CMOS-MEMS Fabrication Technologies and Devices, 2nd Edition
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".
Deadline for manuscript submissions: 31 December 2025 | Viewed by 504
Special Issue Editor
Interests: micromachining; nanofabrication; 3D integration; CMOS-MEMS stacking; advanced packaging
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Electronics are extremely popular in our daily life. Semiconductors such as complementary metal oxide semiconductor (CMOS) and micro-electro-mechanical system (MEMS) are key devices in the electronic field. CMOS can be integrated with MEMS components within a single chip (3D integration) to produce compact and low-cost CMOS-MEMS devices for multiple applications (sensing, detection, imaging, signal transmission, and others). Therefore, these devices’ fabrication and integration are essential for the development of modern society. This Special Issue aims to gather high quality research contributions dealing with MEMS devices integrated with CMOS, independently of fabrication technologies and final applications.
Dr. Liangxing Hu
Guest Editor
Manuscript Submission Information
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Keywords
- CMOS-MEMS fabrication technologies
- CMOS
- MEMS
- CMOS-MEMS integration
- 3D integration
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Related Special Issue
- CMOS-MEMS Fabrication Technologies and Devices in Micromachines (10 articles)
