Reliability Evaluation, Simulation and Mechanical Analysis of Materials for Advanced Electronic Packaging
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".
Deadline for manuscript submissions: closed (10 November 2023) | Viewed by 23058
Special Issue Editor
Interests: mechanical designs and integrations of 3D IC system; back-end of line (BEOL) process enhancement and reliability investigation of nano-micro devices; strain silicon engineering; advanced microsystem packaging; computational solid mechanics; thin film mechanics; coupled-field nonlinear finite element analysis
Special Issue Information
Dear Colleagues,
To overcome the limited operational speed for nano-scaled transistors, scaling electronic devices to small and thin packaging and high-density arrangements has become the technological mainstream in designing versatile packaging architectures. Among these, a promising candidate is the advanced electronic package due to its excellent capability of heterogeneous integration. However, sequential reliability is a troublesome concern given the complex packaging structure, especially for the simulation, mechanical analysis of adopted new packaging materials, packaging framework, and so on. To address this issue, advanced concepts and approaches of packaging reliability evaluation and mechanical analysis are developed to combine chips with different sizes, process nodes, and technologies. To achieve a high operating performance, reduced cost, reliable thermal management, and mechanical stability, assessment approaches to structural design, process flow, and material characteristics with regard to related reliability problems need to be developed through experimental/numerical and theoretical work. Accordingly, this Special Issue aims to demonstrate and disseminate original ideas on reliability evaluation, simulation, and mechanical analysis of materials for advanced electronic package, including physical and numerical modeling in mechanical characteristics and interactions, 2.5D/3D integrated circuits, applications of artificial intelligence and the IoT on advanced package, material characteristics in electronic packaging and its thermomechanical behaviors, wafer/panel level fan-out packaging, power electronic packaging, and application of emerging devices.
I am pleased to invite you to submit manuscripts to this Special Issue on “Reliability Evaluation, Simulation, and Mechanical Analysis of Materials for Advanced Electronic Package” in the form of research papers, communications, letters, and review articles. We look forward to your participation in this Special Issue of Materials.
Prof. Dr. Chang-Chun Lee
Guest Editor
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Keywords
- electronic package
- reliability
- assembly
- fan-out package
- 3D-IC package
- warpage estimation
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