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Micromachines
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Research Progress of Ultra-Precision Micro-Nano Machining, Second Edition
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Research Progress of Ultra-Precision Micro-Nano Machining, Second Edition

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".

Deadline for manuscript submissions: 31 December 2025 | Viewed by 630

Special Issue Editors

Dr. Huaizhong Li

E-Mail Website
Guest Editor
School of Engineering and Built Environment, Griffith University, Southport, QLD 4222, Australia
Interests: advanced manufacturing technologies; micromachining; machine dynamics; vibration monitoring and control; mechatronics
Special Issues, Collections and Topics in MDPI journals
Dr. Xiubing Jing

E-Mail Website
Guest Editor
School of Mechanical Engineering, Tianjin University, Tianjin, China
Interests: mechanical dynamics; surface engineering; micro/meso-scale manufacturing technology
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

This Special Issue aims to showcase the latest research advancements and developments in the field of ultra-precision micro-nano machining. It will gather and disseminate recent research results, novel concepts, and cutting-edge technologies in this field. Micro-nano machining is an interdisciplinary research area that encompasses various fields such as engineering, materials science, physics, and chemistry. It plays a crucial role in the fabrication of advanced devices, structures, and components with high precision and accuracy. This Special Issue invites original research articles, review papers, and technical notes that cover various aspects of ultra-precision micro-nano machining, including but not limited to:

  • Fundamental theories of ultra-precision micro-nano machining;
  • Advances in micro/nano fabrication techniques;
  • Process modeling and simulation in micro/nano machining;
  • Precision measurement and metrology in micro/nano machining;
  • Surface quality and tribology in micro/nano machining;
  • Micro-nano manufacturing process optimization and control;
  • Tool condition monitoring and chatter suppression in micro/nano machining;
  • Multi-scale and multi-process integration in micro/nano machining;
  • Innovative applications of micro/nano machining in industry and academia;
  • New materials and surface treatments for micro/nano machining;
  • Challenges and opportunities in micro/nano machining for future developments.

The Special Issue welcomes original research papers, review articles, and communications on the topics of interest. All submitted papers will undergo a rigorous peer-review process to ensure the quality and novelty of the work.

We look forward to receiving your contributions.

Dr. Huaizhong Li
Dr. Xiubing Jing
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • ultra-precision machining
  • micro-nano machining
  • micro-nano chip formation
  • process modeling and simulation
  • process automation and optimization

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Published Papers (1 paper)

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Research

29 pages, 5132 KB  
Article
Mechanism of a Composite Energy Field for Inhibiting Damage in High-Silicon Aluminum Alloy During Micro-Turning
by Jiaxin Zhao, Yan Gu, Yamei Liu, Lingling Han, Bin Fu, Xiaoming Zhang, Shuai Li, Jinlong Chen and Hongxin Guo
Micromachines 2025, 16(11), 1263; https://doi.org/10.3390/mi16111263 - 7 Nov 2025
Viewed by 383
Abstract
Composite materials are widely utilized for their excellent properties; however, the mismatch in phase response during processing often induces surface and subsurface damage. While reducing the cutting depth is a common strategy to improve quality, it shifts the material removal mechanism from shear [...] Read more.
Composite materials are widely utilized for their excellent properties; however, the mismatch in phase response during processing often induces surface and subsurface damage. While reducing the cutting depth is a common strategy to improve quality, it shifts the material removal mechanism from shear to ploughing–extrusion, which can, in fact, degrade the final surface integrity. Energy field assistance is a promising approach to suppress this issue, yet its underlying mechanism remains insufficiently understood. This study investigates high-silicon aluminum alloy by combining turning experiments with molecular dynamics simulations to elucidate the origin and evolution of damage under different energy fields, establishing a correlation between microscopic processes and observable defects. In conventional turning, damage propagation is driven by particle accumulation and dislocation interlocking. Ultrasonic vibration softens the material and confines plastic deformation to the near-surface region, although excessively high transient peaks can lead to process instability. Laser remelting turning disperses stress within the remelted layer, significantly inhibiting defect expansion, but its effectiveness is highly sensitive to variations in cutting depth. The hybrid approach, laser remelting ultrasonic vibration turning, leverages the dispersion buffering effect of the remelted layer and the localized plastic deformation from ultrasonication to reduce peak loads, control deformation depth, and suppress defects, while simultaneously mitigating the depth sensitivity of damage and maintaining removal efficiency. This work clarifies the mechanism by which a composite energy field controls damage in the micro-cutting of high-silicon aluminum alloy, providing practical guidance for the high-quality machining of composite materials. Full article
(This article belongs to the Special Issue Research Progress of Ultra-Precision Micro-Nano Machining, Second Edition)
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