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Parametric Investigation on a Micro-Array Heat Sink with Staggered Trapezoidal Bumps

School of Mechanical Engineering, Hangzhou Dianzi University, Hangzhou 310018, China
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Micromachines 2019, 10(12), 845; https://doi.org/10.3390/mi10120845
Received: 3 November 2019 / Revised: 26 November 2019 / Accepted: 27 November 2019 / Published: 4 December 2019
(This article belongs to the Special Issue Optimization of Microfluidic Devices)
More efficient heat sinks are required due to the rapid increase of power density in microelectronic devices. In this study, a micro-array heat sink with stagger trapezoidal bumps was designed. Numerical simulations for the flow and heat transfer under various conditions were carried out to help us to fully understand the mechanisms of the heat transfer enhancement in such a heat sink. The effects of the structure of the heat sink, parameters of the bumps, and volume fraction of the nanofluid on the performance of heat sink were studied. The results show us that the bumps in the heat sink can result in chaotic convection, interrupting the thermal boundary layer and increasing the cooling area, subsequently improving the heat transfer performance. Furthermore, parametric investigations for trapezoidal bumps were conducted to obtain preferential values for parameters, such as the bump width, fore rake angle of the bump, bump height, and bump pitch. View Full-Text
Keywords: nanofluid; micro-array heat sink; staggered trapezoidal bumps; heat transfer enhancement nanofluid; micro-array heat sink; staggered trapezoidal bumps; heat transfer enhancement
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MDPI and ACS Style

Wang, R.; Yuan, W.; Wang, J.; Zhu, Z. Parametric Investigation on a Micro-Array Heat Sink with Staggered Trapezoidal Bumps. Micromachines 2019, 10, 845.

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