Special Issue "3D Integration Technologies for MEMS"
A special issue of Micromachines (ISSN 2072-666X).
Deadline for manuscript submissions: closed (25 June 2016).
Interests: MEMS; NEMS; micro and nano-fabrication; wafer bonding; heterogeneous 3D integration; MEMS packaging
Interests: MEMS; acoustics; 3D integartion; wafer bonding
Packaging and integrating microelectromechanical systems (MEMS) with integrated circuits (ICs) is critical for the majority of MEMS devices. Technologies for three dimensional (3D) integration and packaging of MEMS are critical to realize cost-efficient and highly integrated components and, thus, these are hot research topics in both industry and academia. Accordingly, this Special Issue seeks to showcase high quality research papers, short communications, and review articles that focus on 3D integration technologies relevant for MEMS applications. Example topics include MEMS and IC integration, through silicon vias (TSV) technologies for MEMS, wafer bonding, wafer-level packaging of MEMS, vacuum sealing, 3D micro and nano-fabrication technologies, chip and wafer stacking, monolithic CMOS and MEMS integration, and heterogeneous 3D integration technologies.
Prof. Dr. Frank Niklaus
Dr. Roy Knechtel
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- three dimensional (3D) integration
- MEMS and IC integration
- through silicon vias (TSVs)
- wafer stacking
- chip stacking
- wafer bonding
- interposer substrate
- wafer-level packaging of MEMS
- system-on-chip (SoC)
- system-in-package (SiP)