Special Issue "Microsystem for Electronic Devices"

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E:Engineering and Technology".

Deadline for manuscript submissions: 31 August 2021.

Special Issue Editor

Dr. Xinrui Ding
E-Mail Website
Guest Editor
Key Laboratory of Surface Functional Structure Manufacturing of Guangdong High Education Institutes, South China University of Technology, Guangzhou 510641, China
Interests: electronic device packaging; white-light-emitting diode; laser illumination; quantum dots; thermal management of electronic devices; visible light communication

Special Issue Information

Microsystems have a wide range of applications in electronics, such as sensors, actuators, detectors, converters, and transistors. They also contain many interdisciplinary scientific problems that need to be solved, including manufacturing, measurement, control, reliability, efficiency, and sensitivity. Many interesting characteristics may occur due to the scale effect. The microsystem with micro or nanostructures can provide many positive or negative functions in applications, such as hydrophobic/hydrophilic, lubricating or friction, light trapping or enhancing, scattering cancellation or improvement, electromagnetic enhancing or shielding, and electron blocking or transporting. With the development of advanced or extreme manufacturing methods, novel microsystems and applications are continuously increasing. In this Special Issue, we welcome the contributions of microsystems and their applications in the electronic field. The articles contain theoretical and experimental studies on microsystems but are not limited to:

  • Design, finite element analysis (FEA), simulation, and measurement of microsystems;
  • Microreactors, surface-enhanced Raman scattering (SERS), and related biological/chemical microsystems;
  • Microactuators, sensors, controllers, and MEMS-related electronic devices;
  • Light-emitting diodes (LEDs), microdisplay components and devices, and other related microphotoelectric devices;
  • Lithium ion or solar cell batteries, supercapacitors, energy harvesters, pyroelectric components, photodetectors, and other related microenergy devices;
  • Microgrinding, cutting, milling, drilling, and related micro–nanostructure manufacturing;
  • Microheat pipes, ultra-thin vapor chambers, and other related thermal management devices.

Dr. Xinrui Ding
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Microsystems
  • Micro–nanostructures
  • Micromanufacturing
  • Microenergy storage devices
  • Microsensors or actuators
  • Microphoto electronics
  • Microreactors

Published Papers (2 papers)

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Research

Open AccessArticle
Color-Tunable White LEDs with Single Chip Realized through Phosphor Pattern and Thermal-Modulating Optical Film
Micromachines 2021, 12(4), 421; https://doi.org/10.3390/mi12040421 - 12 Apr 2021
Viewed by 265
Abstract
In this paper, a new method to regulate the correlated color temperature (CCT) of white light-emitting diodes (LEDs) is proposed for the single-chip packaging structure, in which the blue light distribution emitted from the chip in the red/yellow phosphor layer was modulated through [...] Read more.
In this paper, a new method to regulate the correlated color temperature (CCT) of white light-emitting diodes (LEDs) is proposed for the single-chip packaging structure, in which the blue light distribution emitted from the chip in the red/yellow phosphor layer was modulated through changing the paraffin-polydimethylsiloxane (PDMS) film transparence and haze. The results show that the transmittance of the paraffin-PDMS film can be modulated from 49.76% to 97.64%, while the haze of that ranges from 88.19% to 63.10%. When the thickness of paraffin-PDMS film is 0.6 mm, and the paraffin-PDMS film concentration is 30 wt%, the CCT of white LED decreases from 15177 K to 3615 K with the increase of thermal load in the paraffin-PDMS film. The modulating range of its CCT reaches 11562 K. The maximum CCT variation at the same test condition is only 536 K in the repeated experiments within one week. Full article
(This article belongs to the Special Issue Microsystem for Electronic Devices)
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Open AccessArticle
Effect of Surface Microstructure on the Heat Dissipation Performance of Heat Sinks Used in Electronic Devices
Micromachines 2021, 12(3), 265; https://doi.org/10.3390/mi12030265 - 04 Mar 2021
Viewed by 333
Abstract
Heat sinks are widely used in electronic devices with high heat flux. The design and build of microstructures on heat sinks has shown effectiveness in improving heat dissipation efficiency. In this paper, four kinds of treatment methods were used to make different microstructures [...] Read more.
Heat sinks are widely used in electronic devices with high heat flux. The design and build of microstructures on heat sinks has shown effectiveness in improving heat dissipation efficiency. In this paper, four kinds of treatment methods were used to make different microstructures on heat sink surfaces, and thermal radiation coating also applied onto the heat sink surfaces to improve thermal radiation. The surface roughness, thermal emissivity and heat dissipation performance with and without thermal radiation coating of the heat sinks were studied. The result shows that with an increase of surface roughness, the thermal emissivity can increase up to 2.5 times. With thermal radiation coating on a surface with microstructures, the heat dissipation was further improved because the heat conduction at the coating and heat sink interface was enhanced. Therefore, surface treatment can improve the heat dissipation performance of the heat sink significantly by enhancing the thermal convection, radiation and conduction. Full article
(This article belongs to the Special Issue Microsystem for Electronic Devices)
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