Journal Description
Electronic Materials
Electronic Materials
is an international, peer-reviewed, open access journal on fundamental science, engineering, and practical applications of electronic materials published quarterly online by MDPI.
- Open Access— free for readers, with article processing charges (APC) paid by authors or their institutions.
- High Visibility: indexed within Scopus, Ei Compendex, and other databases.
- Rapid Publication: manuscripts are peer-reviewed and a first decision is provided to authors approximately 26.6 days after submission; acceptance to publication is undertaken in 5.2 days (median values for papers published in this journal in the first half of 2025).
- Journal Rank: CiteScore - Q2 (Electrical and Electronic Engineering)
- Recognition of Reviewers: APC discount vouchers, optional signed peer review, and reviewer names published annually in the journal.
- Electronic Materials is a companion journal of Materials.
Latest Articles
Reliability of Fine-Pitch Cu-Microbumps for 3D Heterogeneous Integration: Effect of Solder, Pitch Scaling and Substrate Materials
Electron. Mater. 2025, 6(4), 18; https://doi.org/10.3390/electronicmat6040018 - 3 Nov 2025
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A new and transformative era in semiconductor packaging is underway, wherein, there is a shift from transistor scaling to system scaling and integration through advanced packaging. For advanced packaging, interconnect scaling is a key driver, with interconnect density requirements for chip-to-substrate microbump pitch
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A new and transformative era in semiconductor packaging is underway, wherein, there is a shift from transistor scaling to system scaling and integration through advanced packaging. For advanced packaging, interconnect scaling is a key driver, with interconnect density requirements for chip-to-substrate microbump pitch below 5 μm and half-line pitch below 1 μm for Cu redistribution layer (RDL). Here, we present a comprehensive theoretical comparison of thermal cycling behavior in accordance with JESD22-A104D standard, intermetallic thickness evolution, and steady-state thermal analysis of Cu-microbump assembly for different bonding materials and substrates. Bonding materials studied include solder caps such as SAC105 (Sn98.5Ag1.0Cu0.5), eutectic Sn-Pb (Sn63Pb37), eutectic Sn-Bi (Sn42Bi58), Pb95Sn5, Indium, and Cu-Cu TCB structure. Effect of substrates including Si, glass and FR-4 is evaluated for various microbump structures with varying pitches (85 µm, 40 µm, 10 µm, and 5 µm) on their fatigue life. Results indicate that for Cu-microbump assemblies at an 85 µm pitch. The Pb95Sn5 exhibits the longest predicted fatigue life (3267 cycles by Engelmaier and 452 cycles by Darveaux), while SAC105 shows the shortest (320 and 103 cycles). Additionally, the Cu-Cu TCB structure achieves an estimated lifetime of approximately 7800 cycles, which is significantly higher than all solder-based Cu-microbump assemblies. The findings contribute to advanced packaging applications by providing valuable theoretical references for optimizing solder materials and structural configurations.
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Open AccessArticle
An Efficient Electrostatic Discharge Analytical Model for a Local Bottom-Gate Carbon Nanotube Field-Effect Transistor
by
Weiyi Zheng, Yuyan Zhang, Zhifeng Chen, Qiaoying Gan, Xuefang Xiao, Ying Gao, Jianhua Jiang and Chengying Chen
Electron. Mater. 2025, 6(4), 17; https://doi.org/10.3390/electronicmat6040017 - 23 Oct 2025
Abstract
In the post-Moore era, carbon nanotube field-effect transistors (CNTFETs) are a promising alternative to complementary metal-oxide-semiconductor (CMOS) technology at and below the 5 nm node. Compact models bridge circuit design and device physics, yet the electrostatic discharge (ESD) behavior of CNTFETs remains insufficiently
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In the post-Moore era, carbon nanotube field-effect transistors (CNTFETs) are a promising alternative to complementary metal-oxide-semiconductor (CMOS) technology at and below the 5 nm node. Compact models bridge circuit design and device physics, yet the electrostatic discharge (ESD) behavior of CNTFETs remains insufficiently captured. Focusing on the local bottom-gate (LBG) CNTFET structure, which offers enhanced gate control due to its bottom-gate configuration, this paper investigates three dominant ESD-triggering mechanisms—thermionic current, tunneling leakage current, and thermal failure breakdown. Then, a hybrid compact–behavioral ESD model for CNTFETs is established. After theoretical derivation and comparison with test results, the model parameters are optimized through fitting. The simulation results exhibit excellent agreement with CNTFET measurements, particularly capturing the Human Body Model (HBM) pre-charge threshold phenomenon at 72 V and accurately predicting the subsequent voltage collapse behavior. This validates the accuracy and effectiveness of the model, laying a theoretical and experimental foundation for further construction of carbon-based standard-cell and I/O libraries.
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(This article belongs to the Special Issue Feature Papers of Electronic Materials—Third Edition)
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Open AccessReview
Recent Advances in Triboelectric Materials for Active Health Applications
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Chang Peng, Yuetong Lin, Zhenyu Jiang, Yiping Liu, Licheng Zhou, Zejia Liu, Liqun Tang and Bao Yang
Electron. Mater. 2025, 6(4), 16; https://doi.org/10.3390/electronicmat6040016 - 23 Oct 2025
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Triboelectric materials can convert irregular mechanical stimuli from human motion or environmental sources into high surface charge densities and instantaneous electrical outputs. Their intrinsic properties, such as flexibility, stretchability, chemical tunability, and compatibility with diverse substrates, play a critical role in determining the
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Triboelectric materials can convert irregular mechanical stimuli from human motion or environmental sources into high surface charge densities and instantaneous electrical outputs. Their intrinsic properties, such as flexibility, stretchability, chemical tunability, and compatibility with diverse substrates, play a critical role in determining the efficiency and reliability of triboelectric devices. In the context of active health, triboelectric materials not only serve as the core functional layers for self-powered sensing but also enable real-time physiological monitoring, motion tracking, and human–machine interaction by directly transducing biomechanical signals into electrical information. Soft triboelectric sensors exhibit high sensitivity, wide operational ranges, excellent biocompatibility, and wearability, making them highly promising for active health monitoring applications. Despite these advantages, challenges remain in enhancing surface charge density, achieving effective signal multiplexing, and ensuring long-term stability. This review provides a comprehensive overview of triboelectric mechanisms, working modes, influencing factors, performance enhancement strategies, and wearable health applications. Finally, it systematically summarizes the key improvement approaches and future development directions of triboelectric materials for active health, offering valuable guidance for advancing wearable self-powered biosensors.
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(This article belongs to the Special Issue Feature Papers of Electronic Materials—Third Edition)
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Open AccessCommunication
Nanoswelling Structures of Silicone Rubber Under Aluminum Nanoparticles Induced by 193 nm ArF Excimer Laser
by
Masayuki Okoshi
Electron. Mater. 2025, 6(4), 15; https://doi.org/10.3390/electronicmat6040015 - 21 Oct 2025
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In metal nanoparticles, localized surface plasmon resonance occurs due to the interaction between electrons on the surface and light. Among them, aluminum (Al) nanoparticles are known to have a resonant absorption wavelength in the ultraviolet light region. In this paper, I found a
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In metal nanoparticles, localized surface plasmon resonance occurs due to the interaction between electrons on the surface and light. Among them, aluminum (Al) nanoparticles are known to have a resonant absorption wavelength in the ultraviolet light region. In this paper, I found a new phenomenon in which nanoswelling structures are formed on the silicone rubber surface by distributing Al nanoparticles on the surface and irradiating them uniformly with an ArF excimer laser at a wavelength of 193 nm. The formation of the nanoswelling structure was not observed when gold nanoparticles were distributed. Thus, the mechanism of nanoswelling structure formation is considered as follows: localized surface plasmon resonance is induced in the Al nanoparticles by the interaction between the Al nanoparticles and the ArF excimer laser, which causes photodissociation of the Si-O-Si bonds of the silicone rubber underneath, volume expansion due to molecular weight reduction, and swelling to nanometer sizes. The present study provides a new biomimetic method for ensuring the mechano-bactericidal functions of a silicone rubber surface to develop highly functional plastic windows for automobiles.
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Open AccessArticle
Impact of SiN Passivation on Dynamic-RON Degradation of 100 V p-GaN Gate AlGaN/GaN HEMTs
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Marcello Cioni, Giacomo Cappellini, Giovanni Giorgino, Alessandro Chini, Antonino Parisi, Cristina Miccoli, Maria Eloisa Castagna, Aurore Constant and Ferdinando Iucolano
Electron. Mater. 2025, 6(4), 14; https://doi.org/10.3390/electronicmat6040014 - 7 Oct 2025
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In this paper, the impact of SiN passivation on dynamic-RON degradation of AlGaN/GaN HEMTs devices is put in evidence. To this end, samples showing different SiN passivation stoichiometry are considered, labeled as Sample A and Sample B. For dynamic-RON tests, two
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In this paper, the impact of SiN passivation on dynamic-RON degradation of AlGaN/GaN HEMTs devices is put in evidence. To this end, samples showing different SiN passivation stoichiometry are considered, labeled as Sample A and Sample B. For dynamic-RON tests, two different experimental setups are employed to investigate the RON-drift showing up during conventional switch mode operation by driving the DUTs under both (i) resistive load and (ii) soft-switching trajectory. This allows to discern the impact of hot carriers and off-state drain voltage stress on the RON parameter drift. Measurements performed with both switching loci shows similar dynamic-RON response, indicating that hot carriers are not involved in the degradation of tested devices. Nevertheless, a significant difference was observed between Sample A and Sample B, with the former showing an additional RON-degradation mechanism, not present on the latter. This additional drift is totally ascribed to the SiN passivation layer and is confirmed by the different leakage current measured across the two SiN types. The mechanism is explained by the injection of negative charges from the Source Field-Plate towards the AlGaN surface that are captured by surface/dielectric states and partially depletes the 2DEG underneath.
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Open AccessArticle
Development of Water-Developable Negative Photoresist for i-Line Photolithography Using Cellulose Derivatives with Underlayer
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Hiryu Hayashi, Yuna Hachikubo, Mano Ando, Misaki Oshima, Mayu Morita and Satoshi Takei
Electron. Mater. 2025, 6(4), 13; https://doi.org/10.3390/electronicmat6040013 - 25 Sep 2025
Abstract
Water-developable photoresist was synthesized by introducing methacrylate groups into hydroxypropyl cellulose (HPC), a cellulose derivative, via substitution of hydroxyl groups. The material enabled micropatterning through ultraviolet (UV) exposure at a wavelength of 365 nm with an exposure dose of 450 mJ/cm2.
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Water-developable photoresist was synthesized by introducing methacrylate groups into hydroxypropyl cellulose (HPC), a cellulose derivative, via substitution of hydroxyl groups. The material enabled micropatterning through ultraviolet (UV) exposure at a wavelength of 365 nm with an exposure dose of 450 mJ/cm2. Line and dot micropatterns were formed on polypropylene substrates applying underlayer, achieving resolutions of 4.5 µm and 5.0 µm, respectively. The photoresist demonstrated superior etching resistance under CF4 plasma compared to another water-soluble photo resist. Unlike conventional photoresists that require hazardous organic solvents, this water-developable photoresist offers an environmentally friendly alternative, reducing health risks and environmental impact in the electronics industry.
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(This article belongs to the Special Issue Feature Papers of Electronic Materials—Third Edition)
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Open AccessArticle
Boosted Nonlinear Optical Properties of Polypyrrole Nanoplates Covered with Graphene Layers
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Zeyu Zhang, Lingdong Wang, Lili Xie, Feifei Qin and Xu Wang
Electron. Mater. 2025, 6(3), 12; https://doi.org/10.3390/electronicmat6030012 - 17 Sep 2025
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The combination of polypyrrole (PPy) with graphene has attracted extensive attention as a nonlinear optical material with various optoelectronic applications. Here, we describe the development of PPy nanoplates prepared using a simple spin-coating method. The appropriate volume of the dropped PPy solution was
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The combination of polypyrrole (PPy) with graphene has attracted extensive attention as a nonlinear optical material with various optoelectronic applications. Here, we describe the development of PPy nanoplates prepared using a simple spin-coating method. The appropriate volume of the dropped PPy solution was determined to be 50 drops by comparing the surface morphologies, chain structures, elementary compositions, and optical properties of PPy saturable absorbers (SAs). The hybrid PPy/graphene heterostructure SA was obtained using the wet transfer process of a graphene layer. This approach led to significant improvements in optical properties, including a ~7.2% increase in linear optical absorption, a 2.5-fold increase in modulation depth, and a third decrease in saturable intensity at 1550 nm due to the additional optical absorption and the π-π interaction between PPy nanoplates and the graphene layer. By inserting the PPy/graphene heterostructure SA into the passively mode-locked fiber laser cavity, 1559 nm ultrashort laser pulses were generated, with an average output power of 1.24 mW, a 815 fs pulse width, and a repetition frequency of 3.26 MHz. Our experimental results demonstrate that the prepared PPy SA has excellent nonlinear optical characteristics, providing a new opportunity for the generation of ultrashort laser pulses.
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Open AccessArticle
Mole Fraction Dependent Passive Voltage Amplification in FE-DE Heterostructure
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Archana Chamarahalli Manjunatha, Pratheeksha Suresh, Akshatha Bhat, Vikash Mishra, Yashwanth Nanjappa, Bhaskar Awadhiya and Sachin Agrawal
Electron. Mater. 2025, 6(3), 11; https://doi.org/10.3390/electronicmat6030011 - 20 Aug 2025
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This paper explores ferroelectric–dielectric heterostructures comprising a ferroelectric oxide (Lead Zirconium Titanate ) with a varying mole fraction and a fixed dielectric oxide (Silicon dioxide
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This paper explores ferroelectric–dielectric heterostructures comprising a ferroelectric oxide (Lead Zirconium Titanate ) with a varying mole fraction and a fixed dielectric oxide (Silicon dioxide ). The study aims to enhance capacitance, optimize voltage amplification, and achieve stable negative capacitance. An isolated ferroelectric capacitor is examined by varying mole fractions of ferroelectric oxide. The negative capacitance in isolated ferroelectric capacitor is highly unstable in nature. The instability problem is fixed and the overall capacitance of the heterostructure is raised while the negative capacitance is stabilized by connecting a dielectric oxide in series with the ferroelectric capacitor. is utilized as the ferroelectric oxide, with mole fractions . Among the investigated mole fractions, ferroelectric oxide with offers the maximum voltage amplification and improved capacitance because its capacitance closely matches the dielectric capacitance. Also, dynamic response and temperature analysis of heterostructure are studied further.
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Open AccessArticle
Impact of Cu-Site Dopants on Thermoelectric Power Factor for Famatinite (Cu3SbS4) Nanomaterials
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Jacob E. Daniel, Evan Watkins, Mitchel S. Jensen, Allen Benton III, Apparao Rao, Sriparna Bhattacharya and Mary E. Anderson
Electron. Mater. 2025, 6(3), 10; https://doi.org/10.3390/electronicmat6030010 - 6 Aug 2025
Abstract
Famatinite (Cu3SbS4) is an earth-abundant, nontoxic material with potential for thermoelectric energy generation applications. Herein, rapid, energy-efficient, and facile one-pot modified polyol synthesis was utilized to produce gram-scale quantities of phase-pure famatinite (Cu2.7M0.3SbS4,
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Famatinite (Cu3SbS4) is an earth-abundant, nontoxic material with potential for thermoelectric energy generation applications. Herein, rapid, energy-efficient, and facile one-pot modified polyol synthesis was utilized to produce gram-scale quantities of phase-pure famatinite (Cu2.7M0.3SbS4, M = Cu, Zn, Mn) nanoparticles (diameter 20–30 nm) with controllable and stoichiometric incorporation of transition metal dopants on the Cu-site. To produce pellets for thermoelectric characterization, the densification process by spark plasma sintering was optimized for individual samples based on thermal stability determined using differential scanning calorimetry and thermogravimetric analysis. Electronic transport properties of undoped and doped famatinite nanoparticles were studied from 225–575 K, and the thermoelectric power factor was calculated. This is the first time electronic transport properties of famatinite doped with Zn or Mn have been studied. All famatinite samples had similar resistivities (>0.8 mΩ·m) in the measured temperature range. However, the Mn-doped famatinite nanomaterials exhibited a thermoelectric power factor of 10.3 mW·m−1·K−1 at 575 K, which represented a significant increase relative to the undoped nanomaterials and Zn-doped nanomaterials engendered by an elevated Seebeck coefficient of ~220 µV·K−1 at 575 K. Future investigations into optimizing the thermoelectric properties of Mn-doped famatinite nanomaterials are promising avenues of research for producing low-cost, environmentally friendly, high-performing thermoelectric materials.
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(This article belongs to the Special Issue Feature Papers of Electronic Materials—Third Edition)
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Open AccessArticle
Thermal Characterization Methods of Novel Substrate Materials Utilized in IGBT Modules
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János Hegedüs, Péter Gábor Szabó, László Pohl, Gusztáv Hantos, Gyula Lipák, Andrea Reolon and Ferenc Ender
Electron. Mater. 2025, 6(3), 9; https://doi.org/10.3390/electronicmat6030009 - 31 Jul 2025
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In this article, thermal investigation methods for electrically insulating and thermally conductive substrate materials will be presented. The investigations were performed in their real-world application environment, i.e., in the form of IGBT (insulated gate bipolar transistor) module substrate plates. First, the overall thermal
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In this article, thermal investigation methods for electrically insulating and thermally conductive substrate materials will be presented. The investigations were performed in their real-world application environment, i.e., in the form of IGBT (insulated gate bipolar transistor) module substrate plates. First, the overall thermal resistance and thermal structure function of the system in a multivariable parameter space were revealed using CFD (computational fluid dynamics) simulations. Afterwards, thermal transient testing was performed on real samples, with the help of which the thermal resistance values of the modules were determined using the thermal dual interface test method. The presented tests are not intended to determine material parameters, but to rank different substrate materials based on their thermal performance.
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Open AccessArticle
Optical Properties of a-SiC:H Thin Films Deposited by Magnetron Sputtering
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Christina Veneti, Lykourgos Magafas and Panagiota Papadopoulou
Electron. Mater. 2025, 6(2), 8; https://doi.org/10.3390/electronicmat6020008 - 18 Jun 2025
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In the present work a-SiC:H thin films were prepared using magnetron sputtering technique for different substrate temperatures from 100 °C to 290 °C. Their optical properties were studied using the ellipsometry technique. The experimental results show that the optical band gap of the
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In the present work a-SiC:H thin films were prepared using magnetron sputtering technique for different substrate temperatures from 100 °C to 290 °C. Their optical properties were studied using the ellipsometry technique. The experimental results show that the optical band gap of the films varies from 2.00 eV to 2.18 eV for the hydrogenated films, whereas the Eg is equal to 1.29 eV when the film does not contain hydrogen atoms and for Ts = 100 °C. The refractive index has been observed to remain stable in the region of 100 °C–220 °C, whereas it drops significantly when the temperature of 290 °C is reached. Additionally, the refractive index exhibits an inverse relationship with Eg as a function of Ts. Notably, these thin films were deposited 12 years ago, and their optical properties have remained stable since then.
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Open AccessReview
Screen Printing for Energy Storage and Functional Electronics: A Review
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Juan C. Rubio and Martin Bolduc
Electron. Mater. 2025, 6(2), 7; https://doi.org/10.3390/electronicmat6020007 - 30 May 2025
Cited by 3
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Printed electronics employ established printing methods to create low-cost, mechanically flexible devices including batteries, supercapacitors, sensors, antennas and RFID tags on plastic, paper and textile substrates. This review focuses on the specific contribution of screen printing to that landscape, examining how ink viscosity,
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Printed electronics employ established printing methods to create low-cost, mechanically flexible devices including batteries, supercapacitors, sensors, antennas and RFID tags on plastic, paper and textile substrates. This review focuses on the specific contribution of screen printing to that landscape, examining how ink viscosity, mesh selection and squeegee dynamics govern film uniformity, pattern resolution and ultimately device performance. Recent progress in advanced ink systems is surveyed, highlighting carbon allotropes (graphene, carbon nano-onions, carbon nanotubes, graphite), silver and copper nanostructures, MXene and functional oxides that collectively enhance mechanical robustness, electrical conductivity and radio-frequency behavior. Parallel improvements in substrate engineering such as polyimide, PET, TPU, cellulose and elastomers demonstrate the technique’s capacity to accommodate complex geometries for wearable, medical and industrial applications while supporting environmentally responsible material choices such as water-borne binders and bio-based solvents. By mapping two decades of developments across energy-storage layers and functional electronics, the article identifies the key process elements, recurring challenges and emerging sustainable practices that will guide future optimization of screen-printing materials and protocols for high-performance, customizable and eco-friendly flexible devices.
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Open AccessArticle
Implication of Surface Passivation on the In-Plane Charge Transport in the Oriented Thin Films of P3HT
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Nisarg Hirens Purabiarao, Kumar Vivek Gaurav, Shubham Sharma, Yoshito Ando and Shyam Sudhir Pandey
Electron. Mater. 2025, 6(2), 6; https://doi.org/10.3390/electronicmat6020006 - 7 May 2025
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Optimizing charge transport in organic semiconductors is crucial for advancing next-generation optoelectronic devices. The performance of organic field-effect transistors (OFETs) is significantly influenced by the alignment of films in the channel direction and the quality of the dielectric surface, which should be uniform,
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Optimizing charge transport in organic semiconductors is crucial for advancing next-generation optoelectronic devices. The performance of organic field-effect transistors (OFETs) is significantly influenced by the alignment of films in the channel direction and the quality of the dielectric surface, which should be uniform, smooth, and free of charge-trapping defects. Our study reports the enhancement of OFET performance using large-area, uniform, and oriented thin films of regioregular poly[3-hexylthiophene] (RR-P3HT), prepared via the Floating Film Transfer Method (FTM) on octadecyltrichlorosilane (OTS) passivated SiO2 surfaces. SiO2 surfaces inherently possess dangling bonds that act as charge traps, but these can be effectively passivated through optimized surface treatments. OTS treatment has improved the optical anisotropy of thin films and the surface wettability of SiO2. Notably, using octadecene as a solvent during OTS passivation, as opposed to toluene, resulted in a significant enhancement of charge carrier transport. Specifically, passivation with OTS-F (10 mM OTS in octadecene at 100 °C for 48 h) led to a >150 times increase in mobility and a reduction in threshold voltage compared to OTS-A (5 mM OTS in toluene for 12 h at room temperature). Under optimal conditions, these FTM-processed RR-P3HT films achieved the best device performance, with a saturated mobility (μsat) of 0.18 cm2V−1s−1.
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Open AccessArticle
Modeling of Magnetoconductivity (MC) Behavior in Dilute p-Si/SiGe/Si
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Hamza Mabchour, Yassine Essakali, Mounir El Hassan, Samir Elouaham, Boujemaa Nassiri, Said Dlimi and Abdelhamid El Kaaouachi
Electron. Mater. 2025, 6(2), 5; https://doi.org/10.3390/electronicmat6020005 - 29 Apr 2025
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In this study, we investigate the magnetoconductivity behavior in a 2D p-Si/SiGe/Si system. To achieve this, we develop a theoretical model that incorporates three key contributions, the weak localization effect, electron–electron interaction effects, and the Zeeman effect, which is considered only in the
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In this study, we investigate the magnetoconductivity behavior in a 2D p-Si/SiGe/Si system. To achieve this, we develop a theoretical model that incorporates three key contributions, the weak localization effect, electron–electron interaction effects, and the Zeeman effect, which is considered only in the presence of a magnetic field. We then compare our theoretical predictions with experimental magnetoconductivity data, analyzing both the consistencies and discrepancies between the model and the measurements. Through this comparison, we aim to provide a deeper physical understanding of the factors influencing magnetoconductivity in this system.
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Open AccessArticle
Research on the Withstand Voltage Properties of Cr/Mn-Doped Al2O3 Ceramics in Vacuum
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Dandan Feng, Xiaojing Wang, Xueying Han, Zhiqiang Yu, Jialun Feng and Hefei Wang
Electron. Mater. 2025, 6(1), 4; https://doi.org/10.3390/electronicmat6010004 - 5 Mar 2025
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Al2O3 ceramics are widely used in vacuum electronic devices. However, surface flashover in a vacuum during the application of high voltage significantly influences their reliability and restricts the development of vacuum electronic devices. The secondary electron emission yield (SEY) and
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Al2O3 ceramics are widely used in vacuum electronic devices. However, surface flashover in a vacuum during the application of high voltage significantly influences their reliability and restricts the development of vacuum electronic devices. The secondary electron emission yield (SEY) and surface resistivity of ceramics are the main factors affecting the vacuum withstand voltage of ceramic materials. In this study, the bulk density, microstructure, and surface properties—including SEY and surface resistivity—of Al2O3 ceramics were tested. The relationship between these properties and the vacuum withstand voltage of the ceramics was investigated. The influence of the addition ratio of Cr2O3 to MnO2 and the sintering temperature was investigated. The results show Cr/Mn-doped Al2O3 ceramics, with appropriate amounts of Cr2O3 and MnO2 and sintered at suitable temperatures, exhibit low SEY, high withstand voltage, and excellent stability in vacuum.
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Open AccessArticle
Determination of the Band Gap Energy of SnO2 and ZnO Thin Films with Different Crystalline Qualities and Doping Levels
by
Cecilia Guillén
Electron. Mater. 2025, 6(1), 3; https://doi.org/10.3390/electronicmat6010003 - 20 Feb 2025
Cited by 9
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This research is on the structural, optical, and electrical properties of SnO2 and ZnO thin films, which are increasingly used in many electronic devices, including gas sensors, light-emitting diodes, and solar cells. For the various applications, it is essential to accurately determine
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This research is on the structural, optical, and electrical properties of SnO2 and ZnO thin films, which are increasingly used in many electronic devices, including gas sensors, light-emitting diodes, and solar cells. For the various applications, it is essential to accurately determine the band gap energy, as it controls the optical and electrical behavior of the material. However, there is no single method for its determination; rather, different approximations depend on the crystalline quality and the doping level because these modify the energy band structure of the semiconductor. With the aim of analyzing the various approaches, SnO2 and ZnO films were prepared by sputtering on unheated glass substrates and subsequently annealed in N2 at various temperatures between 250 °C and 450 °C. These samples showed different crystallite sizes, absorption coefficients, and free carrier concentrations depending on the material and the annealing temperature. Analysis of the results shows that the expression developed for amorphous materials underestimates the band gap value, and the so-called unified method tends to overestimate it, while the equations for perfect or heavily doped crystals give band gap energies more consistent with the doping level, regardless of the crystalline quality of the films.
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Open AccessArticle
Wrapping Amorphous Indium-Gallium-Zinc-Oxide Transistors with High Current Density
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Jiaxin Liu, Shan Huang, Zhenyuan Xiao, Ning Li, Jaekyun Kim, Jidong Jin and Jiawei Zhang
Electron. Mater. 2025, 6(1), 2; https://doi.org/10.3390/electronicmat6010002 - 23 Jan 2025
Abstract
Amorphous oxide semiconductor transistors with a high current density output are highly desirable for large-area electronics. In this study, wrapping amorphous indium-gallium-zinc-oxide (a-IGZO) transistors are proposed to enhance the current density output relative to a-IGZO source-gated transistors (SGTs). Device performances are analyzed using
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Amorphous oxide semiconductor transistors with a high current density output are highly desirable for large-area electronics. In this study, wrapping amorphous indium-gallium-zinc-oxide (a-IGZO) transistors are proposed to enhance the current density output relative to a-IGZO source-gated transistors (SGTs). Device performances are analyzed using technology computer-aided design (TCAD) simulations. The TCAD simulation results reveal that, with an optimized device structure, the current density of the wrapping a-IGZO transistor can reach 7.34 μA/μm, representing an approximate two-fold enhancement compared to that of the a-IGZO SGT. Furthermore, the optimized wrapping a-IGZO transistor exhibits clear flat saturation and pinch-off behavior. The proposed wrapping a-IGZO transistors show significant potential for applications in large-area electronics.
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(This article belongs to the Special Issue Metal Oxide Semiconductors for Electronic Applications)
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Open AccessArticle
Tribological, Thermal, Kinetic, and Surface Microtextural Characterization of Prime p-Type <100> Silicon Wafer CMP for Direct Wafer Bonding Applications
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Michelle Yap, Catherine Yap, Yasa Sampurno, Glenn Whitener, Jason Keleher, Len Borucki and Ara Philipossian
Electron. Mater. 2025, 6(1), 1; https://doi.org/10.3390/electronicmat6010001 - 8 Jan 2025
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We investigated the tribological, thermal, kinetic, and surface microtextural characteristics of chemical mechanical polishing (CMP) of 300 mm p-type <100> prime silicon wafers (and their native oxide) at various pressures, sliding velocities, and starting platen temperatures. Results showed the dominant tribological mechanism for
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We investigated the tribological, thermal, kinetic, and surface microtextural characteristics of chemical mechanical polishing (CMP) of 300 mm p-type <100> prime silicon wafers (and their native oxide) at various pressures, sliding velocities, and starting platen temperatures. Results showed the dominant tribological mechanism for both native oxide and silicon polishing to be boundary lubrication. Using frictional data, we pinpointed the exact time that corresponded to the total removal of the native oxide and the onset of silicon polishing. This allowed us to separately characterize removal rates of each layer. For native oxide, while the rate depended on temperature, the presence of a temperature-independent shear force threshold and the low observed rates suggested that its removal by the slurry was dominantly mechanical. In contrast, for silicon polish, the absence of a distinctive shear force threshold and the fact that, for the same set of consumables, rates were more than 200 times larger for silicon than for native oxide suggested a dominantly chemical process with an average apparent activation energy of 0.34 eV. It was further confirmed that rate selectivity between native oxide and PE-TEOS based SiO2 control wafers was around 1 to 7, which underscored the importance of being able to directly measure native oxide removal rates. In all cases, we achieved excellent post-polish surfaces with Sa and Sq values of below 1 nm. Due to thermal softening of the thermoplastic pad at elevated temperatures, which we confirmed via dynamic mechanical analysis, overall process vibrations were significantly higher when platen heating was employed.
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Open AccessArticle
A Unified Semiconductor-Device-Physics-Based Ballistic Model for the Threshold Voltage of Modern Multiple-Gate Metal-Oxide-Semiconductor Field-Effect-Transistors
by
Te-Kuang Chiang
Electron. Mater. 2024, 5(4), 321-330; https://doi.org/10.3390/electronicmat5040020 - 13 Dec 2024
Cited by 1
Abstract
Based on the minimum conduction band edge caused by the minimum channel potential resulting from the quasi-3D scaling theory and the 3D density of state (DOS) accompanied by the Fermi–Dirac distribution function on the source and drain sides, a unified semiconductor-device-physics-based ballistic model
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Based on the minimum conduction band edge caused by the minimum channel potential resulting from the quasi-3D scaling theory and the 3D density of state (DOS) accompanied by the Fermi–Dirac distribution function on the source and drain sides, a unified semiconductor-device-physics-based ballistic model is developed for the threshold voltage of modern multiple-gate (MG) transistors, including FinFET, Ω-gate MOSFET, and nanosheet (NS) MOSFET. It is shown that the thin silicon, thin gate oxide, and high work function will alleviate ballistic effects and resist threshold voltage degradation. In addition, as the device dimension is further reduced to give rise to the 2D/1D DOS, the lowest conduction band edge is increased to resist threshold voltage degradation. The nanosheet MOSFET exhibits the largest threshold voltage among the three transistors due to the smallest minimum conduction band edge caused by the quasi-3D minimum channel potential. When the n-type MOSFET (N-FET) is compared to the P-type MOSFET (P-FET), the P-FET shows more threshold voltage because the hole has a more effective mass than the electron.
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(This article belongs to the Special Issue Metal Oxide Semiconductors for Electronic Applications)
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Open AccessReview
Polyimide-Based Dielectric Materials for High-Temperature Capacitive Energy Storage
by
Lingling Liu, Li Li, Shixian Zhang, Wenhan Xu and Qing Wang
Electron. Mater. 2024, 5(4), 303-320; https://doi.org/10.3390/electronicmat5040019 - 8 Dec 2024
Cited by 2
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Polyimide (PI) has received great attention for high-temperature capacitive energy storage materials due to its remarkable thermal stability, relatively high breakdown strength, strong mechanical properties, and ease of synthesis and modification. In this review, several key parameters for evaluating capacitive energy storage performance
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Polyimide (PI) has received great attention for high-temperature capacitive energy storage materials due to its remarkable thermal stability, relatively high breakdown strength, strong mechanical properties, and ease of synthesis and modification. In this review, several key parameters for evaluating capacitive energy storage performance are introduced. Subsequently, the properties of the commercially available PIs are presented. Then, the recent development of designing and tailoring all-organic PI-based polymers is discussed in detail, focusing on molecular composition and spatial configuration to enhance dielectric constant, breakdown strength, discharged energy density, and charge-discharge efficiency. Finally, we outline the current challenges and future development directions of PI-based high-temperature energy storage dielectric materials.
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