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Reliability Evaluation, Simulation and Mechanical Analysis of Materials for Advanced Electronic Packaging

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A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".

Deadline for manuscript submissions: closed (10 November 2023) | Viewed by 23763

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Prof. Dr. Chang-Chun Lee

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Guest Editor

Department of Power Mechanical Engineering, National Tsing Hua University, No. 101, Section 2, Kuang-Fu Road, Hsinchu City 30013, Taiwan
Interests: mechanical designs and integrations of 3D IC system; back-end of line (BEOL) process enhancement and reliability investigation of nano-micro devices; strain silicon engineering; advanced microsystem packaging; computational solid mechanics; thin film mechanics; coupled-field nonlinear finite element analysis

Special Issue Information

Dear Colleagues,

To overcome the limited operational speed for nano-scaled transistors, scaling electronic devices to small and thin packaging and high-density arrangements has become the technological mainstream in designing versatile packaging architectures. Among these, a promising candidate is the advanced electronic package due to its excellent capability of heterogeneous integration. However, sequential reliability is a troublesome concern given the complex packaging structure, especially for the simulation, mechanical analysis of adopted new packaging materials, packaging framework, and so on. To address this issue, advanced concepts and approaches of packaging reliability evaluation and mechanical analysis are developed to combine chips with different sizes, process nodes, and technologies. To achieve a high operating performance, reduced cost, reliable thermal management, and mechanical stability, assessment approaches to structural design, process flow, and material characteristics with regard to related reliability problems need to be developed through experimental/numerical and theoretical work. Accordingly, this Special Issue aims to demonstrate and disseminate original ideas on reliability evaluation, simulation, and mechanical analysis of materials for advanced electronic package, including physical and numerical modeling in mechanical characteristics and interactions, 2.5D/3D integrated circuits, applications of artificial intelligence and the IoT on advanced package, material characteristics in electronic packaging and its thermomechanical behaviors, wafer/panel level fan-out packaging, power electronic packaging, and application of emerging devices.

I am pleased to invite you to submit manuscripts to this Special Issue on “Reliability Evaluation, Simulation, and Mechanical Analysis of Materials for Advanced Electronic Package” in the form of research papers, communications, letters, and review articles. We look forward to your participation in this Special Issue of Materials.

Prof. Dr. Chang-Chun Lee
Guest Editor

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Keywords

electronic package
reliability
assembly
fan-out package
3D-IC package
warpage estimation

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Published Papers (7 papers)

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Research

11 pages, 3792 KiB

Open AccessArticle

Recrystallization and Grain Growth in Cu-Cu Joints under Electromigration at Low Temperatures

by Shih-Chi Yang, Dinh-Phuc Tran and Chih Chen

Materials 2023, 16(17), 5822; https://doi.org/10.3390/ma16175822 - 25 Aug 2023

Cited by 12 | Viewed by 2472

Abstract

The behavior of recrystallization and grain growth was examined in Cu-Cu joints during electromigration at 150 °C. Recrystallization and grain growth were observed in all the joints after electromigration for 9000 h. Voiding was formed in Cu current-feeding lines and in bonding interfaces, and resistance increased with time due to the void formation. However, instead of rising abruptly, the resistance of certain Cu joints dropped after 7000 h. Microstructural analysis revealed that a large grain growth occurred in these joints at 150 °C, and the bonding interface was eliminated. Therefore, the electromigration lifetime can be prolonged for these joints. Full article

(This article belongs to the Special Issue Reliability Evaluation, Simulation and Mechanical Analysis of Materials for Advanced Electronic Packaging)

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13 pages, 7797 KiB

Open AccessArticle

Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions

by Meng-Kai Shih, Yu-Hao Liu, Calvin Lee and C. P. Hung

Materials 2023, 16(12), 4291; https://doi.org/10.3390/ma16124291 - 9 Jun 2023

Cited by 5 | Viewed by 4297

Abstract

Flip Chip Ball Grid Array (FCBGA) packages, together with many other heterogeneous integration packages, are widely used in high I/O (Input/Output) density and high-performance computing applications. The thermal dissipation efficiency of such packages is often improved through the use of an external heat sink. However, the heat sink increases the solder joint inelastic strain energy density, and thus reduces the board-level thermal cycling test reliability. The present study constructs a three-dimensional (3D) numerical model to investigate the solder joint reliability of a lidless on-board FCBGA package with heat sink effects under thermal cycling testing, in accordance with JEDEC standard test condition G (a thermal range of −40 to 125 °C and a dwell/ramp time of 15/15 min). The validity of the numerical model is confirmed by comparing the predicted warpage of the FCBGA package with the experimental measurements obtained using a shadow moiré system. The effects of the heat sink and loading distance on the solder joint reliability performance are then examined. It is shown that the addition of the heat sink and a longer loading distance increase the solder ball creep strain energy density (CSED) and degrade the package reliability performance accordingly. Full article

(This article belongs to the Special Issue Reliability Evaluation, Simulation and Mechanical Analysis of Materials for Advanced Electronic Packaging)

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15 pages, 5697 KiB

Open AccessArticle

Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging

by Wan-Chun Chuang, Yi Huang and Po-En Chen

Materials 2023, 16(9), 3482; https://doi.org/10.3390/ma16093482 - 30 Apr 2023

Cited by 7 | Viewed by 5628

Abstract

This study investigated the impact of material properties of epoxy molding compounds on wafer warpage in fan-out wafer-level packaging. As there is currently a lack of comprehensive discussion on the various material property parameters of EMC materials, it is essential to identify the critical influencing factors and quantify the effects of each parameter on wafer warpage. The material properties include Young’s modulus of the epoxy molding compound before and after the glass transition temperature (Tg) range of 25–35 °C (E_L) and 235–260 °C (E_H), coefficient of thermal expansion (α1, α2), and the temperature change (∆T) between E_L and E_H. Results show that, within the range of extreme values of material properties, E_L and α1 are the critical factors that affect wafer warpage during the decarrier process in fan-out packaging. α1 has a more significant impact on wafer warpage compared with E_L. E_H, α2, Tg, and ∆T have little influence on wafer warpage. Additionally, the study identified the optimized material property of the epoxy molding compound that can reduce the maximum wafer warpage in the X and Y directions from initial values of 7.34 mm and 7.189 mm to 0.545 mm and 0.45 mm, respectively, resulting in a reduction of wafer warpage of 92.58% (X direction) and 93.74% (Y direction). Thus, this study proposes an approach for evaluating the impact of material properties of epoxy molding compounds on wafer warpage in fan-out wafer-level packaging. The approach aims to address the issue of excessive wafer warpage due to material variation and to provide criteria for selecting appropriate epoxy molding compounds to enhance process yield in packaging production lines. Full article

(This article belongs to the Special Issue Reliability Evaluation, Simulation and Mechanical Analysis of Materials for Advanced Electronic Packaging)

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23 pages, 11083 KiB

Open AccessArticle

Measurements and Modelling of Thermally Induced Warpages of DIMM Socket Server PCB Assembly after Solder Reflow Processes

by Ming-Yi Tsai, Yu-Wen Wang, Yen-Jui Lu, Tzu-Min Lu and Shu-Tan Chung

Materials 2023, 16(8), 3233; https://doi.org/10.3390/ma16083233 - 19 Apr 2023

Cited by 6 | Viewed by 2249

Abstract

The thermal warpage of a server-computer-used DIMM socket-PCB assembly after the solder reflow process is studied experimentally, theoretically, and numerically, especially along the socket lines and over the entire assembly. Strain gauge and shadow moiré are used for determining the coefficients of thermal expansion of the PCB and DIMM sockets and for measuring the thermal warpages of the socket-PCB assembly, respectively, while a newly proposed theory and a finite element method (FEM) simulation are used to calculate the thermal warpage of the socket-PCB assembly in order to understand its thermo-mechanical behavior and then further identify some important parameters. The results show that the theoretical solution validated by the FEM simulation provides the mechanics with the critical parameters. In addition, the cylindrical-like thermal deformation and warpage, measured by the moiré experiment, are also consistent with the theory and FEM simulation. Moreover, the results of the thermal warpage of the socket-PCB assembly from the strain gauge suggest a warpage dependence on the cooling rate during the solder reflow process, due to the nature of the creep behavior in the solder material. Finally, the thermal warpages of the socket-PCB assemblies after the solder reflow processes are provided through a validated FEM simulation for future designs and verification. Full article

(This article belongs to the Special Issue Reliability Evaluation, Simulation and Mechanical Analysis of Materials for Advanced Electronic Packaging)

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26 pages, 12812 KiB

Open AccessArticle

Analysis and Modeling of Aged SAC-Bi Solder Joints Subjected to Varying Stress Cycling Conditions

by Minghong Jian, Sa’d Hamasha, Ali Alahmer, Mohammad Hamasha, Xin Wei, Mohamed El Amine Belhadi and Khozima Hamasha

Materials 2023, 16(2), 750; https://doi.org/10.3390/ma16020750 - 12 Jan 2023

Cited by 14 | Viewed by 2319

Abstract

Solder joints are subjected to varied stress cycle circumstances in the electronic packaging service life but are also influenced by aging. There has been limited investigation into the influence of aging and varying cycles on SnAgCu-Bi (SAC-Bi) solder joint fatigue. Cyclic fatigue tests were performed on solder joints of several alloys, including SnAgCu (SAC305), SnAgCu-Bi (SAC-Q), and SnCu-Bi (SAC-R). Individual solder joints were cycled under varying stress levels, alternating between mild and harsh stress levels. At least seven samples were prepared for each alloy by alternating between 25 mild stress (MS) cycles and three harsh stress (HS) cycles until the solder joint broke off. The impact of aging on Bi-doped solder joints fatigue under varied amplitude stress was examined and predicted for 10 and 1000 h under 125 °C. Because of the “Step-up” phenomenon of inelastic work, a new fatigue model was developed based on the common damage accumulation (CDA) model. The experimental results revealed that aging reduced the fatigue life of the tested solder alloys, particularly that of SAC305. According to the CDA model, all solder alloys failed earlier than expected after aging. The proposed model uses the amplification factor to assess inelastic work amplification after switching between the MS and HS cycles under varying stress amplitude conditions. The amplification factor for the SAC-Bi solder alloys increased linearly with fracture initiation and substantially followed crack propagation until the final failure. Compared with existing damage accumulation models, the proposed fatigue model provides a more accurate estimation of damage accumulation. For each case, the cut-off positions were examined. The SAC-Q amplification factor increased linearly to 83% of its overall life, which was much higher than that of SAC305 and SAC-R. This study identified three distinct failure modes: ductile, brittle, and near intermetallic compound (IMC) failure. It was also observed that SAC-Q with an organic solderability preservatives (OSP) surface finish was more susceptible to brittle failure owing to the excessive brittleness of the alloy material. Full article

(This article belongs to the Special Issue Reliability Evaluation, Simulation and Mechanical Analysis of Materials for Advanced Electronic Packaging)

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11 pages, 3029 KiB

Open AccessArticle

Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach

by Shih-Hung Wang, Wensyang Hsu, Yan-Yu Liou, Pei-Chen Huang and Chang-Chun Lee

Materials 2022, 15(20), 7357; https://doi.org/10.3390/ma15207357 - 20 Oct 2022

Cited by 5 | Viewed by 2387

Abstract

In glass interposer architecture and its assembly process, the mechanical responses of interposer structure under thermocompression process-induced thermal loading and generated shrinkage of molding material are regarded as a major reliability issue. Thousands of metal-filled via are involved in glass interposers and are regarded as a potential risk that can lead to cracking and the failure of an entire vehicle. In this study, a finite element-based submodeling approach is demonstrated to overcome the complexity of modeling and the relevant convergence issue of interposer architecture. Convergence analysis results revealed that at least four via pitch-wide regions of a local simulation model were needed to obtain the stable results enabled by the submodeling simulation approach. The stress-generation mechanism during thermocompression, the coefficient of thermal expansion mismatch, and the curing process-induced shrinkage were separately investigated. The critical stress location was explored as the outer corner of the chip, and the maximum first principal stress during the thermocompression process generated on the chip and glass interposer were 34 and 120 MPa, respectively. Full article

(This article belongs to the Special Issue Reliability Evaluation, Simulation and Mechanical Analysis of Materials for Advanced Electronic Packaging)

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22 pages, 16279 KiB

Open AccessArticle

The Effect of Micro-Alloying and Surface Finishes on the Thermal Cycling Reliability of Doped SAC Solder Alloys

by Francy John Akkara, Sa’d Hamasha, Ali Alahmer, John Evans, Mohamed El Amine Belhadi and Xin Wei

Materials 2022, 15(19), 6759; https://doi.org/10.3390/ma15196759 - 29 Sep 2022

Cited by 31 | Viewed by 3628

Abstract

The surface finish (SF) becomes a part of the solder joint during assembly and improves the component’s reliability. Furthermore, the SF influences the solder joint’s reliability by affecting the thickness of the intermetallic compound (IMC) layer at the solder interface and copper pads. In this experiment, five different alloys are used and compared with the SAC305 alloy, two of which, Innolot and SAC-Bi, are bi-based solder alloys. This study includes three common SFs: electroless nickel immersion gold (ENIG), immersion silver (ImAg), and organic solderability preserve (OSP). The performance of three surface finishes is examined in terms of component characteristic life. All of the boards were isothermally aged for twelve months at 125 °C. The boards were then exposed to 5000 cycles of thermal cycling at temperatures ranging from −40–+125 °C. Most of the current research considers only one or two factors affecting the reliability of the electronic package. This study combines the effect of multiple factors, including solder paste content, SF, isothermal aging, and thermal cycling, to ensure that the test conditions represent real-world applications. In addition, the electronics packages are assembled using commercialized alloys. The current study focuses on a high-performance alloy already present in the electronic market. The failure data were analyzed statistically using the Weibull distribution and design of experiments (DOE) analysis of variance (ANOVA) techniques. The findings reveal that the micro and uniformly distributed precipitates in solder microstructures are critical for high-reliability solder joints. Re-crystallization of the thermally cycled solder joints promotes the local formation of numerous new grains in stress-concentrated zones. As the fracture spreads along these grain boundaries and eventually fails, these new grains participate in crack propagation. Aging significantly worsens this situation. Finally, although the ENIG surface finish with its Ni layer outperforms other SFs, this does not imply that ENIG is more reliable in all solder paste/sphere/finish combinations. Full article

(This article belongs to the Special Issue Reliability Evaluation, Simulation and Mechanical Analysis of Materials for Advanced Electronic Packaging)

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