More efficient heat sinks are required due to the rapid increase of power density in microelectronic devices. In this study, a micro-array heat sink with stagger trapezoidal bumps was designed. Numerical simulations for the flow and heat transfer under various conditions were carried out to help us to fully understand the mechanisms of the heat transfer enhancement in such a heat sink. The effects of the structure of the heat sink, parameters of the bumps, and volume fraction of the nanofluid on the performance of heat sink were studied. The results show us that the bumps in the heat sink can result in chaotic convection, interrupting the thermal boundary layer and increasing the cooling area, subsequently improving the heat transfer performance. Furthermore, parametric investigations for trapezoidal bumps were conducted to obtain preferential values for parameters, such as the bump width, fore rake angle of the bump, bump height, and bump pitch.
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