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Sensors 2017, 17(11), 2451; https://doi.org/10.3390/s17112451

3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer

1
Department of Robotics, Graduate School of Engineering, Tohoku University, 6-6-01 Aramaki Aza Aoba, Aoba-ku, Sendai, Miyagi 980-8579, Japan
2
Micro System Integration Center, Tohoku University, 519-1176 Aramaki Aza Aoba, Aoba-ku, Sendai, Miyagi 980-0845, Japan
3
Partner Robot Division, Toyota Motor Corporation, 543 Kirigahora, Nishi-hirose-cho, Toyota, Aichi 470-0309, Japan
4
System & Electronics Engineering Dept. III, Toyota Central R & D Labs., Inc., 41-1 Yokomichi, Nagakute, Aichi 480-1192, Japan
This paper is an extended version of our published paper “3-axis fully-integrated surface-mountable differential capacitive tactile sensor by CMOS flip-bonding”. In Proceedings of the 29th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2016), Shanghai, China, 24–28 January 2016.
*
Author to whom correspondence should be addressed.
Received: 25 September 2017 / Revised: 19 October 2017 / Accepted: 24 October 2017 / Published: 25 October 2017
(This article belongs to the Special Issue Tactile Sensors and Sensing)
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Abstract

This paper reports a 3-axis fully integrated differential capacitive tactile sensor surface-mountable on a bus line. The sensor integrates a flip-bonded complementary metal-oxide semiconductor (CMOS) with capacitive sensing circuits on a low temperature cofired ceramic (LTCC) interposer with Au through vias by Au-Au thermo-compression bonding. The CMOS circuit and bonding pads on the sensor backside were electrically connected through Au bumps and the LTCC interposer, and the differential capacitive gap was formed by an Au sealing frame. A diaphragm for sensing 3-axis force was formed in the CMOS substrate. The dimensions of the completed sensor are 2.5 mm in width, 2.5 mm in length, and 0.66 mm in thickness. The fabricated sensor output coded 3-axis capacitive sensing data according to applied 3-axis force by three-dimensional (3D)-printed pins. The measured sensitivity was as high as over 34 Count/mN for normal force and 14 to 15 Count/mN for shear force with small noise, which corresponds to less than 1 mN. The hysteresis and the average cross-sensitivity were also found to be less than 2% full scale and 11%, respectively. View Full-Text
Keywords: 3-axis tactile sensor; MEMS-CMOS integration; capacitive sensor; Au-Au thermo-compression bonding; low temperature cofired ceramic 3-axis tactile sensor; MEMS-CMOS integration; capacitive sensor; Au-Au thermo-compression bonding; low temperature cofired ceramic
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Asano, S.; Muroyama, M.; Nakayama, T.; Hata, Y.; Nonomura, Y.; Tanaka, S. 3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer. Sensors 2017, 17, 2451.

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