In this study, we present a novel type of package, freeform-designed chip scale package (FDCSP), which has ultra-high light extraction efficiency and bat-wing light field. For the backlight application, mainstream solutions are chip-scale package (CS...
With the development of high-density integrated chips, low-k dielectric materials are used in the back end of line (BEOL) to reduce signal delay. However, due to the application of fine-pitch packages with high-hardness copper pillars, BEOL is suscep...
By solving the problem of very long test time on reliability qualification for Light-emitting Diode (LED) products, the accelerated degradation test with a thermal overstress at a proper range is regarded as a promising and effective approach. For a...
This article presents a chip-scale package (CSP) based filament light-emitting diodes (LEDs) with a stacked-type structure and a segmented-type luminescence design for higher luminous efficiency and better electrical stability. The innovation strateg...
In this paper, we explore the use of chip-scale blown glass microbubble structures for MEMS packaging applications. Specifically, we demonstrate the efficacy of this method of packaging for the improvement of the lifetime of a ferrofluid-based magnet...
This study aims to establish an accurate prediction model using artificial neural networks (ANNs) to effectively and efficiently predict the process-induced warpage of a flip-chip chip-scale package (FCCSP). To enhance model performance, a novel subd...
Current research in the field of aviation considers actively controlled high-lift structures for future civil airplanes. Therefore, pressure data must be acquired from the airfoil surface without influencing the flow due to sensor application. For ex...
Solder joint fatigue is one of the critical failure modes in ball-grid array packaging. Because the reliability test is time-consuming and geometrical/material nonlinearities are required for the physics-driven model, the AI-assisted simulation frame...
This study introduces a novel, non-rotationally symmetrical auxiliary electrode design aimed at mitigating localized hotspots and enhancing the deposition uniformity in wafer-level electroplating for advanced large-scale chip packaging. The formation...
Emerging trends like the Internet of Things require an increasing number of different sensors, actuators and electronic devices. To enable new applications, such as wearables and electronic skins, flexible sensor technologies are required. However, e...
A novel five-surface phosphor-in-glass (FS-PiG) structure for high illumination and excellent color uniformity in large-view scale LEDs for sensor light source application is demonstrated. YAG phosphor (Y3Al5O12:Ce3+) was uniformly mixed with ceramic...
In recent years, silver sintering has gained increasing attention in high-power density electronic packaging due to its characteristics such as a high melting point and excellent thermal and electrical conductivity. Micron-sized silver sintering offe...
This paper proposes a cross-scale simulation approach for evaluating the steady-state electrothermal performance of power MOSFETs at the device–package–heatsink–board (DPHB) level. A co-simulation framework is designed by employing...
To meet the urgent market demand for small package size and high reliability performance for automotive CMOS image sensor (CIS) application, wafer level chip scale packaging (WLCSP) technology using through silicon vias (TSV) needs to be developed to...
As semiconductor chip manufacturing technology advances, chip structures are becoming more complex, leading to an increased likelihood of void defects in the solder layer during packaging. However, identifying void defects in packaged chips remains a...
Silicon photonics, serving as a cornerstone technology in modern information technology, demonstrates significant application potential in critical scenarios such as high-speed data center interconnects and integrated optical communication systems. F...
The development of semiconductor processes and advanced packaging technology has promoted significant advancements in the miniaturization and integration of electronic devices and systems. However, these developments present substantial challenges to...
In this paper we present and discuss two innovative liquid-free SOI sensors for pressure measurements in harsh environments. The sensors are capable of measuring pressures at high temperatures. In both concepts media separation is realized using a...
A flexible multilayer with selenium nanoparticles incorporated has been used to build an antioxidant packaging. The oxidation of hazelnuts, walnuts, and potato chips was tested at laboratory scale. Hexanal released by the nuts, fatty acids oxidation...
Multiplexed sensing in integrated silicon electronic-photonic platforms requires microfluidics with both high density micro-scale channels and meso-scale features to accommodate for optical, electrical, and fluidic coupling in small, millimeter-scale...
This study suggests promising candidates as highly thermally conductive adhesives for advanced semiconductor packaging processes such as flip chip ball grid array (fcBGA), flip chip chip scale package (fcCSP), and package on package (PoP). To achieve...
This paper presents the design of on-chip micro-antennas for package-scale galvanic isolators based on RF planar coupling. A step-by-step design procedure is proposed, which aims at the maximization of the weak electromagnetic coupling between the RX...
Recent years have seen rapid development of chip-scale atomic devices due to their great potential in the field of biomedical imaging, namely chip-scale atomic magnetometers that enable high resolution magnetocardiography (MCG) and magnetoencephalogr...
Laminate substrates in advanced IC packages serve as not only the principal heat dissipation pathway but also the critical component governing the thermomechanical performance of advanced packaging technologies. A solid and profound grasp of their th...
Intracellular gene delivery is normally required to study gene functions. A versatile platform able to perform both chemical transfection and viral transduction to achieve efficient gene modification in most cell types is needed. Here we demonstrated...
In order to improve the production quality and qualification rate of chips, X-ray nondestructive imaging technology has been widely used in the detection of chip defects, which represents an important part of the quality inspection of products after...
The advent of nanotechnology has initiated a profound revolution in almost all spheres of technology. The electronics industry is concerned with the ongoing miniaturization of devices and as such requires packaging technologies that will make the dev...
In advanced packaging technology, the micro bump has become an important means of chip stacking and wafer interconnection. The reliability of micro bumps, which plays an important role in mechanical support, electrical connection, signal transmission...
Thanks to advanced semiconductor microfabrication technology, chip-scale integration and miniaturization of lab-on-a-chip components, silicon-based optical biosensors have made significant progress for the purpose of point-of-care diagnosis. In this...
Vacuum packaging of Micro-electro-mechanical system (MEMS) devices is a hot topic for its advantages of improving performance and reducing power consumption. In this paper, the physics package of a chip scale atomic clock (CSAC), as a typical kind of...
The development and application of virtual reality (VR) technology significantly enhances consumer immersion. Exploring a multi-sensory evaluation model for virtual packaging is valuable for integrating VR technology with packaging. This study develo...
Electrostatic discharge (ESD) failure is a major reliability problem for all forms of microelectronics products. ESD protection is required for all integrated circuits (ICs). As dimension scaling-down approaches its physical limit, heterogeneous inte...
A complementary metal-oxide-semiconductor (CMOS) chip biosensor was developed for cell viability monitoring based on an array of capacitance sensors utilizing a ring oscillator. The chip was packaged in a low temperature co-fired ceramic (LTCC) modul...
Dedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs) from Si foundries mean that researchers and small-to-medium enterprises (SMEs) can now afford to design and fabricate Si photonic chips. While these bare Si-PICs are ade...
This paper presents a novel, highly sensitive and ultra-small fluorescent detection system, including an autonomous capillary fluid manipulation chip. The optical detector integrates a LED light source, all necessary optical components, and a photodi...
This paper presents a time-domain CMOS oscillator-based thermostat with digital set-point programming [without a digital-to-analog converter (DAC) or external resistor] to achieve on-chip thermal management of modern VLSI systems. A time-domain delay...
Fiber to chip coupling is a critical aspect of any integrated photonic circuit. In terms of ease of fabrication as well as wafer-scale testability, surface grating couplers are by far the most preferred scheme of the coupling to integrated circuits....
This paper exploits an effective approach to overcome the breakdown limitations of traditional galvanic isolators based on chip-scale isolation barriers, thus achieving a very high isolation rating (i.e., compliant with the reinforced isolation requi...
A new and transformative era in semiconductor packaging is underway, wherein, there is a shift from transistor scaling to system scaling and integration through advanced packaging. For advanced packaging, interconnect scaling is a key driver, with in...
In this paper, a co-design method and a wafer-level packaging technique of a flexible antenna and a CMOS rectifier chip for use in a small-sized implantable system on the brain surface are proposed. The proposed co-design method optimizes the system...
Urban tree-management operations generate substantial amounts of woody biomass that often remain underutilized despite their potential value as a local renewable fuel. This study investigates the possibility of using woodchips and sawdust delivered f...
To make the light-emitting diode (LED) more compact and effective, the flip chip solder joint is recommended in LED chip-scale packaging (CSP) with critical functions in mechanical support, heat dissipation, and electrical conductivity. However, the...
Vertical-cavity surface-emitting lasers (VCSELs) have generated extensive enthusiasm in scientific research on and applications of lasers. However, thermal resistance has seriously limited the performance of such devices for a long time, especially i...
In this paper, an optimal and robust design method to implement a two-chip out-of-plane microaccelerometer system is presented. The two-chip microsystem consists of a MEMS chip for sensing the external acceleration and a CMOS chip for signal processi...
This paper describes an analysis of power supply rejection and noise improvement techniques for an envelope-tracking power amplifier. Although the envelope-tracking technique improves efficiency, its power supply rejection ratio is much lower than th...
Integrated circuit (IC) X-ray wire bonding image inspections are crucial for ensuring the quality of packaged products. However, detecting defects in IC chips can be challenging due to the slow defect detection speed and the high energy consumption o...
A novel resonant pressure sensor with an improved micromechanical double-ended tuning fork resonator packaged in dry air at atmospheric pressure is presented. The resonator is electrostatically driven and capacitively detected, and the sensor is des...
This paper presents an ultra-small absolute pressure sensor with a silicon-micromachined TSV backside interconnection for high-performance, high spatial resolution contact pressure sensing, including flexible-substrate applications. By exploiting sil...
We present a reproducible process to directly pattern 3-Dimensional (3D) polydimethylsiloxane (PDMS) structures for Organ-on-Chips (OOC) via automated molding. The presented process employs a commercially available system from IC packaging improving...
Additive Manufacturing (AM) and printing-based fabrication technologies have emerged as powerful enablers for next-generation electronic integration and packaging, addressing the growing limitations of conventional subtractive manufacturing technique...
of 2