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Materials 2018, 11(8), 1348; https://doi.org/10.3390/ma11081348

Laser-Induced Silver Seeding on Filter Paper for Selective Electroless Copper Plating

1
Graduate School of Bio-Applications and Systems Engineering, Tokyo University of Agriculture and Technology, Koganei, Tokyo 184-8588, Japan
2
College of Chemistry and Materials Engineering, Changzhou Vocational Institute of Engineering, Changzhou 213164, China
3
College of Textile and Clothing, Jiangnan University, Wuxi 214122, China
*
Authors to whom correspondence should be addressed.
Received: 9 July 2018 / Revised: 28 July 2018 / Accepted: 31 July 2018 / Published: 3 August 2018
(This article belongs to the Special Issue Selective Laser Sintering (SLS) of Materials)
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Abstract

The generation of a flexible printed circuit board on polymer fabrics has been a challenge over the last decade. In this work, a copper pattern was obtained on a soft substrate of filter paper/polyacrylonitrile (FP/PAN) film, where the filter paper was commercially available. The pattern of Ag particles was first produced on an Ag+-doped FP/PAN composite film, followed by electroless plating of copper using the metal silver particles as seeds. The in situ reduction of silver particles and the formation of the silver agglomeration pattern were induced by laser irradiation technology on the FP/PAN/AgNO3 composite film. A variety of characterizations indicated that the resultant copper deposition was uniform, with good conductivity properties. View Full-Text
Keywords: laser-induced irradiation; flexible printed circuit board; electroless plating; copper pattern laser-induced irradiation; flexible printed circuit board; electroless plating; copper pattern
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Liu, C.-C.; Cheng, J.; Li, X.-Q.; Gu, Z.-J.; Ogino, K. Laser-Induced Silver Seeding on Filter Paper for Selective Electroless Copper Plating. Materials 2018, 11, 1348.

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