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E：Engineering and Technology

A section of Micromachines (ISSN 2072-666X).

Section Information

The "Engineering and Technology" section of Micromachines serves as the primary home for applied research that translates the scientific principles underpinning micro and nanosystems into functional devices, platforms, and systems with real-world impact. As the most encompassing section of the journal, it welcomes contributions spanning the full spectrum of engineering disciplines as they intersect with miniaturisation, microfabrication, and nanotechnology—covering topics not specifically addressed by the journal's more focused thematic sections.

Research published here addresses the design, fabrication, integration, characterisation, modelling, and application of micro and nanoscale devices and systems. Key areas of interest include the following: MEMS/NEMS devices and their system-level integration; RF, microwave, and millimetre-wave components including filters, antennas, metasurfaces, and reconfigurable devices; flexible, stretchable, and wearable electronics and sensing systems; energy harvesting, storage, and conversion at the micro- and nanoscale; optoelectronic and photovoltaic devices; micro- and nanomotors, soft robotics, and bioinspired actuators; microfluidic and lab-on-chip platforms; power electronics and integrated circuit technologies; and smart microsystems incorporating signal processing and embedded intelligence.

Micro and nanofabrication science and manufacturing technology constitute a core strength of this section. Relevant process contributions span lithographic and patterning techniques (photolithography, nanoimprint, laser direct-write, electron-beam and focused ion beam), etching and material removal (DRIE, plasma and wet etching, CMP, ultra-precision and abrasive machining, micro-EDM), and thin-film deposition and coating (PVD, CVD, ALD, electroplating). Equally within scope are cross-scale and hybrid fabrication strategies, process modelling and simulation, in situ monitoring and control, and advances in microelectronics assembly and packaging. The application domains for these manufacturing advances are broad, spanning semiconductor device processing, photonic and optoelectronic component fabrication, energy device manufacturing, and the production of MEMS transducers and wearable sensors. Emerging paradigms such as roll-to-roll micro/nanofabrication, laser-based manufacturing for flexible electronics, and additive–subtractive hybrid processes are particularly encouraged, as are studies addressing scalability, yield, and technology transfer from laboratory to industrial production.

This section is attentive to cross-cutting themes uniting engineering innovation with sustainability, miniaturisation, and system performance. The section accepts original research articles, reviews, short communications, technical notes, and perspectives. Interdisciplinary work bridging electrical, mechanical, optical, chemical, and systems engineering with materials science and applied physics is strongly welcomed. The overarching goal is to advance the engineering science and technology of miniaturised systems, fostering innovation that connects device-level advances with broader societal and industrial needs.