- Article
Tin Whiskers’ Behavior under Stress Load and the Mitigation Method for Immersion Tin Surface Finish
- Nor Akmal Fadil,
- Siti Zahira Yusof,
- Tuty Asma Abu Bakar,
- Habibah Ghazali,
- Muhamad Azizi Mat Yajid,
- Saliza Azlina Osman and
- Ali Ourdjini
Since the use of the most stable Pb-based materials in the electronic industry has been banned due to human health concerns, numerous research studies have focused on Pb-free materials such as pure tin and its alloys for electronic applications. Pure...