sensors-logo

Journal Browser

Journal Browser

Advanced Sensors and Artificial Intelligence for Condition Monitoring of Power Electronic Systems

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Intelligent Sensors".

Deadline for manuscript submissions: 30 September 2025 | Viewed by 556

Special Issue Editors

School of Engineering, University of Leicester, Leicester LE1 7RH, UK
Interests: model predictive control; power electronics; motor drive control; machine learning; artificial intelligence
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
College of Automation Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing, China
Interests: power electronics; motor drive control; wide bandgap semiconductor

E-Mail
Guest Editor
School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Singapore
Interests: power electronics; machine learning; artificial intelligence; renewable energy; electric aircraft
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor Assistant
School of Engineering, University of Leicester, Leicester LE1 7RH, UK
Interests: process automation; prototype design and construction for novel (manufacturing) processes; selection and assembling of components; retrofitting and reengineering (manufacturing) equipment

Special Issue Information

Dear Colleagues,

Advanced sensors and artificial intelligence (AI) are revolutionizing the condition monitoring of power electronic systems. On one hand, advanced sensors play a crucial role in monitoring the health and performance of power electronic systems. These sensors can detect various parameters such as temperature, current, and voltage, providing real-time data that are essential for predictive maintenance and fault diagnosis. The integration of advanced sensors allows for more accurate and timely detection of anomalies, which can prevent failures and extend the lifespan of systems with power electronics. On the other hand, AI enhances the capabilities of condition monitoring systems by analyzing the vast amounts of data collected by sensors. AI techniques such as machine learning and fuzzy logic can identify patterns and predict potential issues before leading to system failures.

Therefore, the integration of advanced sensors and AI provides a powerful approach to condition monitoring that paves the way for more intelligent and resilient power electronic systems, ensuring the efficient and reliable operation of power electronic systems.

Scope and Topics:

We welcome original research articles, review papers, and case studies on topics including, but not limited to, the following:

Advanced Sensor Technologies: Development and application of novel sensors for monitoring electrical, thermal, and mechanical parameters in power electronic systems.

AI and Machine Learning: Implementation of AI and machine learning algorithms for fault detection, diagnosis, and prognosis in power electronics.

Data Analytics: Techniques for processing and analyzing large datasets from sensors to extract meaningful insights for condition monitoring.

Predictive Maintenance: Strategies for predictive maintenance using sensor data and AI to enhance the reliability and lifespan of power electronic systems.

Integration and Implementation: Challenges and solutions for integrating advanced sensors and AI into existing power electronic systems.

Case Studies and Applications: Real-world applications and case studies demonstrating the effectiveness of advanced sensors and AI in condition monitoring.

Dr. Yuan Gao
Dr. Haihong Qin
Dr. Yu Zeng
Guest Editors

Dr. Victor Cedeno-Campos
Guest Editor Assistant

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • sensors
  • artificial intelligence
  • condition monitoring
  • power electronic systems
  • predictive maintenance

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • Reprint: MDPI Books provides the opportunity to republish successful Special Issues in book format, both online and in print.

Further information on MDPI's Special Issue policies can be found here.

Published Papers (1 paper)

Order results
Result details
Select all
Export citation of selected articles as:

Research

22 pages, 7820 KiB  
Article
A Junction Temperature Prediction Method Based on Multivariate Linear Regression Using Current Fall Characteristics of SiC MOSFETs
by Haihong Qin, Yang Zhang, Yu Zeng, Yuan Kang, Ziyue Zhu and Fan Wu
Sensors 2025, 25(15), 4828; https://doi.org/10.3390/s25154828 - 6 Aug 2025
Viewed by 203
Abstract
The junction temperature (Tj) is a key parameter reflecting the thermal behavior of Silicon carbide (SiC) MOSFETs and is essential for condition monitoring and reliability assessment in power electronic systems. However, the limited temperature sensitivity of switching characteristics makes it [...] Read more.
The junction temperature (Tj) is a key parameter reflecting the thermal behavior of Silicon carbide (SiC) MOSFETs and is essential for condition monitoring and reliability assessment in power electronic systems. However, the limited temperature sensitivity of switching characteristics makes it difficult for traditional single temperature-sensitive electrical parameters (TSEPs) to achieve accurate estimation. To address this challenge and enable practical thermal sensing applications, this study proposes an accurate, application-oriented Tj estimation method based on multivariate linear regression (MLR) using turn-off current fall time (tfi) and fall loss (Efi) as complementary TSEPs. First, the feasibility of using current fall time and current fall energy loss as TSEPs is demonstrated. Then, a coupled junction temperature prediction model is developed based on multivariate linear regression using tfi and Efi. The proposed method is experimentally validated through comparative analysis. Experimental results demonstrate that the proposed method achieves high prediction accuracy, highlighting its effectiveness and superiority in MLR approach based on the current fall phase characteristics of SiC MOSFETs. This method offers promising prospects for enhancing the condition monitoring, reliability assessment, and intelligent sensing capabilities of power electronics systems. Full article
Show Figures

Figure 1

Back to TopTop