Electronic and Photonic Device Integration and Packaging
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".
Deadline for manuscript submissions: 25 December 2026 | Viewed by 53
Special Issue Editors
Interests: semiconductor metrology; advanced packaging; optical metrology; optical sensing; fiber optics
Interests: laser powder bed fusion; additive manufacturing; solid mechanics; metallic materials; heat transfer; computational fluid dynamics
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The rapid advancement of electronic and photonic technologies has enabled transformative progress in areas such as high-performance computing, artificial intelligence, optical communication, sensing and advanced manufacturing. As device dimensions continue to shrink and system complexity increases, the integration and packaging of electronic and photonic components have become critical enablers of next-generation systems. Recent developments in heterogeneous integration, chiplet architectures, silicon photonics and advanced packaging techniques, including 2.5D/3D integration, through silicon vias, wafer-level packaging and photonic-electronic co-integration, are opening new possibilities for compact, high-performance and energy-efficient devices. At the same time, these advances introduce significant challenges related to thermal management, signal integrity, reliability, manufacturing yield and high-precision metrology. Addressing these challenges requires interdisciplinary innovations spanning device design, materials engineering, fabrication processes, packaging technologies and characterization techniques. Emerging solutions such as advanced interconnect architectures, novel materials, integrated photonic platforms and in situ monitoring and metrology are playing increasingly important roles in enabling reliable and scalable device integration. To highlight the latest progress in this rapidly evolving field, we are pleased to announce the Special Issue entitled “Electronic and Photonic Device Integration and Packaging.” This Special Issue aims to bring together recent advances and emerging research directions in the integration, packaging and reliability of electronic and photonic devices.
Dr. Fengfeng Zhou
Dr. Shafiqur Rahman
Guest Editors
Manuscript Submission Information
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Keywords
- silicon photonics
- integrated circuits
- advanced packaging
- micromanufacturing
- co-packaged optics
- microsensors
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