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Micromachines
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Research Progress of Ultra-Precision Micro-Nano Machining, Second Edition
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Research Progress of Ultra-Precision Micro-Nano Machining, Second Edition

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".

Deadline for manuscript submissions: 31 August 2026 | Viewed by 2327

Special Issue Editors

Dr. Huaizhong Li

E-Mail Website
Guest Editor
School of Engineering and Built Environment, Griffith University, Southport, QLD 4222, Australia
Interests: advanced manufacturing technologies; micromachining; machine dynamics; vibration monitoring and control; mechatronics
Special Issues, Collections and Topics in MDPI journals
Dr. Xiubing Jing

E-Mail Website
Guest Editor
School of Mechanical Engineering, Tianjin University, Tianjin, China
Interests: mechanical dynamics; surface engineering; micro/meso-scale manufacturing technology
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

This Special Issue aims to showcase the latest research advancements and developments in the field of ultra-precision micro-nano machining. It will gather and disseminate recent research results, novel concepts, and cutting-edge technologies in this field. Micro-nano machining is an interdisciplinary research area that encompasses various fields such as engineering, materials science, physics, and chemistry. It plays a crucial role in the fabrication of advanced devices, structures, and components with high precision and accuracy. This Special Issue invites original research articles, review papers, and technical notes that cover various aspects of ultra-precision micro-nano machining, including but not limited to:

  • Fundamental theories of ultra-precision micro-nano machining;
  • Advances in micro/nano fabrication techniques;
  • Process modeling and simulation in micro/nano machining;
  • Precision measurement and metrology in micro/nano machining;
  • Surface quality and tribology in micro/nano machining;
  • Micro-nano manufacturing process optimization and control;
  • Tool condition monitoring and chatter suppression in micro/nano machining;
  • Multi-scale and multi-process integration in micro/nano machining;
  • Innovative applications of micro/nano machining in industry and academia;
  • New materials and surface treatments for micro/nano machining;
  • Challenges and opportunities in micro/nano machining for future developments.

The Special Issue welcomes original research papers, review articles, and communications on the topics of interest. All submitted papers will undergo a rigorous peer-review process to ensure the quality and novelty of the work.

We look forward to receiving your contributions.

Dr. Huaizhong Li
Dr. Xiubing Jing
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • ultra-precision machining
  • micro-nano machining
  • micro-nano chip formation
  • process modeling and simulation
  • process automation and optimization

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Related Special Issue

Published Papers (4 papers)

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Research

17 pages, 2368 KB  
Article
An Ultrasonic Micro-Tool Assisted Platform for Post-Processing of Micrometer-Scale Copper Wires
by Xu Wang, Zhiwei Xu, Chengjia Zhu, Tian Zhang, Qiang Tang, Junchao Zhang and Yinlong Zhu
Micromachines 2026, 17(4), 411; https://doi.org/10.3390/mi17040411 - 27 Mar 2026
Viewed by 306
Abstract
Acoustic microactuation technology has emerged as an effective approach for fabrication of micro- and nanoscale objects, enabling precise processing and shaping control of microscale materials by efficiently transmitting ultrasonic vibration energy and focusing energy locally. In this work, the proposed platform is regarded [...] Read more.
Acoustic microactuation technology has emerged as an effective approach for fabrication of micro- and nanoscale objects, enabling precise processing and shaping control of microscale materials by efficiently transmitting ultrasonic vibration energy and focusing energy locally. In this work, the proposed platform is regarded as an acoustically driven micromachine, in which ultrasonic excitation acts as the primary microactuation mechanism. Micrometer-scale copper wires are widely used in microelectronics and precision manufacturing. However, their small dimensions and low rigidity make fixation and forming particularly challenging. To achieve controllable forming of fine copper wires, this study introduces an ultrasonic vibration energy-focusing principle and investigates an ultrasonic post-processing method tailored for such materials, with the aim of enhancing processing stability and forming accuracy. An ultrasonic processing experimental platform for copper wires was established, and multiple micro-tool designs—including glass fiber, 304 stainless steel wire with support, and elastic hard 304 stainless steel—were evaluated. Single-point and continuous processing experiments were conducted by varying micro-tool materials and support configurations, and the influence of feed speed on processing width and depth was systematically analyzed. The results indicate that a hard 304 stainless steel micro-tool supported by a hard plastic ring provides the best overall performance. Feed speed has a significant effect on processing depth, with a maximum average depth of approximately 0.95 μm achieved at a feed speed of 1 mm/min. These findings demonstrate the feasibility of ultrasonic processing for the effective forming of fine copper wires and confirm that appropriate micro-tool design and feed speed are critical for achieving stable and reliable processing results. The proposed system employs an ultrasonically actuated micro-tool to perform post-processing on micrometer-scale copper wires. The ultrasonic vibration serves as a microactuation mechanism that enhances local deformation and material response during micro-machining. Full article
(This article belongs to the Special Issue Research Progress of Ultra-Precision Micro-Nano Machining, Second Edition)
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11 pages, 2304 KB  
Article
Fabrication of Terahertz Fresnel Zone Plates via Ultraprecision Mechanical Processing
by Meng Chen, Jinshi Wang and Fengzhou Fang
Micromachines 2026, 17(3), 368; https://doi.org/10.3390/mi17030368 - 19 Mar 2026
Viewed by 285
Abstract
This study proposes a new fabrication process for terahertz Fresnel zone plates on high-resistivity silicon substrates. It involves ion implantation surface modification, ultra-precision diamond turning, and magnetron sputtering, followed by polishing. Ductile-regime cutting is used to form smooth microgrooves, which are selectively metallized [...] Read more.
This study proposes a new fabrication process for terahertz Fresnel zone plates on high-resistivity silicon substrates. It involves ion implantation surface modification, ultra-precision diamond turning, and magnetron sputtering, followed by polishing. Ductile-regime cutting is used to form smooth microgrooves, which are selectively metallized to create alternating opaque and transparent zones for terahertz waves. Finite-element simulations are performed to design the zone structure and to evaluate the effect of process-induced radius errors. A 3 μm amorphous layer is formed via ion implantation, which significantly enhances the ductile-to-brittle transition depth of silicon from 55 nm to about 535 nm while causing only minor changes in terahertz transmittance. The results demonstrate that the proposed method can produce high-quality Fresnel zone plates on silicon and offers a practical route to compact diffractive terahertz components. Full article
(This article belongs to the Special Issue Research Progress of Ultra-Precision Micro-Nano Machining, Second Edition)
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10 pages, 1734 KB  
Article
An Artificial Synaptic Device Based on InSe/Charge Trapping Layer/h-BN Heterojunction with Controllable Charge Trapping via Oxygen Plasma Treatment
by Qinghui Wang, Jiayong Wang, Manjun Lu, Tieying Ma and Jia Li
Micromachines 2025, 16(12), 1422; https://doi.org/10.3390/mi16121422 - 18 Dec 2025
Viewed by 532
Abstract
Neuromorphic computing, an emerging computational paradigm, aims to overcome the bottlenecks of the traditional von Neumann architecture. Two-dimensional materials serve as ideal platforms for constructing artificial synaptic devices, yet existing devices based on these materials face challenges such as insufficient stability. Indium selenide [...] Read more.
Neuromorphic computing, an emerging computational paradigm, aims to overcome the bottlenecks of the traditional von Neumann architecture. Two-dimensional materials serve as ideal platforms for constructing artificial synaptic devices, yet existing devices based on these materials face challenges such as insufficient stability. Indium selenide (InSe), a two-dimensional semiconductor with unique properties, demonstrates significant potential in the field of neuromorphic devices, though its application research remains in the initial stage. This study presents an artificial synaptic device based on the InSe/Charge Trapping Layer (CTL)/h-BN heterojunction. By applying oxygen plasma treatment to h-BN to form a controllable charge-trapping layer, efficient regulation of carriers in the InSe channel is achieved. The device successfully emulates fundamental synaptic behaviors including paired-pulse facilitation and long-term potentiation/inhibition, exhibiting excellent reproducibility and stability. Through investigating the influence of electrical pulse parameters on synaptic weights, a structure–activity relationship between device performance and structural parameters is established. Experimental results show that the device features outstanding linearity and symmetry, realizing the simulation of key synaptic behaviors such as dynamic conversion between short-term and long-term plasticity. It possesses a high dynamic range ratio of 7.12 and robust multi-level conductance tuning capability, with stability verified through 64 pulse cycle tests. This research provides experimental evidence for understanding interfacial charge storage mechanisms, paves the way for developing high-performance neuromorphic computing devices, and holds broad application prospects in brain-inspired computing and artificial intelligence hardware. Full article
(This article belongs to the Special Issue Research Progress of Ultra-Precision Micro-Nano Machining, Second Edition)
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29 pages, 5132 KB  
Article
Mechanism of a Composite Energy Field for Inhibiting Damage in High-Silicon Aluminum Alloy During Micro-Turning
by Jiaxin Zhao, Yan Gu, Yamei Liu, Lingling Han, Bin Fu, Xiaoming Zhang, Shuai Li, Jinlong Chen and Hongxin Guo
Micromachines 2025, 16(11), 1263; https://doi.org/10.3390/mi16111263 - 7 Nov 2025
Viewed by 693
Abstract
Composite materials are widely utilized for their excellent properties; however, the mismatch in phase response during processing often induces surface and subsurface damage. While reducing the cutting depth is a common strategy to improve quality, it shifts the material removal mechanism from shear [...] Read more.
Composite materials are widely utilized for their excellent properties; however, the mismatch in phase response during processing often induces surface and subsurface damage. While reducing the cutting depth is a common strategy to improve quality, it shifts the material removal mechanism from shear to ploughing–extrusion, which can, in fact, degrade the final surface integrity. Energy field assistance is a promising approach to suppress this issue, yet its underlying mechanism remains insufficiently understood. This study investigates high-silicon aluminum alloy by combining turning experiments with molecular dynamics simulations to elucidate the origin and evolution of damage under different energy fields, establishing a correlation between microscopic processes and observable defects. In conventional turning, damage propagation is driven by particle accumulation and dislocation interlocking. Ultrasonic vibration softens the material and confines plastic deformation to the near-surface region, although excessively high transient peaks can lead to process instability. Laser remelting turning disperses stress within the remelted layer, significantly inhibiting defect expansion, but its effectiveness is highly sensitive to variations in cutting depth. The hybrid approach, laser remelting ultrasonic vibration turning, leverages the dispersion buffering effect of the remelted layer and the localized plastic deformation from ultrasonication to reduce peak loads, control deformation depth, and suppress defects, while simultaneously mitigating the depth sensitivity of damage and maintaining removal efficiency. This work clarifies the mechanism by which a composite energy field controls damage in the micro-cutting of high-silicon aluminum alloy, providing practical guidance for the high-quality machining of composite materials. Full article
(This article belongs to the Special Issue Research Progress of Ultra-Precision Micro-Nano Machining, Second Edition)
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