The electroless copper plating of textiles, which have been previously printed with a catalyst, is a promising method to selectively metallise them to produce high-reliability e-textiles, sensors and wearable electronics with wide-ranging application...
The generation of a flexible printed circuit board on polymer fabrics has been a challenge over the last decade. In this work, a copper pattern was obtained on a soft substrate of filter paper/polyacrylonitrile (FP/PAN) film, where the filter paper w...
The fabrication of high-resolution and mechanically robust copper patterns remain a critical challenge in flexible electronics. Here, we present a universal metallization strategy that combines sequential two-step laser transfer, including laser-indu...
The selective metallisation of textiles is becoming a very important process in the development of electronic or e-textiles. This study investigated the efficacy of polymer coatings for the protection of copper (Cu) conductive tracks electroless plat...
Various formulations for electroless deposition, to obtain continuous nanometre-sized and micrometre-sized films of palladium on copper, were compared. We deposited ultrathin films using displacement plating formulations. We obtained continuous films...
An environmental-friendly electroless copper plating process was employed in preparing copper-coated polyester fabric with excellent conductivity. The effects of bath temperature on the plating rate, compositions and crystal structure of the electrol...
To improve the AlCoCrFeNi high entropy alloys’ (HEAs’) toughness, it was coated with different amounts of Cu then fabricated by the powder metallurgy technique. Mechanical alloying of equiatomic AlCoCrFeNi HEAs for 25 h preceded the coating process....
Continuous metalized regenerated cellulose fibers for advanced applications (e.g., multi-functional composites) are produced by electroless copper plating. Copper is successfully deposited on the surface of cellulose fibers using commercial cyanide-f...
We investigated copper electrodes deposited onto a BaZr0.7Ce0.2Y0.1O3-δ (BZCY72) proton-conducting membrane via a novel electroless plating method, which resulted in significantly improved performance when compared to a traditional painted copp...
Regenerated cellulose fibers coated with copper via electroless plating process are investigated for their mechanical properties, molecular structure changes, and suitability for use in sensing applications. Mechanical properties are evaluated in ter...
This article presents a novel bonding method for chip packaging applications in the semiconductor industry, with a focus on downsizing high-density and 3D-stacked interconnections to improve efficiency and performance. Microfluidic electroless interc...
Direct-writing submicron copper circuits on glass with laser precision—without lithography, vacuum deposition, or etching—represents a transformative step in next-generation microfabrication. We present a high-resolution, maskless method...
Copper metal catalyst seeds have recently triggered much research interest for the development of low-cost and high-performance metallic catalysts with industrial applications. Herein, we present metallic Cu catalyst seeds deposited by an atomic laye...
Novel composite coatings were fabricated on 6061 aluminum alloy substrates by two steps combining micro-arc oxidation (MAO) plus electroless copper plating (Cu). Different MAO + Cu composite coatings were compared. Cu continuously and evenly covered...
Due to the superior thermal, mechanical and chemical properties of ceramics, metallized ceramics are widely used as circuit carriers and interconnect devices, wherever standard polymer-based circuit boards come to their limits. 2D metallization repre...
This paper reports on the synthesis and structure elucidation of track-etched membranes (TeMs) with electrolessly deposited copper microtubes (prepared in etched-only and oxidized polyethylene terephthalate (PET) TeMs), as well as on the comparative...
The pure Cu coating was plated on the surface of silicon carbide particles (SiCP) by two different methods, hydrazine hydrate direct reduction method and hydrazine with glucose pre-reduction method. The hydrazine with glucose pre-reduction method is...
Through-glass via (TGV) substrates have attracted increasing attention as interposers and core substrates for advanced packaging. However, contaminants adhere to glass surfaces; in particular, airborne organic substances increase the contact angle, h...
In this study, electroless-plating of a nickel-phosphor (Ni–P) thin film on surface-controlled thermoelectric elements was developed to significantly increase the bonding strength between Bi–Te materials and copper (Cu) electrodes in ther...
Copper–graphite composites reinforced with SiO2 particles were fabricated by powder metallurgy technique. Electroless copper plating was introduced to improve the interfacial bonding between SiO2 particles and copper matrix. The microstructure,...
With the growing emphasis on medical testing, people are seeking more technologies to detect indexes of the human body quickly and at a low cost. The electrochemical biosensors became a research hotspot due to their excellent properties. In this stud...
Three-dimensional (3D) integration has become a leading approach in chip packaging. The interconnection density and reliability of micro-bumps in chip stacking are often threatened by high bonding temperatures. The method of building chip-to-chip int...
Copper films were grown on (3-Mercaptopropyl)trimethoxysilane (MPTMS), (3-Aminopropyl)triethoxysilane (APTES) and 6-(3-(triethoxysilyl)propylamino)-1,3,5- triazine-2,4-dithiol monosodium (TES) self-assembled monolayers (SAMs) modified acrylonitrile-b...
The paper presents the results of copper electroless metallization of cellulose paper with the use of a polydopamine coating and silver catalyst. The polydopamine coating was deposited via a simple dip method using a dopamine hydrochloride solution i...
The selective surface activation induced by laser (SSAIL) for electroless copper deposition on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend is one of the promising techniques of electric circuit formation on free-shape dielectric surf...
Mechatronic Integrated Devices or Molded Interconnect Devices (MID) are three-dimensional (3D) circuit carriers. They are mainly fabricated by laser direct structuring (LDS) and subsequent electroless copper plating of an injection molded 3D substrat...
In this study, sodium borohydride oxidation has been investigated on the platinum nanoparticles modified copper/titanium catalysts (PtNPsCu/Ti), which were fabricated by employing the electroless copper plating and galvanic displacement technique. IC...
The electrochemical migration (ECM) behavior of copper-clad laminate (PCB-Cu) and electroless nickel/immersion gold printed circuit boards (PCB-ENIG) under thin electrolyte layers of different thicknesses containing 0.1 M Na2SO4 was studied. Results...
Wire-bonding technology is the most commonly used chip interconnection technology in microelectronic packaging. Metal bonding wire is the key material for wire bonding and plays an important role in the reliability of electronic devices. In recent ye...
Chemical plating has recently been employed for the preparation of flexible piezoresistive sensors; however, plating solutions and processes that affect the sensitivity still need further exploration. In the study, a sponge-based flexible sensor with...
Among the various reinforcement phases available in Cu-based composites, the unique layered structure and easy diffusion of A-layer atoms make MAX phases more suitable for reinforcing a copper matrix than others. In this study, Cu-coated Ti3AlC2 part...
With increasing interest in the rapid development of lattice structures, hybrid additive manufacturing (HAM) technology has become a competent alternative to traditional solutions such as water jet cutting and investment casting. Herein, a HAM techno...
In this work, as-received HiPCO single walled carbon nanotubes (SWCNTs) are incorporated in a controllable manner at various concentrations into Cu-SWCNT composites via electroless plating, by varying the related reaction times, with polyethylene gly...
Lattice structures are a group of cellular materials composed of regular repeating unit cells. Due to their extraordinary mechanical properties, such as specific mechanical strength, ultra-low density, negative Poisson’s ratio, etc., lattice st...
The formation of conductive copper patterns on mica holds promise for developing cost-effective flexible electronics and sensing devices, though it is challenging due to the low adhesion of mica’s atomically flat surface. Herein, we present a w...
Electrically conductive cotton fabrics were successfully prepared by a first free radical polymerization,assisted by a conventional pad-dry-cure textile technology and subsequent electroless deposition (ELD) of copper thin layers on cotton fiber surf...
The effects of electroless coatings on the microstructure and composition of the interface between multi-walled carbon nanotubes (MWCNTs) and a Cu matrix and the mechanical properties and wear behavior of the resulting copper matrix composites were i...
When fabricating high-entropy alloy particle-reinforced metal matrix composites via friction stir processing, the relatively low heat input led to insufficient interfacial diffusion between the particles and matrix, thereby compromising the composite...
Silver-coated copper powder, possessing both excellent electrical conductivity and cost advantages, holds broad application prospects in electronic packaging and conductive materials. This study investigates the surface characteristics of copper powd...
The poor wettability and weak interfacial bonding of diamond/copper composites are due to the incompatibility between diamond and copper which are inorganic nonmetallic and metallic material, respectively, which limit their further application in nex...
This paper reports the synthesis of composite track-etched membranes (TeMs) modified with electrolessly deposited copper microtubules using copper deposition baths based on environmentally friendly and non-toxic reducing agents (ascorbic acid (Asc),...
Microbial contamination of medical devices and treatment rooms leads to several detrimental hospital and device-associated infections. Antimicrobial copper coatings are a new approach to control healthcare-associated infections (HAI’s). This review p...
Through-glass vias (TGVs), as key vertical interconnect structures in 2.5-D/3-D advanced packaging, offer low dielectric loss, low parasitic capacitance, and excellent high-frequency transmission performance. However, several challenges remain in TGV...
In this study, copper coatings smaller than 3 µm were created by electroless deposition on epoxy-based carbon fiber-reinforced polymer (CFRP) laminates for enhancing their electrical properties. This well-known method of metallization was emplo...
As 3D stacking technologies advance, low-temperature hybrid Cu bonding has become essential for fine-pitch integration. This study focuses on evaluating Pd nanolayers deposited by electroless plating (ELP) on Cu surfaces and compares them to electrop...
In the present work, we proposed a novel friction stir processing (FSP) to produce a locally reinforced aluminum matrix composite (AMC) by stirring copper-coated SiC particulate reinforcement into Al6061 alloy matrix. Electroless-plating process was...
SiC particles (SiCp)-reinforced Al–Si matrix composite coatings were synthesized on 4032 aluminum alloy by laser cladding using powder mixtures of Al-20 wt.% Si alloy and electroless copper-plated SiC particles (SiCp-Cu). The effects of SiCp-Cu...
The production of high-purity hydrogen from hydrogen storage materials with further direct use of generated hydrogen in fuel cells is still a relevant research field. For this purpose, nickel-molybdenum-plated copper catalysts (NiMo/Cu), comprising b...
Developing highly efficient and stable electrocatalysts from inexpensive and earth-abundant elements represents a significant advancement in overall water splitting (OWS). This study focuses on the synthesis and evaluation of palladium-modified cobal...
Metal-coated polymer electrodes fabricated by additive manufacturing are promising tools for electrical discharge machining (EDM) of complex shapes; however, coating non-uniformity and thermomechanical degradation limit their performance. This study...
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