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Micromachines
Special Issues
Diamond Micro-Machining and Its Applications
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Diamond Micro-Machining and Its Applications

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E：Engineering and Technology".

Deadline for manuscript submissions: 30 September 2026 | Viewed by 2058

Editor

Dr. Chunlei He

E-Mail Website
Guest Editor
Key Laboratory of Mechanism Theory and Equipment Design of Ministry of Education, Tianjin University, Tianjin 300354, China
Interests: ultra-precision turning; surface roughness; surface topography; optical performance; precision milling; bearing roller lapping; diamond tool
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Diamond micro-machining, or single-point diamond turning (SPDT), is extensively utilized in the production of high-precision devices and has diverse applications in advanced optical manufacturing, aerospace, and other sectors. Currently, diamond micro-machining has emerged as a significant processing technique in high-performance and extreme manufacturing sectors. This Special Issue aims to summarize the research progress in diamond micro-machining and its application areas. We invite submissions of high-quality academic papers in the following research areas:

  1. Modeling fundamental processing mechanisms of diamond micro-machining, encompassing the multi-scale analysis of deformation and phase change mechanisms during processing, including molecular dynamics simulation and finite element simulation.
  2. The modeling of essential surface parameters including surface roughness, morphology, residual stress, and shape accuracy in diamond micro-machining.
  3. Machining methods and CNC trajectory design for the processing of complex microstructures using diamond micro-machining.
  4. Applications of diamond micro-machining in microfluidics, optics, biology, medicine, and additional domains.
  5. Advanced processing technologies pertinent to diamond micro-machining, including field-assisted processing.

Furthermore, submissions of other scholarly papers pertinent to this topic are also encouraged.

Dr. Chunlei He
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • diamond micro-machining
  • single-point diamond turning
  • high-precision devices

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Published Papers (2 papers)

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Research

25 pages, 8106 KB  
Article
Research on Diamond Nano-Grinding of 4H-SiC Crystals and Wear of Abrasives with Different Sharpness
by Lijie Wu, Song Fan, Hanxiao Li, Zijuan Han, Ping Yang, Xiuting Zhao and Jisheng Pan
Micromachines 2026, 17(4), 442; https://doi.org/10.3390/mi17040442 - 1 Apr 2026
Viewed by 593
Abstract
Single-crystal 4H-SiC, as a wide-bandgap semiconductor material, has become a key substrate for high-power electronics and radio frequency devices due to its outstanding characteristics such as high-voltage tolerance, high-temperature stability, high-frequency efficiency and low loss. However, its inherent properties of high hardness and [...] Read more.
Single-crystal 4H-SiC, as a wide-bandgap semiconductor material, has become a key substrate for high-power electronics and radio frequency devices due to its outstanding characteristics such as high-voltage tolerance, high-temperature stability, high-frequency efficiency and low loss. However, its inherent properties of high hardness and low fracture toughness also pose severe challenges to the ultra-precision processing of wafer substrates. In this study, through molecular dynamics methods, the influence of diamond abrasive grains with different sharpness on the processing of 4H-SiC at different grinding speeds was simulated, with a focus on analyzing its surface morphology, material removal behavior and subsurface damage characteristics. The structural evolution of 4H-SiC workpieces and diamond abrasive grains was identified through the radial distribution function, and the dynamic changes in temperature and stress during processing were further investigated to clarify the mechanism of abrasive wear and graphitization phenomena. The results show that regular octahedral abrasive grains with higher sharpness have better material removal efficiency, but they also cause more significant subsurface damage. Increasing the grinding speed helps to reduce the depth of subsurface damage. In addition, high temperature and high stress are the key factors leading to the transformation of diamond into graphite. Even under low-speed grinding conditions, the edges of the abrasive grains may still undergo graphitization due to stress concentration. The above findings have theoretical significance for an in-depth understanding of the material removal mechanism of 4H-SiC nano-grinding, and can also provide an important reference for the development of high-performance grinding wheels for SiC grinding. Full article
(This article belongs to the Special Issue Diamond Micro-Machining and Its Applications)
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27 pages, 13095 KB  
Article
Process Optimization for Ultra-Precision Machining of HUD Freeform Surface Mold Cores Based on Slow Tool Servo
by Tianji Xing, Naiming Qi, Huanming Gao, Longkun Xu, Xuesen Zhao and Tao Sun
Micromachines 2026, 17(2), 164; https://doi.org/10.3390/mi17020164 - 27 Jan 2026
Viewed by 881
Abstract
With the rapid development of Head-Up Display (HUD) technology for vehicles, optical freeform mirrors, as its core optical components, are crucial for achieving system compactness and high imaging quality. However, their complex surface shapes and large-aperture characteristics pose significant challenges to ultra-precision manufacturing. [...] Read more.
With the rapid development of Head-Up Display (HUD) technology for vehicles, optical freeform mirrors, as its core optical components, are crucial for achieving system compactness and high imaging quality. However, their complex surface shapes and large-aperture characteristics pose significant challenges to ultra-precision manufacturing. This study presents a systematic optimization framework for the ultra-precision machining of HUD optical freeform mold cores, integrating surface design, tool path planning, vibration analysis, and process parameter optimization. Firstly, based on the XY polynomial freeform surface model, an off-axis three-mirror HUD system was designed, and the surface parameters and machining dimensions of the mold core were determined. For the Single-Point Diamond Turning (SPDT) Slow Tool Servo (STS) process, a hybrid trajectory planning method combining equidistant projection and cubic spline interpolation was proposed to ensure the smoothness and accuracy of the tool path. Through theoretical analysis and experimental verification, the selection criteria for tool parameters such as tool nose radius and effective cutting angle were clarified, and the mechanistic impact of Z-axis vibration on surface roughness and waviness was quantitatively revealed. Finally, through ultra-precision turning experiments and on-machine measurement, a high-precision freeform surface mold core was successfully fabricated. This validates the effectiveness and feasibility of the proposed process solution and provides technical support for the high-quality manufacturing of HUD optical elements. Full article
(This article belongs to the Special Issue Diamond Micro-Machining and Its Applications)
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