In this work, we developed a measurement platform that employs high-power LEDs as excitation sources in conjunction with a charge-coupled device to perform spatially resolved photoluminescence (PL) and electroluminescence (EL) mapping of commercial L...
Light-emitting diode (LED) chips have disordered arrangement and defects with characteristics of low contrast, for which traditional segmentation methods cannot classify surface defects effectively. In this paper, a chip segmentation method based on...
The continuous development of mini-LEDs has led to higher requirements for chip transfer technology, which makes it difficult for the intermittent transfer method with a mechanical ejector pin to meet these requirements. To solve this problem, a nove...
High-power-density LEDs can achieve many functions that are difficult for traditional light sources and conventional LEDs to realize, pushing the semiconductor lighting technology chain to a new level. Increasing the number of chips is an effective a...
The distributed Bragg reflector (DBR) has been widely used in flip-chip micro light-emitting diodes (micro-LEDs) because of its high reflectivity. However, the conventional double-stack DBR has a strong angular dependence and a narrow reflective band...
Current solutions for improving the light extraction efficiency of flip-chip light-emitting diodes (LEDs) mainly focus on relieving the total internal reflection at sapphire/air interface, but such methods hardly affect the epilayer mode photons. We...
Since the junction temperature is a critical factor determining the lifetime and reliability of LEDs, effective thermal management is essential to prevent premature failure. This study uses COMSOL Multiphysics® to simulate a 10 W multi-chip COB L...
The GaN-based green miniaturized light-emitting diode (mini-LED) is a key component for the realization of full-color display. Optimized passivation layers can alleviate the trapping of carriers by sidewall defects and are regarded as an effective wa...
Dual-wavelength multiple quantum wells (MQWs) have great potential in realizing high quality illumination, monolithic micro light-emitting diode (LED) displays and other related fields. Here, we demonstrate a single chip white light indium gallium ni...
This work proposes the use of integrated high-power InGaN/GaN multiple-quantum-well flip-chip blue micro light-emitting diode (μ-LED) arrays on an AlGaN/GaN-based heterojunction field-effect transistor (HFET), also known as a high electron mobility t...
In this study, we present a novel type of package, freeform-designed chip scale package (FDCSP), which has ultra-high light extraction efficiency and bat-wing light field. For the backlight application, mainstream solutions are chip-scale package (CS...
This paper investigates the effect of two different welding methods, direct welding (DW) and vacuum furnace welding (VFW), on flip-chip light-emitting diode (FC-LED) filament properties. Shearing force, SEM, steady-state voltage, steady-state luminou...
Transducers, such as photodiodes, phototransistors, and photovoltaic cells are promising radiation detectors. However, for accurate radiation detection and dosimetry, signals that emanate from these devices have to be sufficient to facilitate accurat...
In this study, a temperature imaging method based on a magnetic nanoparticle thermometer is proposed and evaluated. We first constructed a new model for finding the single temperature of magnetic nanoparticles with core size distribution. Specificall...
Transferable substrate-less InGaN/GaN light-emitting diode (LED) chips have successfully been fabricated in a laser lift-off (LLO) process employing high power ultrashort laser pulses with a wavelength of 520 nm. The irradiation of the sample was con...
Chip defect detection is a crucial aspect of the semiconductor production industry, given its significant impact on chip performance. This paper proposes a lightweight neural network with dual decoding paths for LED chip segmentation, named LDDP-Net....
LEDs are highly energy efficient and have substantially longer lifetimes compared to other existing lighting technologies. In order to facilitate the new generation of LED devices, approaches to improve power efficiency with increased integration lev...
Achieving a stable color output across wide temperature ranges in automotive LED applications is challenging, especially when using cost-sensitive chips with limited computational resources. This study proposes an improved temperature model that inte...
Chip-On-Board Light-Emitting Diodes (COB LED) are increasingly more common. Their development in recent years has directly contributed to increasing the power of LED sources, whilst simultaneously increasing the luminous flux from the entire COB. Con...
The recent advances in chip-size microscopy based on optical scanning with spatially resolved nano-illumination light sources are presented. This new straightforward technique takes advantage of the currently achieved miniaturization of LEDs in fully...
In this study, the photonic crystal structure is employed to increase both the light extraction efficiency and the modulation bandwidth of flip-chip GaN-based light-emitting diodes (LEDs). The finite difference time domain method is utilized to inves...
This paper discusses possible methods for on-chip fluorescent imaging forintegrated bio-sensors. The integration of optical and electro-optical accessories, accordingto suggested methods, can improve the performance of fluorescence imaging. It can bo...
This research work presents a comparative thermal performance assessment of the laminar flow cooling blocks produced for automotive headlight assembly using a high power Light Emitting Diode (LED) chip. A three-dimensional numerical model with conjug...
Optimization for heat dissipation plays a significant role in energy saving and high-efficiency utilizing of integrated electronics. In this paper, we present a study of micro structuring on polymer-based flexible substrate coupled with aluminum-allo...
In micro-LED chip repair, a nanopositioner is commonly used to adjust the positioning of the LED chip. However, during the bonding process, the heat generated can cause the positioning system to deform, leading to inaccurate alignment and poor-qualit...
A silicon-chip-based 3D metal solenoidal transformer is proposed and developed to achieve AC-DC conversion for integrated power supply applications. With wafer-level micro electromechanical systems (MEMS) fabrication technique to form the metal casti...
In this paper, the X-ray diffraction full width at half the maximum (XRD FWHM) of a 3.5 µm-thick hydride vapor phase epitaxy-aluminum nitride (HVPE-AlN) (002) face after high-temperature annealing was reduced to 129 arcsec. The tensile strain i...
LED packaging miniaturization has raised more requirements for LED materials. As a material contacting the LED chip directly, the reliability of LED non-conductive adhesive has also garnered increasing attention. This study optimized the formula for...
Micro-light-emitting diodes (micro-LEDs) have been regarded as the important next-generation display technology, and a comprehensive and reliable modeling method for the design and optimization of characteristics of the micro-LED is of great use. In...
Micro-LED (light-emitting diode) is a potentially disruptive display technology, while power consumption is a critical issue for all display devices. In this paper, we develop a physical model to evaluate the power consumption of micro-LED displays u...
7 April 2021
The coronavirus SARS-CoV-2 pandemic has become a global health burden. Surface sanitation is one of the key points to reduce the risk of transmission both in healthcare and other public spaces. UVC light is already used in hospital and laboratory inf...
This article summarizes the current development status of nanoimprint lithography (NIL) technology and its application prospects in multiple industries. Nanoimprint lithography technology has significant advantages, such as low cost, high resolution,...
In this article, an active matrix (AM) micro light-emitting diode (MicroLED) display with a resolution of 1920 × 1080 and a high pixel density of 3200 pixels per inch (ppi) is reported. The single pixel with a diameter of 5 μm on the MicroLE...
Micro light emitting diode (μLED) displays have been in development since 2017, aimed for application in 2020. However, when using three-color, i.e., red, blue, and green LEDs, or blue LEDs that excite red and green phosphors, many challenges aris...
An inlay sample with artificial defects was inspected via the pulse-compression thermography (PuCT) technique. The sample belongs to the cultural heritage field, and it was realized by a professional restorer based on his long-time experience, imitat...
By studying the substrate material, structure, chip distribution, and array form of the multi-chip light-emitting diode (LED) package, the heat-dissipation capacity of the LED package is improved. Finite element analysis and steady-state thermal anal...
Currently, built LED luminaires are usually multi-source. This causes a large number of photometric and simulation problems connected with computer lighting visualization. This paper highlights three key issues with these luminaires: a change in the...
In this study, we have fabricated a 368 nm LED with an epitaxial Indium Tin Oxide (ITO) contact layer. We analyze the thermal performance of the flip-chip LED with a symmetric electrode and metal reflective layer, applying ANSYS to build a coupled el...
The effect of correlated color temperature (CCT) on the thermal performance of light emitting diode (LED) filament in flip-chip packaging was investigated in detail. Two filaments with different lengths were selected as the research object, and the t...
This article researches the effect of Sn-based solder alloys on flip-chip light-emitting diode LED (FC-LED) filament properties. SEM images, shearing force, steady-state voltage, blue light luminous flux, and junction temperature were examined to dem...
In this paper, a novel method is presented to estimate the parameters of the SPICE-like multi-domain model of light-emitting diode (LED) chips developed and proposed by the Delphi4LED project. The proposed estimation algorithm employs a modified Neld...
In this paper, a new method to regulate the correlated color temperature (CCT) of white light-emitting diodes (LEDs) is proposed for the single-chip packaging structure, in which the blue light distribution emitted from the chip in the red/yellow pho...
Micro-scale light emitting diodes (micro-LEDs) commonly employ a thin-film flip-chip (TFFC) structure whose substrate is lifted off by an excimer laser. However, flip-chip (FC) micro-LEDs with a substrate can provide a sharp rise on sidewall emission...
The sensitive quantification of low-abundance nucleic acids holds importance for a range of clinical applications and biological studies. In this study, we describe a facile microfluidic chip for absolute DNA quantifications based on the digital loop...
Integrated circuits are created by interfacing different materials, semiconductors, and metals, which are appropriately deposited or grown on substrates and layers soldered together. Therefore, the characteristics of starting materials and process te...
Low light extraction efficiency (LEE) remains a critical bottleneck in the performance of contemporary micro-light-emitting diodes (micro-LEDs). This study presents an innovative approach to improve the LEE of Gallium nitride (GaN)-based thin-film fl...
By solving the problem of very long test time on reliability qualification for Light-emitting Diode (LED) products, the accelerated degradation test with a thermal overstress at a proper range is regarded as a promising and effective approach. For a...
Organs-on-a-Chip (OOAC) is a disruptive technology with widely recognized potential to change the efficiency, effectiveness, and costs of the drug discovery process; to advance insights into human biology; to enable clinical research where human tria...
For high-power applications, it is important to improve the light extraction efficiency and light output of the vertical direction of LEDs. Flip-chip LEDs (FCLEDs) with an Ag/SiO2/distributed Bragg reflector/SiO2 composite reflection micro structure...
Hetero-integration of functional semiconductor layers and devices has received strong research interest from both academia and industry. While conventional techniques such as pick-and-place and wafer bonding can partially address this challenge, a va...
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