This paper presents a fast electrothermal coupled analysis method that combines a temperature-dependent loss model with an analytical multilayer thermal model for multiple heat sources to predict the junction temperatures of silicon carbide metal-oxi...
To reduce carbon dioxide emissions, wind power generation is receiving more attention. The conversion of wind energy into electricity requires frequent use of insulated-gate bipolar transistors (IGBTs). Therefore, it is important to improve their rel...
While junction temperature control is an indispensable part of having reliable solid-state lighting, there is no direct method to measure its quantity. Among various methods, temperature-sensitive optical parameter-based junction temperature measurem...
Gallium nitride high-electron-mobility transistors (GaN HEMTs) are critical for high-power applications like AI power supplies and robotics but face reliability challenges due to increased dynamic ON-resistance (RDS_ON) from electrical and thermomech...
The junction temperature (Tj) is a key parameter reflecting the thermal behavior of Silicon carbide (SiC) MOSFETs and is essential for condition monitoring and reliability assessment in power electronic systems. However, the limited temperature sensi...
This paper presents a new methodical procedure to monitor in real time the junction temperature of SiC Power MOSFET modules of parallel-connected chips utilized in machine drive systems to develop their reliability modelling and predict their lifetim...
In this study, we propose an active junction temperature control method specifically tailored for traction inverters based on active neutral point-clamped (ANPC) three-level topology. This approach not only enables real-time junction temperature equa...
To address junction-temperature fluctuations and thermal-fatigue degradation of IGBT modules in EV traction inverters under CLTC conditions, this study develops a hierarchical active thermal-management framework. A temperature-dependent loss model co...
This work presents a step-by-step procedure to estimate the lifetime of discrete SiC power MOSFETs equipping three-phase inverters of electric drives. The stress of each power device when it is subjected to thermal jumps from a few degrees up to abou...
In this study, an accurate temperature prediction model is proposed for GaAs HBT, which considers both the bias voltage and current rather than power consumption only. The increase in temperature is closely related to the heat source property, which...
Distributed systematic grid-connected inverter practice needs to improve insulated gate bipolar transistor (IGBT) stability to ensure the safe operation. This study is to ensure the safety and reliability operation of the IGBT module in symmetry to m...
In recent years, the use of high-power semiconductor devices has seen growing demand across various applications, including data centers, electric vehicles, and traction systems. However, increasing power densities may increase challenges in ensuring...
This paper presents a detailed refinement and validation of two well-known lifetime prediction models for IGBTs, namely CIPS08 and SKiM63, using experimental power cycling test data. This study focuses on adapting these models to reflect the operatio...
Under the operating conditions of high power and high switching frequency, an insulated gate bipolar transistor (IGBT) chip can produce relatively large power loss, causing the junction temperature to rise rapidly; consequently, the reliability of th...
This paper proposes a novel method for optimizing the Cauer-type thermal network model considering both the temperature influence on the extraction of parameters and the errors caused by the physical structure. In terms of prediction of the transient...
As a core component of photovoltaic power generation systems, insulated gate bipolar transistor (IGBT) modules continually suffer from severe temperature swings due to complex operation conditions and various environmental conditions, resulting in fa...
The convection thermal coupling between adjacent power devices in power converters is dependent on the ambient temperature. When the ambient temperature changes, the convection thermal coupling also changes. This results in an inaccurate thermal mode...
To address the challenge of balancing junction temperature prediction accuracy and computational efficiency for high-power multi-chip IGBT modules in automotive applications during complex electro-thermal conversion processes, this study proposes an...
This study investigated the thermal transport behaviors of branched carbon nanotubes (CNTs) with cross and T-junctions through non-equilibrium molecular dynamics (NEMD) simulations. A hot region was created at the end of one branch, whereas cold regi...
The types and the characteristics of the waste heat on hypersonic vehicles and the application feasibility of thermoelectric generators (TEGs) for hypersonic aircraft are discussed in this paper. Two thermoelectric generator schemes with an isotherma...
This paper presents the development of a hardware simulator based on the junction-temperature of insulated-gate bipolar transistor (IGBT) modules in modular multilevel converters (MMCs). The MMC consists of various power-electronics components, and t...
Grain boundary networks composed of equal microstructural elements were investigated in a recent paper. In this work a more complicated artificial grain topology consisting of one four-sided, two six-sided and one eight-sided grain is designed to fur...
The temperature fluctuations due to the mixing of two streams in a T-junction induce thermal stresses in the piping material, resulting in a pipe failure in Nuclear Power Plants. The numerical modeling of the thermal mixing in T-junctions is a challe...
Digital twin technology is rapidly gaining traction in the semiconductor industry for its ability to model manufacturing processes, including packaging engineering, to monitor and optimise performance cost-effectively. This paper focuses on two key a...
The lifetime prediction using accelerated degradation test (ADT) method has become a main issue for white light emitting diodes applications. This paper proposes a novel lifetime model for light emitting diodes (LEDs) under thermal and electrical str...
Raising the efficiency of triple-junction cells such as (GaInP/GaInAs/Ge) is an important goal for designing high-concentration photovoltaic systems. This purpose can be achieved by facing cell obstacles and acting on their configurations to sustain...
This study proposes a method for estimating the junction temperature of power semiconductors, particularly IGBTs (Insulated Gate Bipolar Transistors) and diodes. Traditional temperature measurement methods using NTC (Negative Temperature Coefficient)...
Employing charge–flux duality for Josephson junctions and superconducting nanowires, we predict a novel effect of fluxon cotunneling in SQUID-like nanorings. This process is strictly dual to that of Cooper pair cotunneling in superconducting tr...
The transition toward electric vehicle (EV) architectures exceeding 800 V offers key advantages, including shorter charging times, lower operating currents, and reduced system weight due to smaller conductor cross-sections, all of which enhance overa...
Light-emitting diode (LED) digital twins enable the implementation of fast digital design flows for LED-based products as the lighting industry moves towards Industry 4.0. The LED digital twin developed in the European project Delphi4LED mimics the t...
Accurate and fast junction-temperature estimation in Silicon Carbide (SiC) power modules is crucial for reliable operation, health monitoring and predictive control of power electronic converters in different applications. However, direct temperature...
The squeeze casting process for an AlSi9Mg aluminum alloy flywheel housing component was numerically simulated using the ProCAST software, and orthogonal simulation tests were designed according to the L16 (4) 5 orthogonal test table to investigate t...
Bose metals are metals made of Cooper pairs, which form at very low temperatures in superconducting films and Josephson junction arrays as an intermediate phase between superconductivity and superinsulation. We predicted the existence of this 2D meta...
Many factors affect the quality of the injection molding of plastic products, including the process parameters, mold materials, type and geometry of plastic parts, cooling system, pouring system, etc. A multi-objective optimization method for injecti...
Light emitting diode (LED)-recessed downlighting is currently mainly used for indoor lighting of residential and commercial buildings. Maintaining a low junction temperature and increasing the lifetime and reliability of LED lighting is desirable. Th...
Evidence is reported that topological effects in graph-shaped arrays of superconducting islands can condition superconducting energy gap and transition temperature. The carriers giving rise to the new phase are couples of electrons (Cooper pairs) whi...
The numerical simulation approach of heat carrier mixing regimes in the T-junction shows that the RANS approach is beneficial for a qualitative flow analysis to obtain relatively agreed averaged velocity and temperature. Moreover, traditionally, the...
The lifetime of power electronic systems is the focus of both the academic and industrial worlds. Today, compact systems present high switching frequency and power dissipation density, causing high junction temperatures and strong thermal fluctuation...
Thermocouples made of etched and non-etched nickel-coated carbon yarn (NiCCY) were investigated. Theoretic Seebeck coefficients were compared to experimental results from measurements of generated electric voltage by these thermocouples. The etching...
The contact interfaces of a press-pack insulated-gate bipolar transistor (PP-IGBT) module under fluctuating thermal stress will undergo minor friction and mutual sliding during service, which results in damage to the contact surface and a decline in...
This study introduces an effective and efficient dynamic electro-thermal coupling analysis (ETCA) approach to explore the electro-thermal behavior of a three-phase power metal–oxide–semiconductor field-effect transistor (MOSFET) inverter for brushles...
The electrification of transportation pushes traction inverters, on-board chargers, and aircraft propulsion systems toward higher power density, increasingly enabled by wide-bandgap devices, thereby concentrating ever-larger heat fluxes on power semi...
This work develops a novel compact Silicon-Controlled Rectifier (SCR) model incorporating self-heating effects, extending the conventional Ebers–Moll (E–M) framework for Bipolar Junction Transistors (BJTs) by comprehensively integrating p...
The interconnecting solder is a key control factor for the reliability of electronic power packaging because it highly affects the junction temperature of insulated-gate bipolar transistor (IGBT) modules and is prone to plasticity, creep, and other f...
Reliable multilevel inverter IGBT modules require precise loss and heat management, particularly in severe traction applications. This paper presents a comprehensive modeling framework for three-level T-type neutral-point clamped (TNPC) inverters usi...
One of the main causes of failure in Insulated Gate Bipolar Transistor (IGBT) modules used in high-power conversion applications is thermal-stress-induced degradation. In this paper, an experimental testing setup for thermal stress and real-time degr...
The accuracy of condensation risk assessment depends on the accuracy of the measured or calculated temperatures. The existing 2D simulation method provides sufficiently accurate results for evaluating average performance values, such as U-values. How...
In this paper, the gas sensing properties of metal oxide nano-powder composites are studied and modeled. The gas sensing properties of mixtures of two different metal oxide nanoparticles, prepared via low-cost routes, are investigated. The responses...
This paper investigates not fully explained voltage offsets observed by several researchers during the measurement of the Seebeck coefficient of high Z materials. These offsets, traditionally attributed to faulty laboratory procedures, have proven to...
This paper presents a new electro-thermal coupling simulation method for evaluating the reliability of IGBT modules, which combines a numerical power loss model and a finite element model. To illustrate the method, a specific case of the Infineon FF5...
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