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Open AccessEditorial

Preface: A Cross-Disciplinary Take on Responsible Electronics at the 1st REACT Conference

by Mahmoud Wagih, Natalia Lukaszewicz and Jeff Kettle

Eng. Proc. 2026, 127(1), 4; https://doi.org/10.3390/engproc2026127004 - 25 Feb 2026

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Abstract

The 1st International Conference on Responsible Electronics and Circular Technologies (REACT Conference) was held in Glasgow as part of the activities of the UK Research and Innovation (UKRI)-funded green economy centre “REACT” [...] Full article

(This article belongs to the Proceedings of International Conference on Responsible Electronics and Circular Technologies)

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5 pages, 663 KB

Open AccessProceeding Paper

Contactless Respiratory Monitoring Using Acoustic Convolutional Neural Network Classification

by Kirill Kurskiy, Yuanying Qu, Minzhang Liu and Jiafeng Zhou

Eng. Proc. 2026, 127(1), 1; https://doi.org/10.3390/engproc2026127001 - 24 Feb 2026

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Abstract

Continuous respiratory monitoring plays a crucial role in both clinical and non-clinical applications, providing valuable insights into physiological health. This paper presents a sustainable, contactless respiratory monitoring framework that integrates acoustic sensing with a lightweight convolutional neural network (CNN) optimized for low-power embedded [...] Read more.

Continuous respiratory monitoring plays a crucial role in both clinical and non-clinical applications, providing valuable insights into physiological health. This paper presents a sustainable, contactless respiratory monitoring framework that integrates acoustic sensing with a lightweight convolutional neural network (CNN) optimized for low-power embedded platforms. Breathing sounds are processed using wavelet-based denoising and Mel-Frequency Cepstral Coefficient (MFCC) extraction, achieving 94.8% classification accuracy with an inference latency of 0.3 s per frame. The quantized model deployed on a Sony Spresense microcontroller reduces memory usage by over 90%. By eliminating disposable sensors and minimizing energy consumption, the proposed approach delivers an eco-efficient, scalable, and real-time solution for continuous respiratory assessment. Full article

(This article belongs to the Proceedings of International Conference on Responsible Electronics and Circular Technologies)

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7 pages, 694 KB

Open AccessProceeding Paper

Life Cycle Assessment of Epitaxy of GaN-on-SiC High-Electron-Mobility Transistors for Advanced Radio Frequency Applications

by Max Mosig, Stefan Müller and Rüdiger Quay

Eng. Proc. 2026, 127(1), 2; https://doi.org/10.3390/engproc2026127002 - 24 Feb 2026

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Abstract

From 4G to 5G to 6G, every few years, a new generation of data transmission technology emerges to meet the growing demand for faster and more efficient communication. Artificial intelligence, the Internet of Things and the increasing need for global connectivity are the [...] Read more.

From 4G to 5G to 6G, every few years, a new generation of data transmission technology emerges to meet the growing demand for faster and more efficient communication. Artificial intelligence, the Internet of Things and the increasing need for global connectivity are the key drivers of this evolution, pushing both research and industry toward ever-higher data rates. These advanced technologies already consume vast amounts of resources and energy, relying on high-tech nano-fabrication processes such as metal–organic chemical vapor deposition, dry etching, deposition and lithography, all of which typically occur in energy-intensive cleanroom environments. This study evaluates the epitaxy process of GaN on SiC for high-electron-mobility transistor (HEMT) devices and integrated circuits using life cycle assessment. GaN HEMTs offer high efficiency and excellent thermal conductivity, paving the way for reduced chip footprints for lower energy consumption. This analysis enables informed decision-making regarding sustainability by providing detailed data and interpretation of Fraunhofer IAF’s GaN-on-SiC HEMT technology. Full article

(This article belongs to the Proceedings of International Conference on Responsible Electronics and Circular Technologies)

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5 pages, 852 KB

Open AccessProceeding Paper

Hydrogel-Based Conductive Inks for the Additive Printing of Biodegradable Radiofrequency Electronic Circuits

by Álvaro Méndez-Espinosa, Sergio Ortiz-Ruiz, Mikel G. Palomo, Francisco Pasadas, Laura Rodríguez-Arco, Modesto T. López-López and Francisco G. Ruiz

Eng. Proc. 2026, 127(1), 3; https://doi.org/10.3390/engproc2026127003 - 25 Feb 2026

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Abstract

Biodegradable hydrogel-based conductive inks, with application in additive circuit manufacturing, are synthesized from agarose, sodium alginate and functional carbon-based particles (carbon nanotubes and graphite). Rheological measurements are conducted to evaluate the printing performance of each ink. The synthesized functional inks are printed, and [...] Read more.

Biodegradable hydrogel-based conductive inks, with application in additive circuit manufacturing, are synthesized from agarose, sodium alginate and functional carbon-based particles (carbon nanotubes and graphite). Rheological measurements are conducted to evaluate the printing performance of each ink. The synthesized functional inks are printed, and their conductivity properties are evaluated as a function of the functional material concentration. Promising conductivity values are achieved, demonstrating their potential application for low-cost and low-environmental-impact circuital and electromagnetic designs. Full article

(This article belongs to the Proceedings of International Conference on Responsible Electronics and Circular Technologies)

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6 pages, 502 KB

Open AccessProceeding Paper

Investigation of E-Waste Management Practices to Promote Circularity: A Case Study from Sri Lanka

by Kuruppuge Themiya, Kulatunga K. Asela and Luis Martino

Eng. Proc. 2026, 127(1), 5; https://doi.org/10.3390/engproc2026127005 - 26 Feb 2026

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Abstract

This study examines the e-waste management practices in Sri Lanka, using a comparative approach that considers the entire e-waste management supply chain. A systematic review was carried out by examining the existing policy implementations and regulations and the current formal and informal waste [...] Read more.

This study examines the e-waste management practices in Sri Lanka, using a comparative approach that considers the entire e-waste management supply chain. A systematic review was carried out by examining the existing policy implementations and regulations and the current formal and informal waste management practices established in Sri Lanka and by comparing collection levels globally and across selected developed and developing countries. This study demonstrates how regulatory bodies currently intervene from manufacturing to the end of product life and how stakeholders are involved in e-waste management. This work reveals the policy, regulations, and institutional capacity gaps in establishing proper e-waste management in Sri Lanka. While Sri Lanka faces some similar challenges to other developing countries, like dependence on informal collection, differences in policy frameworks, and institutional capacity, this may imply that generalized solutions fail to capture some important national variations. Full article

(This article belongs to the Proceedings of International Conference on Responsible Electronics and Circular Technologies)

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4 pages, 620 KB

Open AccessProceeding Paper

Side Chain Engineering of a Solution-Processed Non-Acidic Hole Transport Material for Organic Electronics

by Joseph Cameron, Neil J. Findlay, Rupert G. D. Taylor, Anto R. Inigo and Peter J. Skabara

Eng. Proc. 2026, 127(1), 6; https://doi.org/10.3390/engproc2026127006 - 27 Feb 2026

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Abstract

Organic semiconductors have the potential to contribute to sustainable electronics manufacture due to their ability to be processed from low-energy solution-processing methods. However, improvements must be made in the lifetime of such devices. PEDOT:PSS, a popular hole transport material, is acidic, which causes [...] Read more.

Organic semiconductors have the potential to contribute to sustainable electronics manufacture due to their ability to be processed from low-energy solution-processing methods. However, improvements must be made in the lifetime of such devices. PEDOT:PSS, a popular hole transport material, is acidic, which causes degradation in devices over time. Therefore, a replacement is needed to allow for longer lasting organic semiconductor devices. We have previously reported BEDOTPy, a non-acidic, molecular material that could be used to improve the device lifetime of OLEDs. In this work we explore how molecular engineering of BEDOTPy, by modifying the molecule’s side chain, affects the physical properties that are important to device performance and lifetime. Full article

(This article belongs to the Proceedings of International Conference on Responsible Electronics and Circular Technologies)

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5 pages, 648 KB

Open AccessProceeding Paper

Beyond FR-4: A Comparative Life Cycle Assessment of Traditional and Green PCB Substrates

by Moupali Chakraborty

Eng. Proc. 2026, 127(1), 7; https://doi.org/10.3390/engproc2026127007 - 27 Feb 2026

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Abstract

This study compares the environmental impacts of traditional and biodegradable PCB substrate materials using Life Cycle Assessment (LCA) in GaBi (version number 9.2.1.68). It presents the first cradle-to-grave model of FR4-based rigid PCBs. Results show that conventional substrates (FR4, PI) have high global [...] Read more.

This study compares the environmental impacts of traditional and biodegradable PCB substrate materials using Life Cycle Assessment (LCA) in GaBi (version number 9.2.1.68). It presents the first cradle-to-grave model of FR4-based rigid PCBs. Results show that conventional substrates (FR4, PI) have high global warming potential (~20 kg CO₂-eq/kg) and energy use, with poor recyclability. Biodegradable alternatives (PLA, PBAT) show much lower impacts (~4 kg CO₂-eq/kg) and better end-of-life performance. PET offers moderate recyclable performance, while paper (~6 kg CO₂-eq/kg) is fully biodegradable and recyclable. Overall, biodegradable substrates, especially PLA, PBAT, and paper, provide clear sustainability advantages, with PET as a practical transitional option. Full article

(This article belongs to the Proceedings of International Conference on Responsible Electronics and Circular Technologies)

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5 pages, 1310 KB

Open AccessProceeding Paper

3D-Printed Antenna Arrays and Interconnects for Millimeter-Wave Applications

by Sumin David Joseph, Edward Andrew Ball, Benedict Davies, Matthew Davies, Jon R. Willmott, Jeff Kettle and Jonathon Harwell

Eng. Proc. 2026, 127(1), 8; https://doi.org/10.3390/engproc2026127008 - 6 Mar 2026

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Abstract

Additive manufacturing is transforming high-frequency electronics prototyping by offering a sustainable and cost-effective alternative to traditional methods. This work addresses and demonstrates two areas: the use of 3D printing for millimeter-wave (mmWave) antennas, and chip-to-chip or chip-to-PCB interconnects. Both approaches facilitate reduced material [...] Read more.

Additive manufacturing is transforming high-frequency electronics prototyping by offering a sustainable and cost-effective alternative to traditional methods. This work addresses and demonstrates two areas: the use of 3D printing for millimeter-wave (mmWave) antennas, and chip-to-chip or chip-to-PCB interconnects. Both approaches facilitate reduced material waste. A 47 GHz series-fed microstrip patch array was printed on flexible Kapton using aerosol jet technology, showing performance comparable to etched arrays on Roger’s substrates. Crucially, the Kapton film can be peeled off after testing, allowing the reuse of expensive low-loss substrates. Therefore, this method supports rapid, low-waste prototyping. To address future chip-to-chip and chip-to-PCB mmWave interconnect limitations, XTPL’s Ultra-Precise Dispensing (UPD) was used to fabricate 3D-printed micro-interconnects. At 73 GHz, these interconnect structures achieved return loss better than 10 dB and insertion loss under 1 dB—outperforming traditional bondwires. Together, these results show 3D printing’s potential to enable sustainable, high-performance mmWave RF systems. Full article

(This article belongs to the Proceedings of International Conference on Responsible Electronics and Circular Technologies)

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4 pages, 600 KB

Open AccessProceeding Paper

Development of Dielectrophoresis Electrodes for Nanowire Alignment

by Jungang Zhang, Venkatarao Selamneni, Bhavani Prasad Yalagala, Morteza Amjadi and Hadi Heidari

Eng. Proc. 2026, 127(1), 9; https://doi.org/10.3390/engproc2026127009 - 11 Mar 2026

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Abstract

This work presents the design and simulation of DEP electrodes with an interdigitated electrode (IDE) pattern for the alignment of 1D nanostructures using COMSOL simulations. The impact of electric field distribution with varying electrode geometry, voltage, and frequency were studied using these simulations. [...] Read more.

This work presents the design and simulation of DEP electrodes with an interdigitated electrode (IDE) pattern for the alignment of 1D nanostructures using COMSOL simulations. The impact of electric field distribution with varying electrode geometry, voltage, and frequency were studied using these simulations. The maximum electric field value of 2.6 × 10⁶ V/m was observed at electrode edges and gaps. Moreover, a significant increase in the electric field was observed with a decrease in finger width. These simulation results for DEP electrodes have huge potential in advancing 1D nanowire-based flexible and wearable electronic devices in the future. Full article

(This article belongs to the Proceedings of International Conference on Responsible Electronics and Circular Technologies)

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8 pages, 810 KB

Open AccessProceeding Paper

Environmental Hotspots in Semiconductor-Based Diabetes Care: Green ICs and Circular Economy Approaches

by Theresa Seeholzer, David Sánchez and Rüdiger Quay

Eng. Proc. 2026, 127(1), 10; https://doi.org/10.3390/engproc2026127010 - 10 Mar 2026

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Abstract

Diabetes, projected to affect over 1.3 billion people by 2050, presents significant healthcare burdens and environmental challenges, necessitating innovative and sustainable solutions to manage complications effectively. This study applies life cycle assessment to evaluate the environmental impacts of two semiconductor-enabled diabetes care devices: [...] Read more.

Diabetes, projected to affect over 1.3 billion people by 2050, presents significant healthcare burdens and environmental challenges, necessitating innovative and sustainable solutions to manage complications effectively. This study applies life cycle assessment to evaluate the environmental impacts of two semiconductor-enabled diabetes care devices: (1) a single-use urine-based C-peptide measurement strip aligned with the reduce strategy and (2) a reusable smart wound dressing for chronic wound monitoring under the reuse strategy. Integrating green electricity reduced the total lifecycle global warming potential by 16.2% for the urine strip and 0.4% for the smart wound dressing. The results emphasize the importance of tailored design strategies, showing that the impact of green integrated circuits is substantial for single-use reduce systems, while long-term treatments benefit more from reuse strategies paired with durable, complex designs that extend component lifespan and limit new manufacturing burdens. Full article

(This article belongs to the Proceedings of International Conference on Responsible Electronics and Circular Technologies)

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6 pages, 2092 KB

Open AccessProceeding Paper

Molecular Recognition Technology^TM (MRT™) for Selective Metal Separation in Green E-Waste Processing

by Roberto Navarro-Tovar, Minerva Davila Leija, Luis G. Navarro-Tovar and Steven R. Izatt

Eng. Proc. 2026, 127(1), 11; https://doi.org/10.3390/engproc2026127011 - 10 Mar 2026

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Abstract

The rapid growth of electronic waste (e-waste) demands sustainable recovery solutions based on green chemistry. Conventional recycling relies on energy-intensive pyrometallurgical routes that cause emissions and material losses. This study applies Molecular Recognition Technology™ (MRT™) for selective energy-efficient recovery of base (Cu, Ni, [...] Read more.

The rapid growth of electronic waste (e-waste) demands sustainable recovery solutions based on green chemistry. Conventional recycling relies on energy-intensive pyrometallurgical routes that cause emissions and material losses. This study applies Molecular Recognition Technology™ (MRT™) for selective energy-efficient recovery of base (Cu, Ni, Fe, Sn) and precious/platinum group metals (Ag, Pd, Pt) from a collector metal alloy. A hydrometallurgical process combining electrowinning, sequential acid leaching, and MRT™ separations achieved >99% metal purity with minimal waste generation. The results demonstrate MRT™ as a scalable green alternative for high-efficiency metal recovery from e-waste, supporting circular economy objectives. Full article

(This article belongs to the Proceedings of International Conference on Responsible Electronics and Circular Technologies)

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7 pages, 189 KB

Open AccessProceeding Paper

Bridging the Gap: Integrating 9R Strategies for Circularity in Microelectronics

by Tuğana Aslan and Lotta Adu

Eng. Proc. 2026, 127(1), 12; https://doi.org/10.3390/engproc2026127012 - 10 Mar 2026

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Abstract

The growing scarcity of raw materials and global reliance on these natural resources underscore the critical importance of circularity in ICT and microelectronics. Current circular practices often focus on electronic products while overlooking essential microelectronic components, materials, and processes, revealing a significant gap [...] Read more.

The growing scarcity of raw materials and global reliance on these natural resources underscore the critical importance of circularity in ICT and microelectronics. Current circular practices often focus on electronic products while overlooking essential microelectronic components, materials, and processes, revealing a significant gap in sustainable practices. This paper aims to evaluate the current state of circularity approaches and the application of the 9R Strategies at the component and microelectronics levels. We present best practice examples from the Green ICT @ FMD competence center and explore technological solutions that incorporate circularity principles across various domains, including the integration of longevity principles and process optimization. Based on our findings, we provide a comprehensive analysis of current practices and gaps concerning circularity at the microelectronic level. Full article

(This article belongs to the Proceedings of International Conference on Responsible Electronics and Circular Technologies)

5 pages, 1635 KB

Open AccessProceeding Paper

Cryo-PMOS Hardware Towards Energy Efficient Neuromorphic Systems

by Bhavani Prasad Yalagala, Fiheon Imroze, Meraj Ahmad, Mostafa Elsayed, Robert Graham, Martin Weides and Hadi Heidari

Eng. Proc. 2026, 127(1), 13; https://doi.org/10.3390/engproc2026127013 - 12 Mar 2026

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Abstract

The current work proposes a novel idea of exploration of the standard 180 nm-based bulk CMOS technology operating under cryogenic temperatures to achieve energy-efficient and high-speed computation. A PMOS chip of 180 nm technology is fabricated and is explored for synaptic memory applications [...] Read more.

The current work proposes a novel idea of exploration of the standard 180 nm-based bulk CMOS technology operating under cryogenic temperatures to achieve energy-efficient and high-speed computation. A PMOS chip of 180 nm technology is fabricated and is explored for synaptic memory applications by operating at 4 K temperatures. This proposed approach offers numerous advantages in terms of enhanced charge carrier mobilities, reduced power dissipation, and seamless integration with standard CMOS technology. The fabricated PMOS under cryogenic temperatures exhibits pinched hysteresis characteristics, confirming the memory retention capability with very low set and reset voltages. Next, synaptic functional measurements were performed by applying constant pulse trains at the drain terminal to understand the human brain’s learning and memory retention capabilities. Full article

(This article belongs to the Proceedings of International Conference on Responsible Electronics and Circular Technologies)

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5 pages, 3160 KB

Open AccessProceeding Paper

Modeling Framework for Solid-Phase Peptide Synthesis on SiO₂

by Nicholas Smoliak, Pedro Parreira, Craig Macdonald and Vihar Georgiev

Eng. Proc. 2026, 127(1), 14; https://doi.org/10.3390/engproc2026127014 - 16 Mar 2026

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Abstract

Solid-phase peptide synthesis (SPPS) allows for the sequential assembly of diverse peptide sequences. Alongside its scalability and capacity for automation, this makes it the method of choice for the synthesis of peptide-based pharmaceuticals. SPPS reaction pathways, however, suffer from a negative environmental footprint [...] Read more.

Solid-phase peptide synthesis (SPPS) allows for the sequential assembly of diverse peptide sequences. Alongside its scalability and capacity for automation, this makes it the method of choice for the synthesis of peptide-based pharmaceuticals. SPPS reaction pathways, however, suffer from a negative environmental footprint due to the super-stoichiometric quantities of reagents and high solvent use required to ensure reaction completion. In this paper, we propose the use of charge-based measurements as a complement to optical methods for measuring reaction completion. We extend the capabilities of our hybrid modeling framework to a representative four-step SPPS pathway on SiO₂, showing each reaction intermediate, its molecular encoding, and the resulting modeled surface potential (

ψ_{0}

). We show that the simulated

ψ_{0} (pH)

plots are separable for three of the four key reaction steps in the representative pathway, indicating that charge-based measurements may help verify protection/deprotection steps. Full article

(This article belongs to the Proceedings of International Conference on Responsible Electronics and Circular Technologies)

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8 pages, 1059 KB

Open AccessProceeding Paper

Comparative Cradle-to-Gate Life Cycle Assessment of Planar and Vertical HZO-Based Ferroelectric Memories (FeRAM) on 22 nm FDSOI Node

by Mathilde Billaud, Laura Vauche, Carine Jahan, Julian Sturm, Catherine Euvrard-Colnat, Fabien Grimaud, François Andrieu, Laurent Pain, Yann Beilliard and Laurent Grenouillet

Eng. Proc. 2026, 127(1), 15; https://doi.org/10.3390/engproc2026127015 - 16 Mar 2026

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Abstract

Emerging non-volatile memories based on ferroelectric materials are currently under development to be integrated in the back-end-of-line of advanced complementary metal-oxide-semiconductor (CMOS) nodes. A life cycle assessment (LCA) over 16 impact categories has been carried out to compare planar (2D) and vertical (3D) [...] Read more.

Emerging non-volatile memories based on ferroelectric materials are currently under development to be integrated in the back-end-of-line of advanced complementary metal-oxide-semiconductor (CMOS) nodes. A life cycle assessment (LCA) over 16 impact categories has been carried out to compare planar (2D) and vertical (3D) integration strategies for the manufacturing of Hf_0.5Zr_0.5O₂-based ferroelectric capacitors on a 22 nm CMOS technology node. The LCA demonstrates that the 3D approach allows us to reduce the environmental impacts by up to 20% over several impact categories. The device isolation by a single chemical–mechanical polishing (CMP) step instead of the standard photolithography and plasma etching processes proved to be the main source of reduction on the overall environmental footprint. Full article

(This article belongs to the Proceedings of International Conference on Responsible Electronics and Circular Technologies)

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8 pages, 1089 KB

Open AccessProceeding Paper

Electronic-Grade Silicon (EG Si) Wafer Production: Review and Update of Life Cycle Inventory (LCI) Data

by Enola Fidon, Suzanne Guillou, Yannick Rivoira and Laura Vauche

Eng. Proc. 2026, 127(1), 16; https://doi.org/10.3390/engproc2026127016 - 16 Mar 2026

Cited by 1 | Viewed by 896

Abstract

The growing use of integrated circuits has made it essential to assess and minimize the environmental impacts of these systems. As most integrated circuits are manufactured on electronic-grade silicon (EG Si) wafers, the first step is to obtain reliable, consistent and complete life [...] Read more.

The growing use of integrated circuits has made it essential to assess and minimize the environmental impacts of these systems. As most integrated circuits are manufactured on electronic-grade silicon (EG Si) wafers, the first step is to obtain reliable, consistent and complete life cycle inventory (LCI) data on their production. This work proposes an update to the LCI of EG Si wafers with recent data available for solar-grade silicon (SoG Si) wafers. In addition, as thickness, shape and purity differ greatly between SoG and EG Si wafers, an adaptation to the manufacturing process’s LCI has been made. Full article

(This article belongs to the Proceedings of International Conference on Responsible Electronics and Circular Technologies)

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5 pages, 1399 KB

Open AccessProceeding Paper

A Hybrid Chitosan–Parylene C Composite Based Piezoelectric Pressure Sensor for Biomedical Applications

by Zhao Wang, Bhavani Prasad Yalagala, Hadi Heidari and Andrew Feeney

Eng. Proc. 2026, 127(1), 17; https://doi.org/10.3390/engproc2026127017 - 24 Mar 2026

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Abstract

Flexible and biocompatible sensors are vital for a wide range of biomedical applications, including real-time health monitoring, intracranial pressure monitoring, knee replacement surgeries, wearables, and smart prosthetics. While various highly sensitive and stable pressure sensors have been demonstrated, they often lack the conformability [...] Read more.

Flexible and biocompatible sensors are vital for a wide range of biomedical applications, including real-time health monitoring, intracranial pressure monitoring, knee replacement surgeries, wearables, and smart prosthetics. While various highly sensitive and stable pressure sensors have been demonstrated, they often lack the conformability and biocompatibility crucial for their wider application in various bio-integrated electronic systems. Herein, a piezoelectric pressure sensor is proposed using a hybrid polymer composite by leveraging the unique properties of Chitosan and Parylene C. Various material characterisations, such as XRD and FTIR, were performed to reveal structural and chemical characteristics of the novel composite material. Next, electromechanical characterisations of the pressure sensor were performed to reveal its dynamic sensing properties. The pressure sensor exhibits excellent sensitivity for both pressure and frequency, as well as cyclic stability (10³ cycles), wide pressure range (20–70 kPa), and biocompatibility. Full article

(This article belongs to the Proceedings of International Conference on Responsible Electronics and Circular Technologies)

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6 pages, 957 KB

Open AccessProceeding Paper

Component Recycling in Chipless Devices for Low-Cost, Circular Wireless Temperature Sensors

by Benjamin King, Nikolas Bruce and Mahmoud Wagih

Eng. Proc. 2026, 127(1), 18; https://doi.org/10.3390/engproc2026127018 - 30 Mar 2026

Viewed by 453

Abstract

With the rapid development of smart devices for body area networks and smart packaging, there is a significant demand for low-waste and low-impact electronic systems in industries such as healthcare and transportation. We demonstrate that the dielectric material from capacitors in resistor-inductor-capacitor ( [...] Read more.

With the rapid development of smart devices for body area networks and smart packaging, there is a significant demand for low-waste and low-impact electronic systems in industries such as healthcare and transportation. We demonstrate that the dielectric material from capacitors in resistor-inductor-capacitor (RLC) wireless, chipless, resonant temperature sensors can be successfully recovered from flexible PCBs, with pristine sensors re-introduced to the tag’s sensor loading. First, we demonstrate that replacing the dielectric in a parallel plate capacitor with a pristine component, with recycled electrodes and sub-miniature-A (SMA) adaptor, results in only a 3% change in broadband capacitance. An identical substitution of the sensing element in an RLC circuit tuned to resonate at 21.0 MHz, with recycled parallel plates, a resistor, and an inductive PCB coil, results in a change of only 7.6% in the resonant frequency of the tag to 19.4 MHz. This work demonstrates the recyclability of chipless tags for temperature sensing for the first time, offering sustainability gains in smart packaging applications, with the potential to be expanded to other sensing tags for pH, humidity, and chemical analytes, towards chipless product passports. Full article

(This article belongs to the Proceedings of International Conference on Responsible Electronics and Circular Technologies)

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5 pages, 907 KB

Open AccessProceeding Paper

Sustainable Soil Moisture RF Sensor Based on Fully Recyclable/Biodegradable Liquid Metal Antenna

by Xiaochuan Fang, James Stephenson and Mahmoud Wagih

Eng. Proc. 2026, 127(1), 19; https://doi.org/10.3390/engproc2026127019 - 2 Apr 2026

Viewed by 526

Abstract

In this paper, we demonstrate the first sustainable soil moisture sensor based on a fully recyclable antenna. The antenna is fabricated using recyclable liquid metal and biodegradable polylactic acid (PLA), achieving a recycling efficiency of over 98%. The soil moisture is detected through [...] Read more.

In this paper, we demonstrate the first sustainable soil moisture sensor based on a fully recyclable antenna. The antenna is fabricated using recyclable liquid metal and biodegradable polylactic acid (PLA), achieving a recycling efficiency of over 98%. The soil moisture is detected through the antenna’s reflection coefficient and the transmission coefficient between the proposed antenna and a receiving horn antenna. The antenna has been recycled and refabricated. The reflection and transmission coefficient of the antenna is read out by a benchtop VNA. The reflection coefficient of the dried antenna has maintained bandwidth before and after the antenna has been recycled. The reflection coefficient of the dried antenna varies within the acceptable bandwidth. The transmission coefficient was continuously readout in a 500 s period; the S21 is significantly changed with the changing of the soil moisture. Full article

(This article belongs to the Proceedings of International Conference on Responsible Electronics and Circular Technologies)

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5 pages, 2222 KB

Open AccessProceeding Paper

Towards Biocompatible and Sustainable Flexible RFID Tags Using Screen-Printed PEDOT:PSS

by Mikel García-Palomo, Benjamin King, Francisco Pasadas, Francisco G. Ruiz and Mahmoud Wagih

Eng. Proc. 2026, 127(1), 20; https://doi.org/10.3390/engproc2026127020 - 18 May 2026

Viewed by 91

Abstract

This work presents the design and implementation of a flexible RFID tag based on a biocompatible and environmentally friendly conductive polymer, PEDOT:PSS, which is deposited onto a polyimide/fabric substrate using screen-printing techniques. The complete system consists of a dipole antenna based on PEDOT:PSS [...] Read more.

This work presents the design and implementation of a flexible RFID tag based on a biocompatible and environmentally friendly conductive polymer, PEDOT:PSS, which is deposited onto a polyimide/fabric substrate using screen-printing techniques. The complete system consists of a dipole antenna based on PEDOT:PSS and a compact inductive metallic loop on a separate flexible printed circuit board (PCB) designed to match the capacitive impedance of a commercial RFID chip. The modular architecture, with the integrated circuit (IC) mounted on a reusable PCB substrate, shows efficient power transfer while allowing for easy disassembly, recycling, and consequently circularity of the PEDOT:PSS antenna and IC. By leveraging biocompatible materials and additive manufacturing processes, the proposed approach contributes to the advancement of sustainable and low-impact wireless technologies, addressing environmental concerns in next-generation electronics. Full article

(This article belongs to the Proceedings of International Conference on Responsible Electronics and Circular Technologies)

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5 pages, 814 KB

Open AccessProceeding Paper

Operational Efficiency Underpinning Sustainable Nanofabrication

by Smaragda Lymperopoulou, Vasiliki Kontomitrou, George Stavrinidis, Antonios Stavrinidis, Athanasios Kostopoulos, George Konstantinidis and Loukas Michalas

Eng. Proc. 2026, 127(1), 21; https://doi.org/10.3390/engproc2026127021 - 20 May 2026

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Abstract

In light of sustainable development and the growing global emphasis on implementing green practices across all scientific sectors, the present work introduces a comprehensive framework with contemporary sustainability imperatives in nanofabrication cleanrooms. Recognizing the unique characteristics of cleanroom-based environments, which demand controlled conditions [...] Read more.

In light of sustainable development and the growing global emphasis on implementing green practices across all scientific sectors, the present work introduces a comprehensive framework with contemporary sustainability imperatives in nanofabrication cleanrooms. Recognizing the unique characteristics of cleanroom-based environments, which demand controlled conditions and strict procedures, the aim of the current work is to evaluate diverse nanofabrication scenarios with regard to their sustainability perspective with focus on operations at research- and pilot-line-level facilities. Full article

(This article belongs to the Proceedings of International Conference on Responsible Electronics and Circular Technologies)

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10 pages, 4037 KB

Open AccessProceeding Paper

Best Practices from the Competence Center for Resource-Conscious Information and Communication Technology—“Green ICT @ FMD”

by Manuel Thesen, Lotta Adu and Tuğana Aslan

Eng. Proc. 2026, 127(1), 22; https://doi.org/10.3390/engproc2026127022 - 20 May 2026

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Abstract

The “Green ICT @ FMD” competence center brings together the expertise in resource-efficient information and communications technology from 11 Fraunhofer and two Leibniz institutes, which have joined forces to form the Research Fab Microelectronics Germany (FMD). The competence center offers industry a broad [...] Read more.

The “Green ICT @ FMD” competence center brings together the expertise in resource-efficient information and communications technology from 11 Fraunhofer and two Leibniz institutes, which have joined forces to form the Research Fab Microelectronics Germany (FMD). The competence center offers industry a broad portfolio of services focused on the future development of ICT applications, infrastructures, and microelectronic components with a view on resource-efficient production, energy efficiency, and the reduction in greenhouse gas emissions. Various cooperation opportunities have been initiated to support a wide range of companies in responding to customer needs and regulatory requirements through innovative and resource-efficient ideas and developments. We now present the initial results from the success models of the “Green ICT Space” startup and SME program, as well as selected “Validation Projects” with companies that all pursue the common goal of more resource-efficient production and use of ICT. Full article

(This article belongs to the Proceedings of International Conference on Responsible Electronics and Circular Technologies)

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7 pages, 3880 KB

Open AccessProceeding Paper

Digital Twin-Driven Sustainability in Semiconductor Packaging

by Ahmed Ali, Rezvan Gharehbaghi and Jayakrishnan Chandrappan

Eng. Proc. 2026, 127(1), 23; https://doi.org/10.3390/engproc2026127023 - 20 May 2026

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Abstract

Digital twin technology is rapidly gaining traction in the semiconductor industry for its ability to model manufacturing processes, including packaging engineering, to monitor and optimise performance cost-effectively. This paper focuses on two key areas of development. The first part explores the potential of [...] Read more.

Digital twin technology is rapidly gaining traction in the semiconductor industry for its ability to model manufacturing processes, including packaging engineering, to monitor and optimise performance cost-effectively. This paper focuses on two key areas of development. The first part explores the potential of digital design and additive manufacturing to produce high-performance, compact thermal management solutions that significantly reduce device junction temperatures and enhance operational efficiency. The second part presents the development of surrogate models to predict junction temperatures of electronic packages under varying operating and geometrical conditions. These models, trained using deep learning, were integrated into a user-friendly COMSOL Multiphysics application builder version 6.3. The proposed digital twin framework enables fast and accurate full-thermal field predictions in comparison to conventional 3D finite element simulations. Full article

(This article belongs to the Proceedings of International Conference on Responsible Electronics and Circular Technologies)

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