New Research in Microelectronics and Electronics

A special issue of Chips (ISSN 2674-0729).

Deadline for manuscript submissions: 31 March 2025 | Viewed by 4421

Special Issue Editors


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Guest Editor
Dipartimento di Ingegneria Elettrica Elettronica e Informatica (DIEEI), Università di Catania, 95125 Catania, Italy
Interests: feedback circuits; operational amplifier design; voltage regulators; bandgap voltage references; low-voltage circuits; device modeling
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Guest Editor
Department of Electrical, Computer and Biomedical Engineering, University of Pavia, 27100 Pavia, Italy
Interests: sensor interface circuits; thermal detectors; temperature-to-digital converters; switching DC–DC converters; wireless power transfer; bandgap references
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

The 19th International Conference On PhD Research in Microelectronics and Electronics (PRIME 2024) was held on 9–12 June 2024, in Larnaca, Cyprus (https://cyprusconferences.org/prime2024/).

Also, this edition of PRIME featured a conference program that reflected the wide spectrum of research topics in the fields of Microelectronics and Electronics, building bridges between various research fields. In addition to the technical sessions, conference attendees enjoyed the keynote talks, company exhibitions, and social events.

Several contributions were high-quality papers that fit within the scope of Chips. Therefore, this Special Issue will invite the authors of the best PRIME 2024 papers to submit extended versions of their original works (50% extension of contents of conference papers). In addition to the PRIME 2024 papers, other independent submissions are welcome. The subjects of these contributions should be the same research topics as the ones discussed at the conference:

  • Micro/Nano-electronics;
  • Biomedical electronics;
  • Semiconductors;
  • Sensors and MEMS;
  • Analog/digital signal processing;
  • VLSI and SoC applications;
  • Computer-aided design;
  • ASIC designs;
  • Analog/digital/mixed/RF IC design;
  • Energy efficient circuits;
  • Asynchronous digital circuits;
  • Electronics for ICT systems;
  • RF, microwave, and millimeter-wave circuits;
  • Electronics for metamaterials.

Prof. Dr. Gianluca Giustolisi
Dr. Elisabetta Moisello
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Chips is an international peer-reviewed open access quarterly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • integrated circuits
  • chips
  • microelectronics
  • electronics

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Published Papers (1 paper)

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Review

25 pages, 14135 KiB  
Review
Recent Progress of Non-Volatile Memory Devices Based on Two-Dimensional Materials
by Jiong Pan, Zeda Wang, Bingchen Zhao, Jiaju Yin, Pengwen Guo, Yi Yang and Tian-Ling Ren
Chips 2024, 3(4), 271-295; https://doi.org/10.3390/chips3040014 - 24 Sep 2024
Viewed by 1128
Abstract
With the development of artificial intelligence and edge computing, the demand for high-performance non-volatile memory devices has been rapidly increasing. Two-dimensional materials have ultrathin bodies, ultra-flattened surfaces, and superior physics properties, and are promising to be used in non-volatile memory devices. Various kinds [...] Read more.
With the development of artificial intelligence and edge computing, the demand for high-performance non-volatile memory devices has been rapidly increasing. Two-dimensional materials have ultrathin bodies, ultra-flattened surfaces, and superior physics properties, and are promising to be used in non-volatile memory devices. Various kinds of advanced non-volatile memory devices with semiconductor, insulator, ferroelectric, magnetic, and phase-change two-dimensional materials have been investigated in recent years to promote performance enhancement and functionality extension. In this article, the recent advances in two-dimensional material-based non-volatile memory devices are reviewed. Performance criteria and strategies of high-performance two-dimensional non-volatile memory devices are analyzed. Two-dimensional non-volatile memory array structures and their applications in compute-in-memory architectures are discussed. Finally, a summary of this article and future outlooks of two-dimensional non-volatile memory device developments are given. Full article
(This article belongs to the Special Issue New Research in Microelectronics and Electronics)
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