D1: Semiconductor Devices
A section of Micromachines (ISSN 2072-666X).
Editorial Board
Topical Advisory Panel
Special Issues
Following special issues within this section are currently open for submissions:
- III–V Compound Semiconductors and Devices, 2nd Edition (Deadline: 28 February 2026)
- Applications of Data Sciences in Semiconductor Industry: Design, Manufacturing, Packaging and Testing (Deadline: 28 February 2026)
- Advanced Packaging Technology for MEMS Devices (Deadline: 28 February 2026)
- GaN Heterostructure Devices: From Materials to Application, 2nd Edition (Deadline: 28 February 2026)
- Advances in Wide Band Gap (WBG) Materials for Electronic Devices (Deadline: 20 March 2026)
- Research Progress of Advanced SiC Semiconductors (Deadline: 31 March 2026)
- Advanced Ferroelectric and Memristive Devices: Fundamentals and Applications (Deadline: 31 March 2026)
- Thin Film Microelectronic Devices and Circuits, 2nd Edition (Deadline: 31 March 2026)
- Recent Advances in 3D Printed Electronics (Deadline: 31 March 2026)
- Advanced Nano-Semiconductor Devices: Design, Modeling and Next-Generation AI Applications (Deadline: 30 April 2026)
- Recent Advances in Field-Effect Transistors: Materials, Devices, and Emerging Applications (Deadline: 30 June 2026)
- GaN-Based Materials and Devices: Research and Applications, 2nd Edition (Deadline: 30 June 2026)
- Power Semiconductor Devices and Integration Technology (Deadline: 30 June 2026)
- Advances in CMOS Integrated Sensors and Biosensors (Deadline: 30 June 2026)
- Advanced Oxide- and Carbon Nanotube-Based Transistors for Next-Generation Semiconductor Chips (Deadline: 30 June 2026)
- Memristive Devices and Circuits Made from Materials with Low-Dimensional Structures (Deadline: 30 June 2026)
- High-Reliability Semiconductor Devices and Integrated Circuits, 4th Edition (Deadline: 10 August 2026)
- Wide-Bandgap Semiconductor Devices: Materials, Fabrication, and Applications, 2nd Edition (Deadline: 25 August 2026)
- Reliability Metrology, Testing and Failure Analysis of Semiconductor Devices (Deadline: 30 August 2026)
- Power Semiconductor Devices and Applications, 4th Edition (Deadline: 31 August 2026)
- Semiconductor Materials and Processing Technology (Deadline: 31 August 2026)
- Advances in Semiconductor Power Devices (Deadline: 30 September 2026)
- Advances in Micro/Nano-Fabricated GaN-Based Semiconductor Devices: Materials, Processing, and Applications (Deadline: 30 September 2026)
- Fabrication, Reliability, Simulation, and Protection of Advanced Semiconductor Devices and Integrated Circuits: Enabled by Emerging Semiconductor Materials (Deadline: 30 September 2026)
- Advanced Wide Bandgap Semiconductor Materials and Devices (Deadline: 30 September 2026)
- Advanced Etching Technologies for Three-Dimensional Integrated Chips (Deadline: 30 November 2026)
- Reliability and Degradation in Power Transistors (Deadline: 31 December 2026)
