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Advanced Abrasive Processing Technology and Applications (Second Edition)

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Manufacturing Processes and Systems".

Deadline for manuscript submissions: 20 November 2025 | Viewed by 80

Special Issue Editor


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Guest Editor
School of Mechanical Engineering, Shandong University, Jinan 250061, China
Interests: precision and ultra-precision abrasive machining; diamond wire saw slicing technology; semiconductor abrasive processing
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Special Issue Information

Dear Colleagues,

Abrasive processing technology has been widely used in manufacturing many mission-critical components for various industrial areas, such as semiconductor chips, PV silicon solar cells, advanced optics, aerospace, automotive, telecommunications, etc. Most materials used in these fields, such as semiconductors, laser crystals, engineering ceramics, optical glass, superalloys, composite materials, etc., are difficult to process. The increasing degree of high-precision and high-efficiency requirements and the difficult-to-machine characteristic of advanced materials lead to numerous research challenges in different fields of abrasive processing technology, such as novel machining processes, processing mechanics, surface generation mechanisms, novel machine design, advanced sensing, machine metrology, machining process modeling and simulation, process monitoring, etc.

The second edition of this Special Issue aims to summarize updates on the research of advanced abrasive processing technology and applications. The scope of this Special Issue includes, but is not limited to:

  • Precision and ultra-precision abrasive machining technology in semiconductor, optical, photovoltaic and other fields;
  • Basic theory of abrasive machining, such as sawing, grinding, lapping, etc.;
  • Modeling, simulation, and optimization of the abrasive machining process;
  • High-speed and efficient abrasive processing technology;
  • Multi-energy-field-assisted composite abrasive machining technology;
  • Grinding technology for new materials;
  • Surface integrity of abrasive machining and its detection and control technology;
  • Abrasive processing tools and equipment;
  • Intelligent manufacturing technology and equipment for abrasive processing;
  • Other related processing technologies.

We sincerely invite you to contribute research articles, reviews, and communications to this Special Issue.

Dr. Yufei Gao
Guest Editor

Manuscript Submission Information

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Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • precision/ultra-precision abrasive machining
  • sawing
  • grinding
  • lapping
  • material removal mechanism
  • machined surface integrity
  • difficult-to-machine materials
  • processing damage
  • processing monitoring

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Published Papers (1 paper)

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Research

14 pages, 2123 KiB  
Article
Influence of Grinding Parameters on Surface Roughness and Subsurface Crack Damage Depth of Sapphire Crystal
by Yingqi Hou, Yufei Gao and Chunfeng Yang
Materials 2025, 18(11), 2461; https://doi.org/10.3390/ma18112461 (registering DOI) - 24 May 2025
Abstract
Single sapphire crystals has been widely used in technology such as light emitting diodes, lasers, high-temperature and high-voltage devices, special windows, and optical systems, and grinding is an important process of their machining. In order to reveal the influence of the grinding wheel [...] Read more.
Single sapphire crystals has been widely used in technology such as light emitting diodes, lasers, high-temperature and high-voltage devices, special windows, and optical systems, and grinding is an important process of their machining. In order to reveal the influence of the grinding wheel speed, grinding depth, and feed rate on the ground surface quality of sapphire crystals, a three-factor and five-level orthogonal experiment was designed and completed. Variance and range analysis was conducted on the experimental results using the surface roughness Ra and subsurface crack damage depth (SSD) as evaluation indicators, and optimized parameter combinations were explored. Furthermore, mathematical prediction models for the power regression of the Ra and SSD were established based on the experimental data. The research results indicate that within the range of the process parameters used in this experiment, the grinding process did not achieve the full ductile removal of the material. Some of the material was removed in a brittle mode, forming fractured pits on the ground surface, and median crack propagation occurred in the subsurface, forming a subsurface microcrack damage layer. The influence of the grinding parameters on the Ra and SSD showed a consistent trend, which was that the parameter with the greatest impact was the grinding wheel speed, followed by the feed rate and grinding depth. The Ra and SSD obtained under the optimized grinding parameter combination were 0.326 μm and 2.86 μm, respectively. The research results provide an experimental basis and guidance for improving the surface quality of sapphire crystals during grinding. Full article
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