Advanced Abrasive Processing Technology and Applications (Second Edition)
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Manufacturing Processes and Systems".
Deadline for manuscript submissions: 20 November 2025 | Viewed by 43
Special Issue Editor
Interests: precision and ultra-precision abrasive machining; diamond wire saw slicing technology; semiconductor abrasive processing
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Abrasive processing technology has been widely used in manufacturing many mission-critical components for various industrial areas, such as semiconductor chips, PV silicon solar cells, advanced optics, aerospace, automotive, telecommunications, etc. Most materials used in these fields, such as semiconductors, laser crystals, engineering ceramics, optical glass, superalloys, composite materials, etc., are difficult to process. The increasing degree of high-precision and high-efficiency requirements and the difficult-to-machine characteristic of advanced materials lead to numerous research challenges in different fields of abrasive processing technology, such as novel machining processes, processing mechanics, surface generation mechanisms, novel machine design, advanced sensing, machine metrology, machining process modeling and simulation, process monitoring, etc.
The second edition of this Special Issue aims to summarize updates on the research of advanced abrasive processing technology and applications. The scope of this Special Issue includes, but is not limited to:
- Precision and ultra-precision abrasive machining technology in semiconductor, optical, photovoltaic and other fields;
- Basic theory of abrasive machining, such as sawing, grinding, lapping, etc.;
- Modeling, simulation, and optimization of the abrasive machining process;
- High-speed and efficient abrasive processing technology;
- Multi-energy-field-assisted composite abrasive machining technology;
- Grinding technology for new materials;
- Surface integrity of abrasive machining and its detection and control technology;
- Abrasive processing tools and equipment;
- Intelligent manufacturing technology and equipment for abrasive processing;
- Other related processing technologies.
We sincerely invite you to contribute research articles, reviews, and communications to this Special Issue.
Dr. Yufei Gao
Guest Editor
Manuscript Submission Information
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Keywords
- precision/ultra-precision abrasive machining
- sawing
- grinding
- lapping
- material removal mechanism
- machined surface integrity
- difficult-to-machine materials
- processing damage
- processing monitoring
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Related Special Issue
- Advanced Abrasive Processing Technology and Applications in Materials (10 articles)
