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Electronic Materials

Electronic Materials is an international, peer-reviewed, open access journal on fundamental science, engineering, and practical applications of electronic materials published quarterly online by MDPI.

All Articles (132)

The increasing demand for next-generation rechargeable batteries that offer high energy density, a long lifespan, high safety, and low cost has led to a need for better electrode materials for lithium-ion batteries. This also involves developing alternative storage systems using common resources such as sodium-ion batteries, beryllium-ion batteries, or magnesium-ion batteries. Tin carbide (SnC) is highly promising as an anode material for lithium, sodium, beryllium, and magnesium ion batteries due to its ability to form nanoclusters like Sn(Li2)C, Sn(Na2)C, Sn(Be2)C, and Sn(Mg2)C. A detailed study was done using computational methods, including analysis of charge density differences, total density of states, and electron localization function for these hybrid clusters. This research suggests that SnC could be useful in multivalent-ion batteries using Be2+ ions because its properties can match or even exceed those of monovalent ions. The study also shows that the maximum capacity, stability energy, and ion movement in these materials can be understood by looking at atomic-level properties like the coordination between host atoms and ions. Recent findings on using tin carbide in these types of batteries and methods to improve their performance have been discussed.

1 January 2026

Adding Li, Na, Be and Mg to SnC nanoclusters leads to the formation of four different complexes: (a) Sn(Li2)C, (b) Sn(Na2)C, (c) Sn(Be2)C and (d) Sn(Mg2)C. These complexes show promise for energy storage in innovative batteries. The atoms of Sn(13) and Sn(28) in the blue frame are the most efficient electron donors in Sn(Li2)C, Sn(Na2)C, Sn(Be2)C, or Sn(Mg2)C complexes (Table 1).

Recent studies show that titanium (Ti)-based alloys combine established mechanical strength, corrosion resistance, and biocompatibility with emerging electrical and electrochemical properties relevant to bioelectronics. The main goal of the present manuscript is to give a wide-ranging overview on the use of Ti-alloys in electronics and biomedicine, focusing on a comprehensive analysis and synthesis of the existing literature to identify gaps and future directions. Concurrently, the identification of possible correlations between the effects of the manufacturing process, alloying elements, and other degrees of freedom influencing the material characteristics are put in evidence, aiming to establish a global view on efficient interdisciplinary efforts to realize high-added-value smart devices useful in the field of biomedicine, such as, for example, implantable apparatuses. This review mostly summarizes advances in surface modification approaches—including anodization, conductive coatings, and nanostructuring that improve conductivity while maintaining biological compatibility. Trends in applications demonstrate how these alloys support smart implants, biosensors, and neural interfaces by enabling reliable signal transmission and long-term integration with tissue. Key challenges remain in balancing electrical performance with biological response and in scaling laboratory modifications for clinical use. Perspectives for future work include optimizing alloy composition, refining surface treatments, and developing multifunctional designs that integrate mechanical, biological, and electronic requirements. Together, these directions highlight the potential of titanium alloys to serve as foundational materials for next-generation bioelectronic medical technologies.

1 January 2026

Representative biomedical applications of titanium alloys. (a) Hip implant. (b) Dental screw. (c) Stent.

To address the issues of insufficient responsivity and low imaging contrast of carbon-based HGFET high-sensitivity short-wave infrared (SWIR) detectors under low-light conditions, this paper proposes a high-sensitivity and high-contrast image enhancement algorithm for low-light detection, with FPGA-based hardware verification. The proposed algorithm establishes a multi-stage cooperative enhancement framework targeting key challenges such as low signal-to-noise ratio (SNR), high dark-state noise, and weak target extraction. Unlike traditional direct enhancement methods, the proposed approach first performs defective row-column correction and background noise separation based on dark-state data, which provides a clean foundation for signal reconstruction. Furthermore, an adaptive gamma correction mechanism based on image maximum value is introduced to avoid unnecessary nonlinear transformations in high-contrast regions. During the contrast enhancement stage, an exposure-constrained adaptive histogram equalization strategy is adopted to effectively suppress noise amplification and saturation in low-light scenes. Finally, an innovative dual-mode threshold selection method based on image variance is proposed, which can dynamically integrate the OTSU algorithm with statistical moment analysis to ensure robust background noise separation across both high- and low-contrast scenarios. Experimental results demonstrate that the proposed algorithm significantly improves target contrast in infrared images while preventing detail loss due to overexposure. Under microwatt-level laser power, background noise is effectively suppressed, and both imaging quality and weak target detection capability are substantially enhanced.

2 December 2025

The structural configuration of the HGFET SWIR detector.

In this study, we explore the integration of a cost-effective triboelectric nanogenerator (TENG) with an large silicon PIN detector (diameter: 12 mm) for intelligent wireless recognition applications. Wireless communication eliminates the need for physical connections, enabling greater flexibility and scalability in deployment. It allows for seamless integration of AI systems into a wide range of environments without the constraints of wiring, reducing installation complexity and enhancing mobility. Additionally, we demonstrate the TENG’s functionality as an autonomous communication unit. The TENG is employed to convert various environmentally triggered signals into digital formats and to autonomously power optoelectronic devices, thus eliminating the need for an external power supply. By integrating optoelectronic components within the self-powered sensing system, the TENG can identify specific trigger information and reduce extraneous noise, thereby improving the accuracy of information transmission. Moreover wireless technology facilitates real-time data transmission and processing. This setup not only enhances the overall efficiency and adaptability of the system but also supports continuous operation in diverse and dynamic settings. This paper introduces a novel convolutional neural network-long short-term memory (CNN-LSTM) fusion neural network model. Utilizing the sensing system in combination with the CNN-LSTM neural network enables the collection and identification of variations in the flicker frequency and luminosity of optoelectronic devices. This capability allows for the recognition of environmental trigger signals generated by the TENG. The classification and recognition results of human body trigger signals indicate a recognition accuracy of 92.94%.

2 December 2025

(a) Schematic diagram of trigger signal detection process. (b) Diagram of the trigger signal detection system.

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Electron. Mater. - ISSN 2673-3978