Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems
Okabe, K.; Jeewan, H.P.; Yamagiwa, S.; Kawano, T.; Ishida, M.; Akita, I. Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems. Sensors 2015, 15, 31821-31832. https://doi.org/10.3390/s151229885
Okabe K, Jeewan HP, Yamagiwa S, Kawano T, Ishida M, Akita I. Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems. Sensors. 2015; 15(12):31821-31832. https://doi.org/10.3390/s151229885
Chicago/Turabian StyleOkabe, Kenji, Horagodage P. Jeewan, Shota Yamagiwa, Takeshi Kawano, Makoto Ishida, and Ippei Akita. 2015. "Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems" Sensors 15, no. 12: 31821-31832. https://doi.org/10.3390/s151229885


