Abstract
Since the junction temperature is a critical factor determining the lifetime and reliability of LEDs, effective thermal management is essential to prevent premature failure. This study uses COMSOL Multiphysics® to simulate a 10 W multi-chip COB LED package, focusing on the role of thermally conductive adhesive films. Results show that junction temperature is more sensitive to film thickness than to thermal conductivity. Reducing thickness from 0.6 mm to 0.1 mm gradually improves cooling, with diminishing returns below 0.1 mm. Similarly, thermal conductivity above 5 W/m·K offers limited improvement. Dense chip layouts intensify the film’s influence. Optimizing these parameters effectively reduces local overheating and enhances dissipation. This study provides practical guidelines for enhancing the long-term reliability of high-density LED packaging by strategically optimizing adhesive film parameters to mitigate thermal-induced degradation.