Journal Menu► ▼ Journal Menu
Journal Browser► ▼ Journal Browser
Special Issue "Diffusion Bonding of Metals"
A special issue of Metals (ISSN 2075-4701).
Deadline for manuscript submissions: 29 February 2020.
Interests: joining technologies, diffusion bonding, laser welding, materials technology, materials diagnostics; application of new materials; corrosion phenomena
Diffusion bonding is an amazing technology for producing holohedral joints, and also of internal structures. Although expensive equipment is required to maintain an inert atmosphere at high temperatures, and an external load has to be applied to the parts to be joined, diffusion bonding is used extensively in, e.g., aerospace industries and for internal cooling structures for molding tools.
The main process parameters are bonding temperature, dwell time, and bearing pressure. In addition, the aspect ratio and the number of layers to be bonded affect deformation during the diffusion bonding process.
Furthermore, additional issues must be considered to reach the goal, forming a monolithic part with vacuum tightness and resistance to high internal pressures by grain growth across bonding planes. For this, surface roughness must be leveled. Apart from the roughness values affecting vacuum tightness, the number of layers has an impact on the degree of deformation.
Materials science aspects resulting from the heat treatment, such as grain growth and its impact on mechanical or corrosive properties of the materials, must be considered.
To facilitate grain growth across bonding planes, the passivation layer must be soluble in the bulk material or must be removed by appropriate surface preparation, e.g. by brushing or pickling.
Interlayers like thin amorphous foils or additional metals deposited by PVD-processes may facilitate bonding by formation of a temporary liquid phase due to high interfacial energy or forming eutectic compositions. The occurrence of liquid phases at considerably lower temperature helps to limit grain growth of the matrix material, and the coefficient of diffusion in liquids is several orders of magnitude higher than in solids.
For this Special Issue in Metals, we welcome research articles and reviews addressing theoretical aspects, specific designs for diffusion bonding, diffusion bonding equipment, surface preparation, bonding experiments of all kinds of metallic materials, including use of different inter- and multilayers, preparation and characterization of diffusion-bonded parts, as well as examples of applications of diffusion bonding.
Dr. Thomas Gietzelt
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- Diffusion bonding
- Diffusion welding
- Temporary liquid phase (TLP)
- Amorphous interlayer
- Surface pretreatment
- Passivation layer
- Aspect ratio
- Micro process engineering