Flip-chip bonding is a key packaging technology to achieve the smallest form factor possible. Using copper as a direct under-bump metal and performing bonding under little force and at a low temperature eliminates the processing step for the depositi...
With the continuous miniaturization of electronic devices and the upcoming new technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation cellular networks (5G), etc., the electronics industry is achieving high-spee...
More efficient heat sinks are required due to the rapid increase of power density in microelectronic devices. In this study, a micro-array heat sink with stagger trapezoidal bumps was designed. Numerical simulations for the flow and heat transfer und...
Speed bumps are commonly used as traffic calming devices to reduce vehicle speeds on urban road sections. However, their geometric design and implementation quality are critical not only for traffic safety but also for vehicle occupants’ comfor...
In the context of the growing promotion of sustainable urban mobility policies, traffic calming is one of the main actions adopted by local, regional, and national administrations to support the liveability and vitality of residential and commercial...
The unsteady flow characteristics of a supercritical OAT15A airfoil with a shock control bump were numerically studied by a wall-modeled large eddy simulation. The numerical method was first validated by the buffet and nonbuffet cases of the baseline...
Pavement evaluation is critical for the decision-making process of pavement preservation and rehabilitation. Roughness is a key airport pavement characteristic that has been linked to impacts such as safety and service life. The Boeing Bump is one of...
In advanced packaging technology, the micro bump has become an important means of chip stacking and wafer interconnection. The reliability of micro bumps, which plays an important role in mechanical support, electrical connection, signal transmission...
Gas chromatography (GC) is the chemical analysis technique most widely used to separate and identify gas components, and it has been extensively applied in various gas analysis fields such as non-invasive medical diagnoses, indoor air quality monitor...
Traffic safety is a fundamental element of urban mobility, and speed bumps remain one of the most widely used measures for reducing vehicle speeds on local streets. This study investigates how different types of speed bumps influence traffic flow spe...
Micro Light Emitting Diode (Micro-LED) technology, characterized by exceptional brightness, low power consumption, fast response, and long lifespan, holds significant potential for next-generation displays, yet its commercialization hinges on resolvi...
Bump foil gas bearings (BFGBs) play an important role in high-speed turbomachinery. However, most studies on the dynamic characteristics of BFGBs focus on a one-pad structure composed of a bump foil and a top foil. This paper considers the multi-pad...
With the rapid development of nano/micro technology for commercial electronics, the typical interconnection method could not satisfy the high power-density packaging requirement. The 2.5D/3D integrated packaging was seen as a promising technology for...
With the advent of the era of big data and the vigorous development of consumer electronics, the demand for higher-speed processing capacity for gigantic amounts of data is increasing; this requires finer and far more numerous connections between die...
At transonic flight conditions, the buffet caused by the interaction between the shock waves and the boundary layers can degrade an aircraft’s aerodynamic performance and even threaten its safety. In this paper, the shock control bumps, origina...
We report a study on the process of the formation of bubble-like structures on a coated glass surface using 50 ps laser pulses. The high-intensity interaction of laser radiation on the film–glass interface allowed us to develop a process for ef...
At transonic flight conditions, shock oscillations on wing surfaces are known to occur and result in degraded aerodynamic performance and handling qualities. This is a purely flow-driven phenomenon, known as transonic buffet, that causes limit cycle...
Indium-based micro-bump arrays, among other things, are used for the bonding of infrared photodetectors and focal plane arrays. In this paper, several aspects of the fabrication technology of micrometer-sized indium bumps with a smooth surface morpho...
In this study, three-dimensional simulations of the ultrasonic vibration bonding process of micro-copper blocks were conducted using the finite element method. We analyzed the effects of ultrasonic vibration frequency on the stress field, strain fiel...
Structural damage identification plays an important role in providing effective evidence for the health monitoring of bridges in service. Due to the limitations of measurement points and lack of valid structural response data, the accurate identifica...
At transonic flight conditions, the buffet caused by the shockwave/boundary-layer interaction can degrade aircraft performance and even threaten their safety. In this paper, a closed-loop control using an active shock control bump (SCB) has been prop...
Among the current challenges of the Smart City, traffic management and maintenance are of utmost importance. Road surface monitoring is currently performed by humans, but the road surface condition is one of the main indicators of road quality, and i...
In the field of intelligent connected vehicles, the precise and real-time identification of speed bumps is critically important for the safety of autonomous driving. To address the issue that existing visual perception algorithms struggle to simultan...
We developed a telecentric 3D measurement system based on the fringe projection technique to measure phases corresponding to the 3D shape of bumps on a surface. A measurement algorithm based on an area scan camera with a flexibly programmable region...
Gallium nitride (GaN) power devices have many benefits, including high power density, small footprint, high operating voltage, and excellent power gain capability. However, in contrast to silicon carbide (SiC), its performance and reliability can be...
Objectives: The ‘speed bump sign’ is a clinical symptom characterised by aggravated abdominal pain while driving over speed bumps. This study aimed to perform a diagnostic meta-analysis, rate the certainty of evidence (CoE) and analyse th...
In this paper, a thermo-hydrodynamic model of the bump foil thrust gas bearing is developed, which solves the coupled gas film three-dimensional energy equation, non-isothermal Reynolds equation, and the foil deformation equation. The effects of bear...
Chimera states and bump states are collective synchronization phenomena observed independently (in different parameter regions) in networks of coupled nonlinear oscillators. And while chimera states are characterized by coexistence of coherent and in...
The condition of the roads where cars circulate is of the utmost importance to ensure that each autonomous or manual car can complete its journey satisfactorily. The existence of potholes, speed bumps, and other irregularities in the pavement can cau...
Objectives: To investigate the association between calcaneal bump height and hindfoot radiographic parameters on weight-bearing lateral radiographs in adult males with Progressive Collapsing Foot Deformity (PCFD), and to determine whether posterior c...
The dry lubricated bump-type foil air bearing enables a carrying load capacity due to a pressure build up in a convergent air film. Since the air bearing provides low power dissipation above the lift-off speed and the flexible foil provides an adapti...
The unsteady buzz characteristics of a dorsal supersonic bump inlet for a flying-wing configuration are investigated using wind-tunnel tests and three-dimensional unsteady numerical simulations. This study focuses on off-design operation at a freestr...
Bonding technology can be an important component of packaging for photonic chips, such as electro-optic (EO) modulators and other active function devices. In general, an EO modulator chip can achieve a broader 3 dB EO bandwidth than its packaging dev...
The rolling element bearing is a fundamental component of any rotating machinery. During operation, wear debris and lubricant impurities create dents and bumps on the bearing raceway surfaces. Such localized defects produce transient vibration impuls...
The aim of this study was to identify genetic variants and pathways associated with the total number of piglets born and to investigate the potential negative consequences of the intensive selection for reproductive traits, particularly the formation...
In response to the increasingly severe situation of main roadway shock in coal seams, with a focus on the strong-bump coal seam in main roadways under an asymmetric goaf in a certain mine, theoretical analysis, numerical simulation, and engineering p...
Bump feeding is a nutritional management strategy in swine production that involves increasing feed allowance and/or dietary nutrient density during the final weeks of gestation, usually from day 90 to farrowing, to support rapid fetal growth and pre...
In this study, an interconnection was formed between a Cu/SnAg pillar bump and an Ni-less surface-treated Cu pad through laser-assisted bonding (LAB), and its bonding characteristics were evaluated. The LAB process influences the bond quality and mec...
Three-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for achieving high-density integration, high-speed connectivity, and for downsizing of electronic devices. This paper describes recent developments in TSV fabrication and...
Bump foil journal bearings (BFJBs) are widely used in the superchargers of aviation piston engines (APEs). This paper proposes a method to evaluate the operating state of superchargers by monitoring the bearing temperature. A numerical model with a r...
Roads are the most heavily affected aspect of urban infrastructure given the ever-increasing number of vehicles needed to provide mobility to residents, supply them with goods, and help sustain urban growth. An important indicator of degrading road i...
Due to the complexity of lubricating characteristics in the variable-sectional and multiscale clearance, the absence of an effective prediction method and theoretical basis of multi-foil aerodynamic journal bearing with bump-backing foils needs to be...
Background: Haglund’s deformity, which is characterized by a bony prominence of the posterosuperior aspect of the calcaneus, causes posterior heel pain. To date, there is no standard radiographic parameter to diagnose symptomatic Haglund’...
Due to their self-adaptability, low friction, low loss, and high-speed stability, bump foil aerodynamic journal bearings are widely used in high-speed rotating equipment such as turbomachinery and flywheel energy storage. In the process of high-speed...
By extending the dipole Pomeron (DP) model, successful in describing elastic nucleon–nucleon scattering, to proton single diffractive dissociation (SD), we predict a dip-bump structure in the squared four-momentum transfer (t) distribution of p...
In this work, the development and implementation of a dynamic characteristics model for a specific multi-foil aerodynamic journal bearing with bump-backing foils (MFJB) is considered. Based on the previously established static characteristics model,...
Bumped kinase inhibitors are safe with promising efficacy against apicomplexan parasites. The 5-aminopyrazole-4-carboxamide BKI-1708 effectively inhibited vertical transmission of Toxoplasma gondii and significantly reduced the cerebral parasite load...
Flexible tactile sensors have been utilized in intelligent robotics for human-machine interaction and healthcare monitoring. The relatively low flexibility, unbalanced sensitivity and sensing range of the tactile sensors are hindering the accurate ta...
Background: Bumped kinase inhibitors (BKIs) are potential drugs for neosporosis treatment in farm animals. BKI-1294 exposure results in the formation of multinucleated complexes (MNCs), which remain viable in vitro under constant drug pressure. We in...
Currently, the high-speed performance of thin-film lithium niobate electro-optic modulator chips is evolving rapidly. Nevertheless, due to the inherent technical limitations imposed by the packaging design and material architecture, the intrinsic ele...
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