Journal Menu► ▼ Journal Menu
Journal Browser► ▼ Journal Browser
Special Issue "Wafer Level Packaging of MEMS"
Deadline for manuscript submissions: closed (15 March 2018).
Packaging is essential for the practical use of micro electro mechanical systems (MEMS), in terms of performance and reliability. The electronics market has been continuously requiring the downsizing and cost reduction of MEMS, and, thus, wafer-level packaging is becoming more important and replacing conventional die-level packaging. For example, the recent drastic reduction of die size found in inertial sensors has been driven by the progress of wafer-level packaging technology. One of important features of the wafer-level packaging of MEMS is that it often needs the device cavity, which is hermetically sealed. Therefore, hermetic/vacuum sealing and electrical feedthrough from the sealed cavity are key technologies. On the other hand, emerging devices need new types of packaging, for example, biocompatible and flexible packaging, which are also attracting a great deal of attention. Test, reliability control, wiring, dicing, chip-level integration and material development related to the wafer-level packaging of MEMS are also included in the scope of this Special Issue. Wafer-level packaging is strongly connected to the integration of multiple components, and, thus, papers about wafer-level integration are also welcome.
Prof. Dr. Shuji Tanaka
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- Wafer-level packaging
- Wafer-level integration
- Hermetic sealing
- Vacuum sealing
- Wafer bonding
- Electrical feedthrough
- TSV (Through Silicon Via)