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Ultra-Precision Surface Abrasive Micro-Machining: Advances and Applications

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A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E：Engineering and Technology".

Deadline for manuscript submissions: 31 December 2025 | Viewed by 4811

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Special Issue Editors

Prof. Dr. Fengjun Chen

E-Mail Website1 Website2
Guest Editor

1. School of Intelligent Manufacturing and Electronic Engineering, Wenzhou University of Technology, Wenzhou 325035, China
2. College of Mechanical and Vehicle Engineering, Hunan University, Changsha 410082, China
3. National Engineering Research Center for High Efficiency Grinding, Hunan University, Changsha 410082, China
Interests: ultra-precision abrasive machining; grinding; lapping; polishing; intelligent automated manufacturing

Prof. Dr. Jianguo Zhang

E-Mail Website
Guest Editor

School of Mechanical Science & Engineering, Huazhong University of Science and Technology, Wuhan 430074, China
Interests: ultra-precision machining of difficult-to-machine materials; elliptical vibration diamond cutting and ultra-precision micro-manufacturing of functional micro–nano structures
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Special Issue Information

Dear Colleagues,

Ultra-precision abrasive micro-machining plays a pivotal role in manufacturing high-performance components with sub-micron accuracy and nanoscale surface finishes. This Special Issue aims to highlight cutting-edge research on abrasive-based surface finishing technologies, including grinding, lapping, finishing, polishing, and hybrid processes, for applications in optics, semiconductors, aerospace, biomedical devices, and advanced manufacturing. We invite the submission of original research articles and reviews covering (but not limited to) the following topics:

1) advanced abrasive machining technologies: ultra-precision grinding (ductile-mode grinding, ELID grinding), lapping and free abrasive machining, chemical–mechanical polishing (CMP) and magnetorheological finishing (MRF), laser-assisted abrasive machining, and atomic-scale and close-to-atomic-scale machining (CASM);
2) process mechanics and modeling: material removal mechanisms in abrasive micro-machining, surface/subsurface damage prediction and control, and the use of machine learning and AI for process optimization;
3) novel abrasives and tooling: super-abrasives (diamonds, CBN) and structured grinding wheels, Soft abrasive techniques for brittle materials, and nanocomposite abrasives and smart polishing slurries;
4) industrial applications: optics and photonics (e.g., lenses, mirrors), additive manufacturing post-processing, and medical and precision engineering components.

Prof. Dr. Fengjun Chen
Prof. Dr. Jianguo Zhang
Guest Editors

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Keywords

abrasive
polishing
finishing
grinding

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Published Papers (9 papers)

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Research

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12 pages, 2886 KB

Open AccessArticle

Atomic-Scale Revelation of Voltage-Modulated Electrochemical Corrosion Mechanism in 4H-SiC Substrate

by Qiufa Luo, Dianlong Lin, Jing Lu, Congming Ke, Zige Tian, Feng Jiang, Jianhui Zhu and Hui Huang

Micromachines 2025, 16(10), 1129; https://doi.org/10.3390/mi16101129 - 30 Sep 2025

Viewed by 340

Abstract

Electrochemical mechanical polishing is a critical technology for improving the surface quality of silicon carbide (SiC) substrates. However, the fundamental electrochemical corrosion mechanism of the SiC substrate remains incompletely understood. In this study, the electrochemical corrosion behavior of the SiC substrate is explored through comprehensive experiments and molecular dynamics simulations. Key findings demonstrated that the 4H-0° SiC exhibited the highest corrosion rate in a 0.6 mol/L NaCl electrolyte. The corrosion rate increased as the voltage rose within the range of 2 to 20 V. When the voltage was between 20 and 25 V, the system entered the stable passivation region, while when the voltage was 25 to 30 V, partial dissolution of the surface oxide layer occurred. Molecular dynamics simulations further revealed that both amorphization degree and reaction depth on the SiC surface showed a decreasing trend at elevated voltages, suggesting a corresponding reduction in the corrosion rate when the voltage exceeded the optimal range. OH⁻, O²⁻, and •OH generated by the electrolysis of water during electrochemical corrosion would rapidly react with the surface of the SiC anode, and subsequently form a SiO₂ modified layer. Moreover, these atomistic insights establish a scientific foundation for achieving superior surface integrity in large-diameter SiC substrates through optimized electrochemical mechanical polishing processes. Full article

(This article belongs to the Special Issue Ultra-Precision Surface Abrasive Micro-Machining: Advances and Applications)

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21 pages, 6905 KB

Open AccessArticle

Simulation and Experimental Study on Abrasive–Tool Interaction in Drag Finishing Edge Preparation

by Julong Yuan, Yuhong Yan, Youzhi Fu, Li Zhou and Xu Wang

Micromachines 2025, 16(10), 1113; https://doi.org/10.3390/mi16101113 - 29 Sep 2025

Viewed by 596

Abstract

Tool edge preparation is the process aimed at eliminating edge defects and optimizing the micro-geometric parameters of cutting tools. Drag finishing, the primary engineering method, subjects tools to planetary motion (simultaneous revolution and rotation) within abrasive media to remove burrs and micro-chips, thereby improving cutting performance and extending tool life. A discrete element method (DEM) model of drag finishing edge preparation was developed to investigate the effects of processing time, tool rotational speed, and rotation direction on abrasive-mediated tool wear behavior. The model was validated through milling cutter edge preparation experiments. Simulation results show that increasing the processing time causes fluctuating changes in average abrasive velocity and contact forces, while cumulative energy and tool wear increase progressively. Elevating tool rotational speed increases average abrasive velocity, contact forces, cumulative energy, and tool wear. Rotation direction significantly impacts tool wear: after 2 s of clockwise (CW) rotation, wear reached 1.45 × 10⁻⁸ mm; after 1 s of CW followed by 1 s of counterclockwise (CCW) rotation, wear was 1.25 × 10⁻⁸ mm; and after 2 s of CCW rotation, wear decreased to 1.02 × 10⁻⁸ mm. Experiments, designed based on simulation trends, confirm that edge radius increases with time and tool rotational speed. After 30 min of processing at 60, 90, and 120 rpm, average edge radius increased to 22.5 μm, 28 μm, and 30 μm, respectively. CW rotation increased the edge shape factor K, while CCW rotation decreased it. The close agreement between experimental and simulation results confirms the model’s effectiveness in predicting the impact of edge preparation parameters on tool geometry. Rotational speed control optimizes edge preparation efficiency, the predominant tangential cumulative energy reveals abrasive wear as the primary material removal mechanism, and rotation direction modulates the shape factor K, enabling symmetric edge preparation. Full article

(This article belongs to the Special Issue Ultra-Precision Surface Abrasive Micro-Machining: Advances and Applications)

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18 pages, 4236 KB

Open AccessArticle

End Surface Grinding Machinability of Zirconia Ceramics via Longitudinal–Torsional Coupled Vibration Rotary Ultrasonic Machining

by Fan Chen, Wenbo Bie, Kuohu Li and Xiaosan Ma

Micromachines 2025, 16(9), 1065; https://doi.org/10.3390/mi16091065 - 21 Sep 2025

Viewed by 641

Abstract

Zirconia (ZrO₂) ceramics are advanced structural materials that exhibit exceptional performance in aerospace and other heavy-duty applications. Since conventional machining of ZrO₂ ceramics presents significant challenges, this study employs the longitudinal–torsional coupled rotary ultrasonic machining (LTC-RUM) method for end surface grinding of ZrO₂ ceramics. To elucidate the material removal mechanism of LTC-RUM, an analysis was conducted from the perspective of individual abrasive grains. Subsequently, LTC-RUM experiments were carried out on ZrO₂ ceramic samples to investigate the effects of processing parameters on cutting force, surface roughness, and surface morphology. The results show that cutting force decreases with lower spindle speed and ultrasonic power, but increases with higher feed rate and cutting depth. The surface roughness decreases with increasing spindle speed, yet increases with feed rate. Moreover, the surface roughness initially decreases and then increases with increasing ultrasonic power and cutting depth. Compared to conventional machining methods, LTC-RUM significantly reduces cutting force and surface roughness, thereby improving workpiece surface quality. This study provides valuable insights into the application of LTC-RUM for machining ZrO₂ ceramics and other hard and brittle materials. Full article

(This article belongs to the Special Issue Ultra-Precision Surface Abrasive Micro-Machining: Advances and Applications)

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15 pages, 9265 KB

Open AccessArticle

On-Machine Precision Truing and Error Compensation of Cup-Shaped Diamond Grinding Wheels with Arc-Shaped Cutting Edge

by Yawen Guo and Ziqiang Yin

Micromachines 2025, 16(9), 1050; https://doi.org/10.3390/mi16091050 - 15 Sep 2025

Viewed by 473

Abstract

The cup-shaped grinding wheels with arc-shaped edges provide a satisfactory precision grinding solution for high-accuracy optical surfaces on hard and brittle materials. However, the complex profile of the arc-shaped edges of cup-shaped grinding wheels makes them challenging to truing. This paper proposes an on-machine truing technique targeting cup-shaped grinding wheels with arc-shaped cutting edge. First, a mathematical model was established to simulate the three-axis of on-machine truing the arc-shaped cutting edge using a diamond roller. Based on this model, a theoretical analysis is conducted to investigate the impact of tool setting errors, measurement errors of the diamond roller, and the pose error on truing accuracy. A compensation method was proposed, and experimental results validated its effectiveness. To investigate the grinding performance of cup-shaped grinding wheels after truing, a complex component is ground using a truing diamond grinding wheel. The experimental results demonstrate that this method enables precise on-machine truing of the arc-shaped edges of cup-shaped grinding wheels and is efficient. The average dimensional accuracy of the grinding wheel’s arc-shaped edge is reduced to 1.5 μm, with the profile accuracy (PV) of 0.89 μm. Full article

(This article belongs to the Special Issue Ultra-Precision Surface Abrasive Micro-Machining: Advances and Applications)

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12 pages, 2523 KB

Open AccessArticle

Lightweight Design Method for Micromanufacturing Systems Based on Multi-Objective Optimization

by Shan Li and Seyed Hamed Hashemi Sohi

Micromachines 2025, 16(9), 1032; https://doi.org/10.3390/mi16091032 - 9 Sep 2025

Viewed by 461

Abstract

This study proposes a multi-stage collaborative design framework integrating sensitivity analysis, response surface methodology (RSM), and topology optimization for synergistic lightweighting and performance enhancement of micromanufacturing systems using ultra-precision computer numerical control (CNC) machine tools. Overall sensitivity analysis identified the base and column as stiffness-critical components, while the spindle box exhibited significant weight-reduction potential. Using spindle box wall and bottom thickness as variables, RSM models for mass and stress were constructed. Multi-objective optimization via a genetic clustering algorithm achieved a 57.2% (590 kg) weight reduction under stress constraints (<45 MPa). Subsequent variable-density topology optimization (SIMP model) reconfigured the rib layouts of the base and column under volume constraints, reducing their weights by 38.5% (2844 kg) and 41.5% (1292 kg), respectively. Whole-machine validation showed that maximum static deformation decreased from 0.17 mm to 0.09 mm, maximum stress reduced from 58 MPa to 35 MPa, and first-order natural frequency increased from 50.68 Hz to 84.08 Hz, significantly enhancing dynamic stiffness. Cumulative weight reduction exceeded 3000 kg, achieving a balance between lightweighting and static/dynamic performance improvement. This work provides an effective engineering pathway for a structural design of high-end micromanufacturing systems. Full article

(This article belongs to the Special Issue Ultra-Precision Surface Abrasive Micro-Machining: Advances and Applications)

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14 pages, 19891 KB

Open AccessArticle

Investigating Surface Morphology and Subsurface Damage Evolution in Nanoscratching of Single-Crystal 4H-SiC

by Jianpu Xi, Xinxing Ban, Zhen Hui, Wenlan Ba, Lijuan Deng and Hui Qiu

Micromachines 2025, 16(8), 935; https://doi.org/10.3390/mi16080935 - 14 Aug 2025

Viewed by 830

Abstract

Single-crystal 4H silicon carbide (4H-SiC) is a key substrate material for third-generation semiconductor devices, where surface and subsurface integrity critically affect performance and reliability. This study systematically examined the evolution of surface morphology and subsurface damage (SSD) during nanoscratching of 4H-SiC under varying normal loads (0–100 mN) using a nanoindenter equipped with a diamond Berkovich tip. Scratch characteristics were assessed using scanning electron microscopy (SEM), while cross-sectional SSD was characterised via focused ion beam (FIB) slicing and transmission electron microscopy (TEM). The results revealed three distinct material removal regimes: ductile removal below 14.5 mN, a brittle-to-ductile transition between 14.5–59.3 mN, and brittle removal above 59.3 mN. Notably, substantial subsurface damage—including median cracks exceeding 4 μm and dislocation clusters—was observed even within the transition zone where the surface appeared smooth. A thin amorphous layer at the indenter-substrate interface suppressed immediate surface defects but promoted subsurface damage nucleation. Crack propagation followed slip lines or their intersections, demonstrating sensitivity to local stress states. These findings offer important insights into nanoscale damage mechanisms, which are essential for optimizing precision machining processes to minimise SSD in SiC substrates. Full article

(This article belongs to the Special Issue Ultra-Precision Surface Abrasive Micro-Machining: Advances and Applications)

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14 pages, 7197 KB

Open AccessArticle

Study on Self-Sharpening Mechanism and Polishing Performance of Triethylamine Alcohol on Gel Polishing Discs

by Yang Lei, Lanxing Xu and Kaiping Feng

Micromachines 2025, 16(7), 816; https://doi.org/10.3390/mi16070816 - 16 Jul 2025

Viewed by 406

Abstract

To address the issue of surface glazing that occurs during prolonged polishing with gel tools, this study employs a triethanolamine (TEA)-based polishing fluid system to enhance the self-sharpening capability of the gel polishing disc. The inhibitory mechanism of TEA concentration on disc glazing is systematically analyzed, along with its impact on the gel disc’s frictional wear behaviour. Furthermore, the synergistic effects of process parameters on both surface quality and material removal rate (MRR) of SiC are examined. The results demonstrate that TEA concentration is a critical factor in regulating polishing performance. At an optimal concentration of 4 wt%, an ideal balance between chemical chelation and mechanical wear is achieved, effectively preventing glazing while avoiding excessive tool wear, thereby ensuring sustained self-sharpening capability and process stability. Through orthogonal experiment optimization, the best parameter combination for SiC polishing is determined: 4 wt% TEA concentration, 98 N polishing pressure, and 90 rpm rotational speed. This configuration delivers both superior surface quality and desirable MRR. Experimental data confirm that TEA significantly enhances the self-sharpening performance of gel discs through its unique complex reaction. During the rough polishing stage, the MRR increases by 34.9% to 0.85 μm/h, while the surface roughness S_a is reduced by 51.3% to 6.29 nm. After subsequent CMP fine polishing, an ultra-smooth surface with a final roughness of 2.33 nm is achieved. Full article

(This article belongs to the Special Issue Ultra-Precision Surface Abrasive Micro-Machining: Advances and Applications)

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20 pages, 5119 KB

Open AccessArticle

Research on Rotary Magnetorheological Finishing of the Inner Surface of Stainless Steel Slender Tubes

by Zhaoyang Luo, Chunya Wu, Ziyuan Jin, Bing Guo, Shengdong Gao, Kailei Luo, Huiyong Liu and Mingjun Chen

Micromachines 2025, 16(7), 763; https://doi.org/10.3390/mi16070763 - 29 Jun 2025

Viewed by 558

Abstract

316L stainless steel slender tubes with smooth inner surfaces play an important role in fields such as aerospace and medical testing. In order to solve the challenge of difficult machining of their inner surfaces, this paper introduces a novel rotary magnetorheological finishing (RMRF) method specifically designed for processing the inner surfaces of slender tubes. This method does not require frequent replacement of the polishing medium during the processing, which helps to simplify the processing technology. By combining the rotational motion of a magnetic field with the linear reciprocating movement of the workpiece, uniform material removal on the inner surfaces of 316L stainless steel tubes was achieved. Initially, a finite element model coupling the magnetic and flow fields was developed to investigate the flow behavior of the MPF under a rotating magnetic field, to examine the theoretical feasibility of the proposed polishing principle. Subsequently, experimental validation was performed using a custom-designed polishing apparatus. Through processing experiments, with surface quality designated as the index, the influences of key parameters such as the volume content and sizes of carbonyl iron particles and abrasive particles in the MPF were comprehensively evaluated, and the composition and ratio of the MPF were optimized. Based on the optimized formulation, the optimal processing time was established, reducing the inner surface roughness from an initial Sa of approximately 320 nm to 28 nm, and effectively eliminating the original defects. Full article

(This article belongs to the Special Issue Ultra-Precision Surface Abrasive Micro-Machining: Advances and Applications)

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Review

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26 pages, 4669 KB

Open AccessReview

Recent Advances in Precision Diamond Wheel Dicing Technology

by Fengjun Chen, Meiling Du, Ming Feng, Rui Bao, Lu Jing, Qiu Hong, Linwei Xiao and Jian Liu

Micromachines 2025, 16(10), 1188; https://doi.org/10.3390/mi16101188 (registering DOI) - 21 Oct 2025

Abstract

Precision dicing with diamond wheels is a key technology in semiconductor dicing, integrated circuit manufacturing, aerospace, and other fields, owing to its high precision, high efficiency, and broad material applicability. As a critical processing stage, a comprehensive analysis of dicing technologies is essential for improving the machining quality of hard-and-brittle optoelectronic materials. This paper reviews the core principles of precision diamond wheel dicing, including dicing processes and blade preparation methods. Specifically, it examines the dicing mechanisms of composite and multi-mode dicing processes, demonstrating their efficacy in reducing defects inherent to single-mode approaches. The review also examines diverse preparation methods for dicing blades, such as metal binder sintering and roll forming. Furthermore, the roles of machine vision and servo control systems are detailed, illustrating how advanced algorithms facilitate precise feature recognition and scribe line control. A systematic analysis of key components in grinding wheel dicer is also conducted to reduce dicing deviation. Additionally, the review introduces models for tool wear detection and discusses material removal mechanisms. The influence of critical process parameters—such as spindle speed, feed rate, and dicing depth—on dicing quality and kerf width is also analyzed. Finally, the paper outlines future prospects and provides recommendations for advancing key technologies in precision dicing, offering a valuable reference for subsequent research. Full article

(This article belongs to the Special Issue Ultra-Precision Surface Abrasive Micro-Machining: Advances and Applications)

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