swarm optimization algorithm with linear decreasing inertia weight (PSO-LDIW). Based on the HFSS software,
[...] Read more.
In this research, a signal-integrity control strategy of a through-silicon via (TSV) array for a Chiplet-based system is developed, based on the backpropagation neural network (BP-NN) model and particle swarm optimization algorithm with linear decreasing inertia weight (PSO-LDIW). Based on the HFSS software, the simulation results of the TSV array are obtained. The irregular relationship between design parameters (TSV pitches, height of TSV, radius of TSV, thickness of oxide layer, and offset angle) and signal indexes (return loss, insertion loss, near-end, and far-end crosstalk) is established by the BP-NN model. Then, the design parameters of the TSV array are optimized by the PSO-LDIW algorithm to obtain the desired signal indexes. Based on the optimized design parameters, the effectiveness of the developed signal-integrity control strategy is verified by HFSS simulations. For the three verification cases, the relative errors between the BP-NN-predicted values and the corresponding HFSS simulation values range from 0.31% to 5.02%. The relative deviations of the HFSS results from the desired NEXT, FEXT, and return-loss targets are no greater than 5.72%, while the maximum absolute deviation from the desired insertion-loss target is 0.0160 dB. These results demonstrate the feasibility of the developed strategy for controlling the signal indexes of the TSV array in the tested cases.
Full article
(This article belongs to the Special Issue Emerging Circuits and Devices for Sensing, Computing, and Actuation Integration in Intelligent Microsystems)
►▼
Show Figures

Figure 1
Journal Menu
► ▼ Journal Menu-
- Micromachines Home
- Aims & Scope
- Editorial Board
- Reviewer Board
- Topical Advisory Panel
- Early Career Editorial Board
- Instructions for Authors
- Special Issues
- Topics
- Sections & Collections
- Article Processing Charge
- Indexing & Archiving
- Editor’s Choice Articles
- Most Cited & Viewed
- Journal Statistics
- Journal History
- Journal Awards
- Society Collaborations
- Conferences
- Editorial Office
Journal Browser
► ▼ Journal BrowserHighly Accessed Articles
Latest Books
E-Mail Alert
News
9 October 2025
Meet Us at the 3rd International Conference on AI Sensors and Transducers, 2–7 August 2026, Jeju, South Korea
Meet Us at the 3rd International Conference on AI Sensors and Transducers, 2–7 August 2026, Jeju, South Korea
15 July 2026
Meet Us at the 2026 Academic Conference of China Instrument and Control Society, 12–14 August 2026, Hefei, China
Meet Us at the 2026 Academic Conference of China Instrument and Control Society, 12–14 August 2026, Hefei, China
Topics
Topic in
Electronics, Eng, Materials, Micro, Micromachines
Wide Bandgap Semiconductor Electronics and Devices
Topic Editors: Joseph Bernstein, Asaf AlboDeadline: 31 July 2026
Topic in
Applied Sciences, Computers, Electronics, Sensors, ASI, Micromachines
Collection Series on Applied System Innovation
Topic Editors: Sheng-Joue Young, Shoou-Jinn Chang, Stephen D. Prior, Liang-Wen JiDeadline: 31 August 2026
Topic in
Electronics, Fluids, Machines, Micromachines, Applied Sciences
Micro-Mechatronic Engineering, 2nd Edition
Topic Editors: Teng Zhou, Antonio F. MiguelDeadline: 31 October 2026
Topic in
Applied Sciences, Energies, Fluids, Micromachines, Processes
Enhanced Heat Transfer and Advanced Energy Conversion Technology, 2nd Edition
Topic Editors: Feng Zhang, Yong LiDeadline: 30 November 2026
Conferences
Special Issues
Special Issue in
Micromachines
Recent Advances in Soft Miniature Robotics: Design, Fabrication, Control, and Application
Guest Editors: Rongjing Zhang, Patrick R. OnckDeadline: 15 July 2026
Special Issue in
Micromachines
Piezoelectric Actuators and Motors: From Theory to Applications
Guest Editor: Qiaosheng PanDeadline: 15 July 2026
Special Issue in
Micromachines
Emerging Nanomaterials and Novel Structures for Photodetectors and Their Applications
Guest Editor: Zhanfeng HuangDeadline: 20 July 2026
Special Issue in
Micromachines
Fiber Optic Sensors: From Materials to Applications
Guest Editor: Chuen-Lin TienDeadline: 20 July 2026
Topical Collections
Topical Collection in
Micromachines
Lab-on-a-Chip
Collection Editors: Jeong-Bong Lee, Ning Xue, Xiwei Huang
Topical Collection in
Micromachines
Micromixers: Analysis, Design and Fabrication
Collection Editor: Kwang-Yong Kim
Topical Collection in
Micromachines
Microdevices and Applications Based on Advanced Glassy Materials
Collection Editors: Giancarlo Righini, Luigi Sirleto, Francesco Enrichi
Topical Collection in
Micromachines
Micro/Nanoscale Electrokinetics
Collection Editors: Xiangchun Xuan, Rodrigo Martinez-Duarte


