Monocrystalline silicon is an excellent semiconductor material for integrated circuits. Its surface quality has an enormous effect on its service life. The surfaces are formed by ultra-precision machining using nano-grinding, one of the technologies...
The silica opticsare widely applied in the modern laser system, and its fabrication is always the research focus. In the manufacturing process, the lapping process occurs between grinding and final polishing. However, lapping processes optimizations...
In order to achieve accurate prediction of subsurface damage (SSD) in ultra-precision grinding of high-performance ultra-violet laser-irradiated fused silica optics, the paper combines damage precursor multimodal measurement technology with magnetorh...
During the grinding process of K9 glass, various forms of surface damage—such as indentations and pitting—as well as subsurface damage—including cracks and residual stress—are generated. This paper focuses on the planetary gri...
Mitigating the surface loss induced by subsurface damage is of critical importance in the manufacturing of fused silica devices with ultra-low mechanical loss. Chemical etching technology has been applied as an effective approach in controlling surfa...
In this work, a novel method is put forward to quantitatively simulate the subsurface damages microstructural alteration of titanium alloy components subjected to microscale cutting. A trans-scale numerical framework is conducted with the purpose of...
Subsurface damage (SSD) produced in a grinding process will affect the performance and operational duration of single-crystal silicon. In order to reduce the subsurface damage depth generated during the grinding process by adjusting the process param...
The interaction between adjacent asperities is a typical characteristic of the grinding process and plays an important role in the material removal mechanism. Therefore, in order to systematically investigate the formation mechanism of the subsurface...
Single-crystal 4H silicon carbide (4H-SiC) is a key substrate material for third-generation semiconductor devices, where surface and subsurface integrity critically affect performance and reliability. This study systematically examined the evolution...
Structures in their service life are often damaged as a result of aging or extreme events such as earthquakes or storms. It is essential to detect damage in a timely fashion to ensure the safe operation of the structure. If left unchecked, subsurface...
The qualitative measurement is a common practice in infrastructure condition inspection when using Infrared Thermography (IRT), as it can effectively locate the defected area non-destructively and non-contact. However, a quantitative evaluation becom...
Single sapphire crystals has been widely used in technology such as light emitting diodes, lasers, high-temperature and high-voltage devices, special windows, and optical systems, and grinding is an important process of their machining. In order to r...
Laser-induced damage on fused silica optics remains a major issue that limits the promotion of energy output of large laser systems. Subsurface impurity defects inevitably introduced in the practical polishing process incur strong thermal absorption...
Subsurface damage (SSD) in optical materials is easily induced during ultra-precision processes and plays a critical role in the surface performance and lifetime of optical materials. Without proper characterization of SSD in optical materials, it is...
Subsurface damages and surface roughness are two significant parameters which determine the performance of silicon carbide (SiC) ceramics. Subsurface damages (SSD) induced by conventional polishing could seriously affect the service life of the workp...
Subsurface damage (SSD), having a great impact on the laser-induced damage threshold (LIDT) of ultra-smooth optics applied in high-power laser systems, should be tightly controlled. An improved total internal reflection microscopy (TIRM), combined wi...
Subsurface damage (SSD) in the polishing process of silicon carbide (SiC) ceramic presents one of the most significant challenges for practical applications. In this study, the theoretical models of SSD depth are established on the basis of the mater...
This study extended a previously established intraoral scanning (IOS) and optical coherence tomography (OCT) dual-modality monitoring workflow for computer-aided design/computer-aided manufacturing (CAD/CAM) restorations to three additional crown mat...
In optical fabrication, brittle-hard materials are used for numerous applications. Especially for high-performance optics for laser or lithography applications, a complex and consistent production chain is necessary to account for the material proper...
In diamond wire saw cutting monocrystalline silicon (mono-Si), the material brittleness removal can cause microcrack damage in the subsurface of the as-sawn silicon wafer, which has a significant impact on the mechanical properties and subsequent pro...
Fused silica glass is a critical material in many industries due to its superior physicochemical properties. The detection of subsurface damage (SSD) poses fundamental challenges that directly affect the performance of fused silica glass. The polariz...
Ceramic waveguide components play a critical role in modern microwave semiconductor systems. For the first time, this work reports experimental results obtained when dielectric ceramics are abrasive-machined into waveguide components. This process wi...
Optical materials are widely used in large optical systems such as lithography machines and astronomical telescopes. However, optical materials inevitably produce subsurface damage (SSD) during lapping and polishing processes, degrading the laser dam...
Al-50 wt% Si alloy is widely used in aerospace and electronics but is hard to machine owing to uneven microstructure. To elucidate the relationship between force–thermal coupling effects and surface integrity during Al-50 wt% Si alloy milling,...
Optical components inevitably suffer subsurface damage (SSD) during grinding and lapping, and this SSD substantially degrades the performance of optical systems. Moreover, given the surface roughness of optical components after grinding or lapping, i...
This study investigates the material removal mechanism and the evolution of subsurface damage (SSD) in single-crystal silicon during ultra-precision machining using molecular dynamics (MD) simulations. A three-dimensional MD model was established by...
Silicon carbide (SiC) substrates have been widely adopted in high-performance applications such as power electronics, optoelectronics, and semiconductors. However, achieving high-quality processing remains a formidable challenge due to SiC’s in...
The study of the single-particle erosion mechanism is essential to understand the material removal mechanism in the non-contact polishing process and ultimately ensure the high-efficiency, non-damage, and ultra-smooth processing of optical glass. In...
Molecular dynamics simulations were performed to investigate the nanometric cutting of polycrystalline oxygen-free copper using a single-crystal diamond tool. The effects of grain size, tool geometry (rake angle and edge radius), cutting speed, and a...
The longitudinal seismic response characteristics of a shallow-buried water-conveyance tunnel under non-uniform longitudinal subsurface geometry and obliquely incident SV-waves was studied using the numerical method, where the effect of the non-unifo...
Co2+:MgAl2O4 crystals are successfully used as passive Q-switches within the cavity of erbium glass lasers. Their limited resistance to laser radiation might also put constraints on the generated output peak power. Usually, polishing of optical subst...
Fused silica is an important optical material with important applications, where the surface must be precisely machined without subsurface damage. In this study, multi-cyclic indentations under incremental loads were performed on fused silica using t...
The damaging of ZnSe crystal has a significant impact on its service performance and life. Based on the specific cutting energies for brittle and ductile mode machining, a model is proposed to evaluate the damage depth in the shoulder region of ZnSe...
The surface properties of fused silica (FS) change after H2O2 treatment, but the surface and subsurface damage behaviors and their mechanisms under various physical contact conditions have not been elucidated yet. This work investigated the effect of...
Single-crystal 4H-SiC, as a wide-bandgap semiconductor material, has become a key substrate for high-power electronics and radio frequency devices due to its outstanding characteristics such as high-voltage tolerance, high-temperature stability, high...
Zirconia-toughened alumina (ZTA) ceramics are promising for load-bearing biomedical applications because they combine the hardness, chemical stability, wear resistance, and biocompatibility of alumina with the transformation-toughening capability of...
Molecular dynamics (MD) simulation of nanoscratching with a spherical diamond abrasive was performed to investigate the role of water molecular film on the surface nanotribological characteristics and subsurface lattice damage of GaN (0001) at the at...
This study investigates nanoscale material removal behavior and its correlation with subsurface damage of (100)-oriented β-Ga2O3 subjected to single-point diamond scratching across a range of normal loads. Using multi-scale characterizations, we...
Cadmium telluride (CdTe) is known as an important semiconductor material with favorable physical properties. However, as a soft-brittle material, the fabrication of high-quality surfaces on CdTe is quite challenging. To improve the fundamental unders...
The grain size effect is an important factor in determining the material removal behavior of polycrystalline silicon (p-Si). In the present study, to improve the understanding of nanoscale machining of p-Si, we performed molecular dynamics simulation...
This study investigated the deformation behavior and damage evolution of AA7075-T6, Anodized AA6061-T6-T6 (oxide layer with an average thickness of 8.71 µm), and Al-15 vol.% SiC-T4 (particle size range of 3.1–8.3 µm) under scratch,...
Composite materials are widely utilized for their excellent properties; however, the mismatch in phase response during processing often induces surface and subsurface damage. While reducing the cutting depth is a common strategy to improve quality, i...
This study investigates the arc-induced degradation mechanisms of Ag–Ni (90/10) electrical contacts under controlled laboratory cycling conditions using a custom PLC-controlled switching system. The degradation process is characterized by three...
For the axisymmetric shell resonator gyroscopes, the quality factor (Q factor) of the resonator is one of the core parameters limiting their performances. Surface loss is one of the dominating losses, which is related to the subsurface damage (SSD) t...
Machining of brittle ceramics is a challenging task because the requirements on the cutting tools are extremely high and the quality of the machined surface strongly depends on the chosen process parameters. Typically, the efficiency of a machining p...
Due to its excellent high-temperature resistance and fatigue properties, 8Cr4Mo4V high-temperature bearing steel has become a critical material for aero-engine main shaft bearings. Consequently, the surface integrity of this material after grinding d...
Grinding at the nanometric level can be efficiently employed for the creation of surfaces with ultrahigh precision by removing a few atomic layers from the substrate. However, since measurements at this level are rather difficult, numerical investiga...
Lithium niobate (LiNbO3, LN) single crystal is widely used in optoelectronic fields due to its excellent performance. However, its low hardness, high brittleness, and strong anisotropy lead to low processing efficiency and poor surface quality. Hydro...
Aluminum optics are widely used in modern optical systems because of their high specific stiffness and high reflectance. With the applied optical frequency band moving to visible, traditional processing technology cannot meet the processing precision...
The campus of the Karlsruhe Institute of Technology (KIT) contains several waste heat streams. In an effort to reduce greenhouse gas emissions by optimizing thermal power consumption on the campus, researchers at the KIT are proposing a ‘DeepStor’ pr...
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