A section of Electronics (ISSN 2079-9292).
Analog, digital, mixed, radio frequency (RF), resonant, radiation tolerant, low power, in vivo and other integrated electronic topics are now expanding in the microelectronics market due to increasing global demand.
This Section on Microelectronics is dedicated to publishing original research articles and cutting-edge reviews for the applications of microelectronics in emerging, frontier and challenging technologies. Electronics operating in extreme environments, such as vacuum, space, harsh radiation, extreme cold and other niche applications, is today pushing microelectronic design beyond the frontier of standard electronics.
Furthermore, as there is an expanding environment of software tools to facilitate microelectronic design and to cope with large circuits composed of many hierarchical blocks, vendor IPs, multi-clock trees, various physical interfaces of I/O and other specific blocks, the simulation environment is becoming increasingly strategic for integrated circuit (IC) submissions.
In addition, optimizing design methodologies can be evaluated separately by a trade-off between cost, die area and time-to-market.
Thus, design methodologies for approaching such a complex design environment are shared here, among scientists and electronic designers, and particular emphasis is given to the circuit design, modeling, simulation and testability methodologies.
Hence, a receptacle journal aimed at sharing the individual experiences, achievements and successes of scientists around the world is absolutely crucial.
- Top-down and bottom-up design approach in microelectronics
- Microelectronic models for analog/digital and mixed-mode precise simulations
- Built-in self-test (BIST), testing, design for testability
- Semiconductor-based memories, volatile, nonvolatile, high-bandwidth memories (HBM)
- Embedded processors, systems-on-chip (SoC), intellectual property (IP) blocks, FPGA integration
- Optoelectronics, front-end interfaces for sensors
- Radiation hardening design approaches for space and physics applications
- Microelectronics operating in extreme (cold) conditions
- In vivo and remote powered microelectronics
- Antennas, oscillators, wireless and resonant circuits
- Through silicon via (TSV), through glass via (TGV), 3D-ICs, system in package (SiP) technologies
- Emerging, frontier and future microelectronics, xx-FETs, non-silicon-based electronics
Following special issues within this section are currently open for submissions:
- Advances in Additive Technologies for Electronics (Deadline: 15 December 2023)
- Radiation Effects of Advanced Electronic Devices and Circuits (Deadline: 31 December 2023)
- Micro Energy Harvesters: Modelling, Design, and Applications (Deadline: 20 January 2024)
- Electronic Nose: From Fundamental Research to Applications (Deadline: 15 February 2024)
- High Carrier Mobility Devices Technology and Applications (Deadline: 15 February 2024)
- Radiation Tolerant Electronics, Volume III (Deadline: 29 February 2024)
- Innovative Numerical Methods for Advanced Computation of Electromagnetic Devices and Microsystems (Deadline: 31 March 2024)
- Advanced Non-Volatile Memory Devices and Systems (Deadline: 15 April 2024)
- Sensing Technology and Intelligent Application (Deadline: 15 April 2024)
- Feature Review Papers in Microelectronics (Deadline: 15 May 2024)
- Microelectromechanical Systems (MEMSs): Design, Fabrication, Integration, and Applications (Deadline: 15 May 2024)
- Heterogeneous Integration Electronic Devices (Deadline: 15 June 2024)
- Advancements and Applications of Millimeter Wave and Terahertz Vacuum Electronic Devices (Deadline: 15 June 2024)
- Challenges in Flexible/Wearable Electronics and Devices (Deadline: 15 July 2024)
- FPGA-Based Reconfigurable Embedded Systems (Deadline: 31 July 2024)
- Image Sensors and Companion Chips (Deadline: 20 August 2024)