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Micromachines
Special Issues
Functional Materials and Microdevices, 2nd Edition
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Functional Materials and Microdevices, 2nd Edition

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".

Deadline for manuscript submissions: 30 June 2025 | Viewed by 5333

Special Issue Editors

Dr. Zhenhua Wu

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Guest Editor
School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
Interests: thermoelectric; memristor; energy harvesting; sensors
Special Issues, Collections and Topics in MDPI journals
Dr. Erzhen Mu

E-Mail Website
Guest Editor
School of Materials Science and Engineering, Henan Polytechnic University, Jiaozuo 454003, China
Interests: thermoelectric; energy harvesting and conversion; direct ink writing of 3D; radiative cooling
Special Issues, Collections and Topics in MDPI journals
Dr. Hongjing Shang

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Guest Editor
Key Laboratory of Applied Superconductivity and Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing 100190, China
Interests: thermoelectric materials and devices; flexible electronics; low-dimension materials
Special Issues, Collections and Topics in MDPI journals
Dr. Ming Li

E-Mail Website
Guest Editor
Key Laboratory for Thin Film and Microfabrication of Ministry of Education, Shanghai, China
Interests: MEMS gas sensors; nanostructured sensing materials; chip-based in situ TEM characterization
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Functional materials play a crucial role in the development of advanced devices that have the potential to revolutionize various industries, including electronics, energy, healthcare, and environmental monitoring. These materials are designed to possess specific properties and functionalities that enable them to perform specific tasks or functions such as catalysis, thermoelectric, photoelectric, piezoelectric, ferroelectric, photothermal, and radiative cooling. They are typically engineered at the nanoscale level, allowing for precise control over their properties and performance. The development of functional materials and devices involves various approaches, including synthesis, fabrication, and characterization. Advancements in micro-nano manufacturing technologies enabled the fabrication of functional materials with tailored properties for advanced electronic devices, sensing, and monitoring. However, the development of high-performance functional materials and devices also presents several challenges, including cost, scalability, stability and reliability, toxicity, and environmental impact. Accordingly, this Special Issue seeks to showcase research papers and review articles that focus on functional materials and microdevices, encompassing a wide range of applications and technologies.

Dr. Zhenhua Wu
Dr. Erzhen Mu
Dr. Hongjing Shang
Dr. Ming Li
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • functional materials and characterizations
  • energy conversion and transport
  • nano-micro device
  • device modeling and simulation
  • sensors and actuators
  • 3D printing and MEMS technologies
  • machine learning and algorithm

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Related Special Issue

Published Papers (5 papers)

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Research

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13 pages, 4920 KiB  
Article
Thermal Performance of T-Shaped Ultra-Thin Vapor Chamber with Double-Sided Heating for LED Automotive Headlamp Cooling
by Yaokang Zhang, Tengqing Liu, Yu Bai, Shuangfeng Wang, Qianxi Zhang and Huifeng Kang
Micromachines 2025, 16(5), 571; https://doi.org/10.3390/mi16050571 - 12 May 2025
Viewed by 392
Abstract
High heat flux brings about severe thermal problems for light-emitting diode (LED) automotive headlamps in narrow heat removal spaces, which will degrade their performance and lifespan. This study proposes an easily fabricated and feasible 1.3 mm thick 2D T-shaped in-plane ultra-thin vapor chamber [...] Read more.
High heat flux brings about severe thermal problems for light-emitting diode (LED) automotive headlamps in narrow heat removal spaces, which will degrade their performance and lifespan. This study proposes an easily fabricated and feasible 1.3 mm thick 2D T-shaped in-plane ultra-thin vapor chamber (UTVC) for cooling the high heat flux of LED automotive headlamps. The effects of heating modes, unequal input heat load, and orientations on the thermal performance of the T-shaped UTVC are investigated. The results show that double-sided heating can improve the temperature uniformity of the T-shaped UTVC and reduce the thermal resistance compared to the single-sided heating. The lowest thermal resistances under single-sided and double-sided heating are 1.127 K/W at 12 W and 0.898 K/W at 16 W, respectively. When the total power is identical, the proposed 2D T-shaped UTVC can work effectively at unequal input power. The orientations have a significant impact on the thermal performance of the 2D T-shaped UTVC, and the thermal performance under different orientations changes with anti-gravity state < horizontal state < gravity-assisted state. The proposed T-shaped UTVC can work effectively under diverse operating ranges. Full article
(This article belongs to the Special Issue Functional Materials and Microdevices, 2nd Edition)
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27 pages, 10127 KiB  
Article
Research on the Trajectory and Relative Speed of a Single-Sided Chemical Mechanical Polishing Machine
by Guoqing Ye and Zhenqiang Yao
Micromachines 2025, 16(4), 450; https://doi.org/10.3390/mi16040450 - 10 Apr 2025
Viewed by 534
Abstract
This study establishes a bidirectional kinematic analysis framework for single-sided chemical mechanical polishing systems through innovative coordinate transformation synergies (rotational and translational). To address three critical gaps in existing research, interaction dynamics for both pad–wafer and abrasive–wafer interfaces are systematically derived via 5-inch [...] Read more.
This study establishes a bidirectional kinematic analysis framework for single-sided chemical mechanical polishing systems through innovative coordinate transformation synergies (rotational and translational). To address three critical gaps in existing research, interaction dynamics for both pad–wafer and abrasive–wafer interfaces are systematically derived via 5-inch silicon wafers. Key advancements include (1) the development of closed-form trajectory equations for resolving multibody tribological interactions, (2) vector-based relative velocity quantification with 17 × 17 grid 3D visualization, and (3) first-principle parametric mapping of velocity nonuniformity (NUV = 0–0.42) across 0–80 rpm operational regimes. Numerical simulations reveal two fundamental regimes: near-unity rotational speed ratios (ωP/ωC = [0.95, 1) and (1, 1.05]) generate optimal spiral trajectories that achieve 95% surface coverage, whereas integer multiples produce stable relative velocities (1.75 m/s at 60 rpm). Experimental validation demonstrated 0.3 μm/min removal rates with <1 μm nonuniformity under optimized conditions, which was attributable to velocity stabilization effects. The methodology exhibits inherent extensibility to high-speed operations (>80 rpm) and alternative polishing configurations through coordinate transformation adaptability. This work provides a systematic derivation protocol for abrasive trajectory analysis, a visualization paradigm for velocity optimization, and quantitative guidelines for precision process control—advancing beyond current empirical approaches in surface finishing technology. Full article
(This article belongs to the Special Issue Functional Materials and Microdevices, 2nd Edition)
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18 pages, 5900 KiB  
Article
Research on Deflection and Stress Analyses and the Improvement of the Removal Uniformity of Silicon in a Single-Sided Polishing Machine Under Pressure
by Guoqing Ye and Zhenqiang Yao
Micromachines 2025, 16(2), 198; https://doi.org/10.3390/mi16020198 - 8 Feb 2025
Cited by 1 | Viewed by 2993
Abstract
The chemical–mechanical polishing (CMP) of silicon wafers involves high-precision surface machining after double-sided lapping. Silicon wafers are subjected to chemical corrosion and mechanical removal under pressurized conditions. The multichip CMP process for 4~6-inch silicon wafers, such as those in MOSFETs (Metal Oxide Semiconductor [...] Read more.
The chemical–mechanical polishing (CMP) of silicon wafers involves high-precision surface machining after double-sided lapping. Silicon wafers are subjected to chemical corrosion and mechanical removal under pressurized conditions. The multichip CMP process for 4~6-inch silicon wafers, such as those in MOSFETs (Metal Oxide Semiconductor Field Effect Transistors), IGBTs (Insulated-Gate Bipolar Transistors), and MEMS (Micro-Electromechanical System) field materials, is conducted to maintain multiple chips to improve efficiency and improve polish removal uniformity; that is, the detected TTV (total thickness variation) gradually increases from 10 μm to less than 3 μm. In this work, first, a mathematical model for calculating the small deflection of silicon wafers under pressure is established, and the limit values under two boundary conditions of fixed support and simple support are calculated. Moreover, the removal uniformity of the silicon wafers is improved by improving the uniformity of the wax-coated adhesion state and adjusting the boundary conditions to reflect a fixed support state. Then, the stress distribution of the silicon wafers under pressure is simulated, and the calculation methods for measuring the TTV of the silicon wafers and the uniformity measurement index are described. Stress distribution is changed by changing the size of the pressure ring to achieve the purpose of removing uniformity. This study provides a reference for improving the removal uniformity of multichip silicon wafer chemical–mechanical polishing. Full article
(This article belongs to the Special Issue Functional Materials and Microdevices, 2nd Edition)
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Review

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19 pages, 6385 KiB  
Review
An Updated Review of BiCuSeO-Based Thermoelectric Materials
by Haitao Zhang, Bo Feng, Suoluosu Yang, Ruolin Ruan, Rong Zhang, Tongqiang Xiong, Biyu Xu, Zhipeng Zheng, Guopeng Zhou, Yang Zhang, Kewei Wang, Yin Zhong, Yanhua Fan and Xiaoqiong Zuo
Micromachines 2025, 16(6), 703; https://doi.org/10.3390/mi16060703 - 12 Jun 2025
Viewed by 234
Abstract
Since 2010, BiCuSeO has emerged as a captivating subject of investigation within the realm of thermoelectric materials. Its allure lies in a remarkable confluence of characteristics: a distinctive natural super-lattice structure, an elevated Seebeck coefficient, and a low thermal conductivity, all of which [...] Read more.
Since 2010, BiCuSeO has emerged as a captivating subject of investigation within the realm of thermoelectric materials. Its allure lies in a remarkable confluence of characteristics: a distinctive natural super-lattice structure, an elevated Seebeck coefficient, and a low thermal conductivity, all of which have collectively piqued the intense interest of scientists worldwide. Over the subsequent eight-year period, an extensive array of research endeavors has been meticulously carried out, delving deep into the multifaceted properties of BiCuSeO and exploring avenues for performance enhancement. In this comprehensive review, we embark on a detailed exploration of the fundamental properties of BiCuSeO, encompassing its preparation methodologies, as well as its thermoelectric and mechanical attributes. A thorough synthesis of diverse strategies for optimizing the composition and structure of BiCuSeO is presented, elucidating how these modifications contribute to the enhancement of its thermoelectric and mechanical performance. Finally, the current state of research on N-type BiCuSeO is systematically summarized, offering a panoramic view of the advancements and challenges in this particular area. Full article
(This article belongs to the Special Issue Functional Materials and Microdevices, 2nd Edition)
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27 pages, 27489 KiB  
Review
Advances in Magnetically Controlled Medical Robotics: A Review of Actuation Systems, Continuum Designs, and Clinical Prospects for Minimally Invasive Therapies
by Tiantian Kong, Qitong Zheng, Jiarong Sun, Chunxiao Wang, Huibin Liu, Zhizheng Gao, Zezheng Qiao and Wenguang Yang
Micromachines 2025, 16(5), 561; https://doi.org/10.3390/mi16050561 - 6 May 2025
Cited by 1 | Viewed by 896
Abstract
Magnetically controlled micro-robots hold immense potential for revolutionizing advanced medical applications, garnering significant research interest. This potential is underscored by the dual focus on magnetic control systems—both as driving forces and manipulation field sources—and magnetic continuums that have demonstrated clinical therapeutic efficacy. This [...] Read more.
Magnetically controlled micro-robots hold immense potential for revolutionizing advanced medical applications, garnering significant research interest. This potential is underscored by the dual focus on magnetic control systems—both as driving forces and manipulation field sources—and magnetic continuums that have demonstrated clinical therapeutic efficacy. This comprehensive review delves into the actuation characteristics of permanent magnet systems, electromagnetic systems, and commercially available magnetic control systems. It also explores innovative designs of magnetic wires and tubes serving as continuum structures and investigates the variable stiffness properties of magnetic continua, informed by material and structural attributes. Furthermore, the discussion extends to their prospective roles and future applications within the medical realm. The objective is to elucidate emerging trends in the study of magnetic control systems and magnetic continua, marked by an expanding operational scope and enhanced precision in manipulation. By aligning these trends with clinical challenges and requirements, this review seeks to refine research trajectories, expedite practical implementations, and ultimately advocate for minimally invasive therapies. These therapies, leveraging magnetic control systems and magnetic continuums as cutting-edge treatment modalities, promise transformative impacts on the future of healthcare. Full article
(This article belongs to the Special Issue Functional Materials and Microdevices, 2nd Edition)
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