Special Issue "Thin Films for Thermoelectric Applications"

A special issue of Coatings (ISSN 2079-6412).

Deadline for manuscript submissions: 31 October 2020.

Special Issue Editors

Prof. Dr. Clara M Gómez
E-Mail Website
Guest Editor
University of Valencia
Tel. +34 963544881
Interests: conducting polymers; thermoelectricity; polyurethanes; hybrid materials; nanoparticle synthesis; structure–property characterization
Special Issues and Collections in MDPI journals
Prof. Dr. Rafael Muñoz-Espí
E-Mail Website
Guest Editor
University of Valencia
Tel. +34 963544210
Interests: multicomponent polymer systems; hybrid materials; conducting polymers; colloidal systems; nanoparticle synthesis
Special Issues and Collections in MDPI journals

Special Issue Information

Dear Colleagues,

The majority of the energy produced today comes from nonrenewable resources, such as fossil fuels and natural gas, which are known to contribute to environmental problems. To combat these issues, much research is currently devoted to developing alternative ways of energy production that are both renewable and clean. In particular, energy recovery from heat (energy harvesting) can be a good strategy to minimize the negative impact that “dirty” energy produces on the environment. That is exactly what thermoelectricity, also called the Peltier–Seebeck effect, is about: Direct conversion of heat into electricity or electricity into heat through two related mechanisms, the Seebeck effect and the Peltier effect. To attain this effect, we need to develop efficient thermoelectric materials.

This Special Issue, “Thin Films for Thermoelectric Applications”, aims to cover original research and critical review articles on recent aspects of novel thermoelectric materials processed as thin films. In particular, papers are invited that discuss recent advances in thermoelectric materials and their processing as thin films, characterization techniques relating structure–properties, construction of devices based on thin thermoelectric films, theory relating to thermoelectricity of thin films, and in general, all aspects of applications of thermoelectric thin films.

Although other interesting related topics not mentioned in the above list are also welcome, intended submissions should generally fall in line with thin films for thermoelectric applications.

 

The topics of interest include but are not limited to:

  • Synthesis of novel thermoelectric materials
  • Deposition techniques for thin films of thermoelectric materials
  • Characterization methods of thermoelectric properties of thin films
  • Structural characterization of thermoelectric thin films
  • Quantum confinement, phonon drag, 2D materials
  • Physics and chemistry of novel thermoelectric materials for thin films
  • Theory and modelling of thermoelectric thin films
  • Thermoelectric thin films sensors and applications
  • Thermoelectric nanodevices

Prof. Dr. Clara M Gómez
Prof. Dr. Rafael Muñoz-Espí
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Coatings is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Published Papers (2 papers)

Order results
Result details
Select all
Export citation of selected articles as:

Research

Open AccessArticle
Lightning Performance of Copper-Mesh Clad Composite Panels: Test and Simulation
Coatings 2019, 9(11), 727; https://doi.org/10.3390/coatings9110727 - 02 Nov 2019
Abstract
:According to simulation lightning experiments and eddy current analysis results, a three-dimensional finite element model of composite laminated plates with shield is established. By applying electric-thermal boundary and the coupling relationship between them, the lightning strike damage results under the protection of shield [...] Read more.
:According to simulation lightning experiments and eddy current analysis results, a three-dimensional finite element model of composite laminated plates with shield is established. By applying electric-thermal boundary and the coupling relationship between them, the lightning strike damage results under the protection of shield are realistically simulated with the commercial finite element analysis software, ABAQUS. Considering the coupling effect of heat, electricity, and force during lightning strike, the load distribution field of copper mesh and carbon fiber panel with lightning current inducted is analyzed. Comparing the thermal stress distribution of the specimen surface under various current loads, it is shown that the stress of carbon fiber panel is significantly lower than the one of the copper screen when the specimen structure suffers heavy current, since the copper network plays a role of endergonic protection. Simulation data are consistent with the test results, thus the method can be used for other similar research. Full article
(This article belongs to the Special Issue Thin Films for Thermoelectric Applications)
Open AccessArticle
Effect of Surface Roughness and Electroless Ni–P Plating on the Bonding Strength of Bi–Te-based Thermoelectric Modules
Coatings 2019, 9(3), 213; https://doi.org/10.3390/coatings9030213 - 26 Mar 2019
Abstract
In this study, electroless-plating of a nickel-phosphor (Ni–P) thin film on surface-controlled thermoelectric elements was developed to significantly increase the bonding strength between Bi–Te materials and copper (Cu) electrodes in thermoelectric modules. Without electroless Ni–P plating, the effect of surface roughness on the [...] Read more.
In this study, electroless-plating of a nickel-phosphor (Ni–P) thin film on surface-controlled thermoelectric elements was developed to significantly increase the bonding strength between Bi–Te materials and copper (Cu) electrodes in thermoelectric modules. Without electroless Ni–P plating, the effect of surface roughness on the bonding strength was negligible. Brittle SnTe intermetallic compounds were formed at the bonding interface of the thermoelectric elements and defects such as pores were generated at the bonding interface owing to poor wettability with the solder. However, defects were not present at the bonding interface of the specimen subjected to electroless Ni–P plating, and the electroless Ni–P plating layer acted as a diffusion barrier toward Sn and Te. The bonding strength was higher when the specimen was subjected to Ni–P plating compared with that without Ni–P plating, and it improved with increasing surface roughness. As electroless Ni–P plating improved the wettability with molten solder, the increase in bonding strength was attributed to the formation of a thicker solder reaction layer below the bonding interface owing to an increase in the bonding interface with the solder at higher surface roughness. Full article
(This article belongs to the Special Issue Thin Films for Thermoelectric Applications)
Show Figures

Figure 1

Planned Papers

The below list represents only planned manuscripts. Some of these manuscripts have not been received by the Editorial Office yet. Papers submitted to MDPI journals are subject to peer-review.

Title: Large-Area Laying of Soft Textile Power Generators for the Realization of Body-Heat-Harvesting Clothing
Authors: Yao-Shing Chen* and Ben-Je Lwo
Affiliationos: Department of Mechanical and Aerospace Engineering, Chung-Cheng Institute of Technology,  National Defense University, Taiwan
Abstrate: 
This paper presents the realization of a flexible thermoelectric (TE) generator as a textile fabric that converts human body heat into electrical energy for portable, low-power microelectronic products. In this study, an organic non-toxic conductive coating was used to dip rayon wipes into conductive TE fabrics so that the textile take the advantage that TE currents are parallel to the temperature gradient. To this end, a dyed conductive cloth was first sewn into a TE unit. The TE unit was then sewn into an array to create a temperature difference between the human body and the environment to harvest TE power. The prototype of the TE fabric consists of 48 TE units connected by conductive wire over an area of 275 × 205 mm2, and the TE units were sewn on a T-shirt at the chest area. After fabrication and property tests, a Seebeck coefficient of approximately 20 μV/K was measured from the TE unit, and 0.979 mV voltage was obtained from the T-shirt with TE textile fabric. Since the voltage was generated at a low temperature gradient environment, the proposed energy solution in actual fabric applications is suitable for future portable microelectronic power devices.
Back to TopTop