This paper presents the study of gold/gold thermocompression bonding at silicon wafer level. The first samples contains sealing rings and electrical pads, and are characterized on pull, and shear test showing bond strength similar to silicon/glass an...
The optimization of the autogenous diffusion copper bonding via thermocompression at vacuum environment was investigated. The influence of various bonding parameters on the interdiffusion efficiency was studied in detail at the micro (SEM-EBSD) and n...
The aim of this study was to assess the influence of thermocompression conditions on lignocellulosic biomasses such as sugarcane bagasse (SCB) in the production of 100% binderless bio-based materials. Five parameters were investigated: pressure appli...
Thermocompression bonding for wafer-level hermetic packaging was demonstrated at the lowest temperature of 370 to 390 °C ever reported using Al films with thin Sn capping or insertions as bonding layer. For shrinking the chip size of MEMS (micro elec...
Silicon-based microchannel technology offers unmatched performance in the cooling of silicon pixel detectors in high-energy physics. Although Si–Si direct bonding, used for the fabrication of cooling plates, also meets the stringent requirement...
Cu-Cu direct interconnects are highly desirable for the microelectronic industry as they allow for significant reductions in the size and spacing of microcontacts. The main challenge associated with using Cu is its tendency to rapidly oxidize in air....
In this work, sodium alginate/chitosan (SA/CS) blend films were prepared by thermo-compression for the first time. Glycerol and lactic acid were used as de-structuring agents for SA and CS, respectively. The chemical structures, thermal stability, ph...
In this study, we prepared guar gum (GG) films using a compression molding technique for the first time, incorporating glycerol as a plasticizer and microcrystalline cellulose (MCC) as a reinforcing filler. The chemical structures, thermal properties...
In glass interposer architecture and its assembly process, the mechanical responses of interposer structure under thermocompression process-induced thermal loading and generated shrinkage of molding material are regarded as a major reliability issue....
Thermoplastic chitosan/microcrystalline cellulose (TPC/MCC) composite films were prepared by thermo-compression and are reported here for the first time. L-lactic acid (LLA) was used as a plasticizer in the formation of TPC. TPC films with varying LL...
Alginate is a biocompatible and biodegradable polymer derived from seaweed. It has been extensively researched and developed for various applications. However, its poor mechanical properties present a significant drawback that limits its use in multi...
To increase the yield of the wafer-level Cu-Cu thermo-compression bonding method, certain surface pre-treatment methods for Cu are studied which can be exposed to the atmosphere before bonding. To inhibit re-oxidation under atmospheric conditions, th...
Chickpea (Cicer arietinum L.) flour is a promising raw material for bio-based packaging due to its protein and polyphenol content. In this study, thermocompressed chickpea flour sheets were reinforced with cellulose nanocrystals (CNCs) to improve the...
This study reports the fabrication and characterization of copper–silicon carbide (Cu–SiC) metal matrix composites produced using powder metallurgy (PM) combined with thermo-compression processing (TCP), a dual route that remains limited...
Thermo-compression bonding (TCB) properties of Cu/SnAg pillar bumps on electroless palladium immersion gold (EPIG) were evaluated in this study. A test chip with Cu/SnAg pillar bumps was bonded on the surface-finished Cu pads with the TCB method. The...
This study investigates the fabrication of eco-friendly composite films based on guar gum (GG) reinforced with untreated rice husk (URH) powder (5–30 wt%) via a thermocompression process. To the best of our knowledge, this is one of the first d...
Plasma- and water-assisted oxide-oxide thermocompression direct bonding for a self-assembly based multichip-to-wafer (MCtW) 3D integration approach was demonstrated. The bonding yields and bonding strengths of the self-assembled chips obtained by the...
Since 2010, huge quantities of Sargassum spp. algae have been proliferating in the Atlantic Ocean and stranding on Caribbean beaches, causing major economic, environmental, and health problems. In this study, an innovative high-density binderless par...
The aim of this work was to prepare sugar alcohol-based deep eutectic solvents (DES) and test them as starch plasticizers. Thermoplastic starch (TPS) films were obtained via a simple and convenient thermocompression method. Influence of starch/DES pr...
Three-dimensional (3D) printing of continuous fiber-reinforced composites has been developed in recent decades as an alternative means to handle complex structures with excellent design flexibility and without mold forming. Although 3D printing has b...
The flame retardancy of wood–polymer composites significantly affects their potential applications. Thus, multilayered wood flour/high-density polyethylene (HDPE)/polycarbonate (PC) composites were prepared via thermocompression to improve the...
The technology trends of next generation electronic packaging are moving toward heterogeneous 3D packaging systems. One of the key processes of 3D packaging system is Cu-to-Cu bonding, which is highly dependent on the planarized, activated, and oxyge...
This paper reports a 3-axis fully integrated differential capacitive tactile sensor surface-mountable on a bus line. The sensor integrates a flip-bonded complementary metal-oxide semiconductor (CMOS) with capacitive sensing circuits on a low temperat...
In soft electronics, anisotropic conductive adhesive films (ACFs) are the trending interconnecting approach due to their substantial softness and superior bondability to flexible substrates. However, low bonding pressure (≤1 MPa) and fine-pitch in...
This study demonstrates the achievement of robust Cu-Cu bonding strength through thermocompression bonding (TCB) under a formic acid (FA) atmosphere. When subjected to sintering at 300 °C for 1 min under FA, sintering joints exhibit an average sh...
Gold-to-gold (Au–Au) bonding forms an oxide-resistant metallic interface without solder or conductive adhesive, making it attractive for heterogeneous integration, MEMS sealing, optoelectronic packaging, and flexible hybrid electronics (FHEs)....
This research investigates resonator width optimization for simultaneously enhancing electrical performance and mechanical reliability in wideband RF MEMS filters through systematic evaluation of three configurations: 0% (L1), 60% (L2), and 100% (L3)...
To bond a semiconductor power chip on a substrate using the formation of bondlines exhibiting long-term mechanical durability at high temperatures such as 300 °C, compression-assisted sinter bonding between Cu finishes was carried out at 300&ndas...
Guar gum (GG), a typical biopolymer, has found widespread use in packaging applications due to its biodegradability, non-toxicity, and low price. However, the further application of GG is significantly limited by its poor flexibility and water resist...
Advanced packaging technology has become more and more important in the semiconductor industry because of the benefits of higher I/O density compared to conventional soldering technology. In advanced packaging technology, copper–copper (Cu-Cu)...
In this work, films of polylactide (PLA) prepared by extrusion and thermo-compression were plasticized with oligomer of lactic acid (OLA) at contents of 5, 10, and 20 wt%. The PLA sample containing 20 wt% of OLA was also reinforced with 3, 6, and 9 p...
This study originally explores the use of naringin (NAR), gallic acid (GA), caffeic acid (CA), and quercetin (QUER) as natural antioxidants for bio-based high-density polyethylene (bio-HDPE). These phenolic compounds are present in various citrus fru...
Reliable bonding of microstructured polymer parts is one of the major challenges in industrial fabrication of microfluidic devices. In the present work, the effects of a UV/ozone surface activation on the bonding process were investigated for the co...
This research investigates an effective alkali (NaOH) treatment and fire-retardant coating to produce biocomposites from frost-retted hemp fiber and PLA. The fiber surface treatment with various NaOH concentrations was investigated throughout a range...
The growing demand for sustainable materials has driven significant interest in composites reinforced with organic fibers, due to their mechanical performance, availability, and reduced environmental impact. This study investigates the mechanical beh...
A new and transformative era in semiconductor packaging is underway, wherein, there is a shift from transistor scaling to system scaling and integration through advanced packaging. For advanced packaging, interconnect scaling is a key driver, with in...
This study addresses the urgent need for sustainable alternatives to single-use plastics by developing biodegradable composites from peach and apple processing waste employing hot compression molding. Utilizing a definitive screening design, the impa...
To investigate the influence of substrate curvature and process deviations on the bonding quality of microchips mounted on curved surfaces, a thermo–mechanical coupled finite element model was developed in ANSYS 19.2 using a 0402 microchip as a...
This article presents the results of research into the causes of the wear of the piston pin mounted in piston bosses by means of a hinge joint and in the connecting rod small end by means of the thermocompression bond. Changes in geometry and in the...
This work aimed to evaluate the properties of butylene adipate-co-terephthalate (PBAT) degraded after 1800 days of storage (DPBAT) by preparing blends (films) with crosslinked starch (Cm) through extrusion and thermocompression. Different ratios of D...
In this study, we conducted the first plasticization of wheat flour (WF) with the addition of choline chloride:urea (1:5 molar ratio) eutectic mixture as a plasticizer and spent coffee grounds (cf) as a filler. Thermoplastic wheat flour (TPWF) films...
Recently, several chemical and physical treatments were developed to improve different properties of wood. Such treatments are applicable to many types of cellulose-based materials. Densification leads the group in terms of mechanical results and com...
The goal of the study was to prepare deep eutectic solvents (DESs) with different urea (U) contents and apply them as potato-starch plasticizers to investigate the influence of various DES compositions on the physicochemical properties of thermoplast...
In the present study, agro-food waste derived rice straw (RS) was valorized into cellulose microfibers (CMFs) using a green process of combined ultrasound and heating treatments and were thereafter used to improve the physical properties of thermopla...
The development of a microfluidic module for on-line protein separation is presented in this paper. The device is based on the SPLITT (Split flow Thin fractionation) technique and the separation of proteins is electrically driven by means of two plat...
The present work investigates the potential of developing bio-composites based on thermoplastic polymers reinforced with natural fibres by using hybrid yarns. The hybrid yarns were produced by the wrapping technique, in which a multifilament of polya...
Highly environmentally-friendly fibreboards were manufactured by hot-press moulding using Posidonia ocaeanica wastes and a partially biobased epoxy resin as binder. Fibreboards with a constant fibre content of 70 wt % were successfully manufactured b...
Carbon nanotubes (CNTs) have, over the years, been used in research as a promising material in electronics as a thermal interface material and as interconnects amongst other applications. However, there exist several issues preventing the widespread...
Novel green composites based on commercial poly(3-hydroxybutyrate) (PHB) filled with 10 wt % rice husk flour (RHF) were melt-compounded in a mini-mixer unit using triglycidyl isocyanurate (TGIC) as compatibilizer and dicumyl peroxide (DCP) as initiat...
Nowadays, a range of sensors and actuators can be realized directly in the structure of textile substrates using metal-plated yarns, metal-filament yarns, or functionalized yarns with nanomaterials, such as nanowires, nanoparticles, or carbon materia...
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