E：Engineering and Technology
A section of Micromachines (ISSN 2072-666X).
Editorial Board
Topical Advisory Panel
Special Issues
Following special issues within this section are currently open for submissions:
- Low-Power Electronics and System Integration for Next-Generation Computing (Deadline: 30 May 2026)
- AI-Driven Design and Optimization of Microsystems (Deadline: 31 May 2026)
- Intelligent RF Microsystems for Next-Generation Communication and Sensing (Deadline: 31 May 2026)
- Emerging Trends in Soft Robotics and Bioinspired Technologies (Deadline: 15 June 2026)
- Piezoelectric MEMS/NEMS—Materials, Devices, and Applications, Third Edition (Deadline: 30 June 2026)
- Wearable Electronics and Sensory Devices (Deadline: 30 June 2026)
- Soft Embodied AI: The Convergence of Flexible Systems and Intelligent Microrobotics (Deadline: 30 June 2026)
- Emerging Technologies and Applications for Semiconductor Industry (Deadline: 30 June 2026)
- Recent Progress in Wearable Healthcare Devices (Deadline: 30 June 2026)
- New Trends in Nanoscale Materials Applied to Photovoltaic Research (Deadline: 10 July 2026)
- Recent Advances in Soft Miniature Robotics: Design, Fabrication, Control, and Application (Deadline: 15 July 2026)
- Microelectronics Assembly and Packaging: Materials and Technologies, 3rd Edition (Deadline: 30 July 2026)
- Advanced Developments in Droplet Microfluidics (Deadline: 30 July 2026)
- Micro/Nanomanufacturing and Cross-Scale Fabrication: Methods, Systems, and Applications (Deadline: 31 July 2026)
- Latest Breakthroughs in 6G RF/Microwave Front-End Filtering and Reconfigurable Devices (Deadline: 31 July 2026)
- Advanced Micro- and Nano-Manufacturing Technologies for Flexible Electronics (Deadline: 31 July 2026)
- Microwave Passive Components, 3rd Edition (Deadline: 31 July 2026)
- Research Trends of RF Power Devices (Deadline: 15 August 2026)
- Smart Robots for Industrial Inspection: Integrating Micro-Technologies and Intelligent Systems (Deadline: 30 August 2026)
- Micro-Energy Harvesting Technologies and Self-Powered Sensing Systems (Deadline: 31 August 2026)
- Microwave/Millimeter-Wave Devices and Metasurfaces (Deadline: 31 August 2026)
- Advances in Optoelectronic Devices, 3rd Edition (Deadline: 30 September 2026)
- Advanced Filtering, Fusion, and State Estimation in Microsystems and Robotics (Deadline: 30 September 2026)
- MEMS/NEMS Devices and Applications, 4th Edition (Deadline: 30 September 2026)
- Diamond Micro-Machining and Its Applications (Deadline: 30 September 2026)
- Translational Microfluidics: From Lab Prototype to Scalable Manufacturing (Deadline: 30 September 2026)
- Recent Advances in Electromagnetic Devices, 2nd Edition (Deadline: 15 October 2026)
- Integrated RF MEMS and Applications (Deadline: 25 October 2026)
- Micro-/Nano-Electromagnetic and Acoustic Devices (Deadline: 31 October 2026)
- Micro-/Nanomotors: Design, Fabrication and Applications (Deadline: 31 October 2026)
- Advanced Micro-Integrated Power Devices and Gate Driving Technologies (Deadline: 31 October 2026)
- Portable Sensing Systems in Biological and Chemical Analysis (Deadline: 31 October 2026)
- Electromagnetic Metamaterials and Metasurfaces: From Design to Applications (Deadline: 31 October 2026)
- Advanced Nanoindentation Techniques (Deadline: 1 November 2026)
- Micro- and Nanosensors: Fabrication, Applications and Performance Enhancements, 4th Edition (Deadline: 25 November 2026)
- Advances in Field-Programmable Gate Arrays (FPGAs) (Deadline: 30 November 2026)
- Advancing Energy Storage Techniques: Chemistry, Materials and Devices (Deadline: 30 November 2026)
- Human-Centred Intelligent Wearable Devices (Deadline: 15 December 2026)
- RF MEMS and Microsystems, 2nd Edition (Deadline: 30 December 2026)
- Nanoscale Lithography—Pressing Miniaturization Towards Ever Smaller Sizes, 2nd Edition (Deadline: 31 December 2026)
- Metasurfaces and Functional Microdevices for Terahertz and Photonic Applications (Deadline: 31 December 2026)
- High-Performance Semiconductor Memory: Capacitor-Less DRAM and Emerging Architectures (Deadline: 31 December 2026)
- Manufacturing and Application of Advanced Thin-Film-Based Device, Second Edition (Deadline: 31 December 2026)
- Fluid Flow in Microchannel (Deadline: 28 February 2027)
