LEDs are widely used in medicine, navigation and landscape lighting. The development of high-power LED is a severe challenge to LED heat dissipation. In this review, packaging technology and packaging structure are reviewed in terms of the thermal pe...
A novel four-in-one (4-in-series) MicroLED-in-Package (MiP4) architecture is demonstrated for the first time, integrating four sub-85 µm blue micro-LED (µ-LED) dies on a transparent glass substrate through a redistribution-layer (RDL) int...
In this study, we present a novel type of package, freeform-designed chip scale package (FDCSP), which has ultra-high light extraction efficiency and bat-wing light field. For the backlight application, mainstream solutions are chip-scale package (CS...
In this study, the small-size and side-view LED packages used in the backlight modules were examined by performing the electrostatic discharge (ESD) process. The high voltages used for the ESD process were 2 kV, 3 kV, and 4 kV. After ESD, the current...
Background: More effective and automated techniques for disinfecting elevator push-buttons currently need to be developed, especially given that they are frequently touched by hundreds of individuals. Methods: An automatic elevator push-button disinf...
LED packaging miniaturization has raised more requirements for LED materials. As a material contacting the LED chip directly, the reliability of LED non-conductive adhesive has also garnered increasing attention. This study optimized the formula for...
Amorphous fluorine resin is a promising material that can be used for the encapsulation of deep-ultraviolet light-emitting diodes (DUV LEDs) to promote the light output, due to its light characteristics which mean it shows no absorption in the DUV wa...
Aluminum nitride (AlN) ceramic materials have relatively low thermal conductivity and poor heat dissipation performance, and are increasingly unsuitable for high-power LED packaging. In this study, diamond films were deposited on AlN ceramic substrat...
The effect of correlated color temperature (CCT) on the thermal performance of light emitting diode (LED) filament in flip-chip packaging was investigated in detail. Two filaments with different lengths were selected as the research object, and the t...
This study investigates the degradation mechanisms of 2835-packaged white LEDs commonly used in residential lighting scenarios under various environmental conditions and explores how standard ageing tests compare to those that better reflect real-wor...
A thermal model was built to estimate the temperature distribution in the hemispherical packaging volume of a white LED at a steady state. Inherent heat sources appeared in the white LED when its power was measured. A simplified 3D to 2D space proces...
In this paper, a new method to regulate the correlated color temperature (CCT) of white light-emitting diodes (LEDs) is proposed for the single-chip packaging structure, in which the blue light distribution emitted from the chip in the red/yellow pho...
A modeling procedure was proposed for the through-hole LEDs commonly used in traffic signs. The measurements from a sample batch of LEDs were performed at several midfield distances to provide a set of representative angular intensity distributions a...
By studying the substrate material, structure, chip distribution, and array form of the multi-chip light-emitting diode (LED) package, the heat-dissipation capacity of the LED package is improved. Finite element analysis and steady-state thermal anal...
Electronically active yarn (E-yarn) pioneered by the Advanced Textiles Research Group of Nottingham Trent University contains a fine conductive copper wire soldered onto a package die, micro-electro-mechanical systems device or flexible circuit. The...
Poly(phenyl-substituted siloxanes/silsesquioxanes) are obtained by the Piers–Rubinsztajn (PR) reaction of hydrogen-containing siloxanes (HCS) with diphenyldialkoxysilanes such as diphenyldimethoxysilane and diphenyldiethoxysilane catalyzed by t...
This article presents a chip-scale package (CSP) based filament light-emitting diodes (LEDs) with a stacked-type structure and a segmented-type luminescence design for higher luminous efficiency and better electrical stability. The innovation strateg...
Light Emitting Diodes (LEDs) are the most commonly used light sources. Temperature strongly affects their operation. Considering that multiple devices are often placed in a single housing, thermal couplings between devices become important. This prob...
Since the junction temperature is a critical factor determining the lifetime and reliability of LEDs, effective thermal management is essential to prevent premature failure. This study uses COMSOL Multiphysics® to simulate a 10 W multi-chip COB L...
Bond wire failure, primarily wire neck breakage, in power LED devices due to thermomechanical fatigue is one of the main reliability issues in power LED devices. Currently, the standard testing methods to evaluate the device’s lifetime involve...
A professional closet with highly efficient disinfection for reusing protective clothing is required to reduce supply and demand and protect the environment. A self-developed ultraviolet-C (UVC) light-emitting diode (LED) package that can emit unifor...
By solving the problem of very long test time on reliability qualification for Light-emitting Diode (LED) products, the accelerated degradation test with a thermal overstress at a proper range is regarded as a promising and effective approach. For a...
This manuscript presents a comprehensive study on the assembly of microchips using fluidic self-assembly (FSA) technology, with a focus on optimizing the spacing between binding sites to improve yield and assembly. Through a series of experiments, we...
In this paper, a novel method is presented to estimate the parameters of the SPICE-like multi-domain model of light-emitting diode (LED) chips developed and proposed by the Delphi4LED project. The proposed estimation algorithm employs a modified Neld...
This paper introduces a compact optical information storage sensing system. Applications of this system include longitudinal surface plasmon resonance detection of gold nanorods with a single femtosecond laser in three-dimensional space as well as da...
To realize high-efficiency, AlGaN-based, deep-ultraviolet light-emitting diodes (DUV-LEDs), enhancing their light-extraction efficiency and reducing thermal resistance is very crucial. We proposed a liquid packaging structure that could enhance optic...
Thermal transient testing is widely used for LED characterization, derivation of compact models, and calibration of 3D finite element models. The traditional analysis of transient thermal measurements yields a thermal model for a single heat source....
Recently, we have seen energy-efficient light-emitting diode (LED) light bulbs rapidly replace incandescent ones. However, results of new research are indicative of adverse health impacts of LED lighting, which is characterized by enriched blue light...
The effect of a prior chilling period and an alga extract packaging on the quality of a canned underutilised mackerel species (Scomber colias) was investigated. For this different chilling times (0, 4 and 9 days) were taken into account and three con...
To realize high-efficiency AlGaN-based deep-ultraviolet light-emitting diodes (DUV-LEDs), enhancing their light-extraction efficiency (LEE) is crucial. This paper proposes an aluminum-based sidewall reflector structure that could replace the conventi...
Effective and reliable interconnections are crucial for microfluidics to connect with the macro world. Current microfluidic interfaces are still bulky, expensive, or with issues of clogging and material limitation. In this study, a novel ultraviolet...
In this paper, we report an AlN-based ceramic lead frame (LF) with encapsulating silicone between the surface of an AlGaN-based ultraviolet-B light-emitting diode (UVB-LED) chip and a quartz glass cover; the light output power (LOP) of this structure...
This study investigated how different LED spectral compositions affect seed germination, early growth, photosynthetic efficiency, and the postharvest quality and microbiological stability of Ipomoea aquatica Forsk. cultivated in a plant factory syste...
Quantum-dot-converted white LEDs (QD-WLEDs) are promising in both lighting and display applications owing to their high luminous efficiency (LE) and high color-rendering index (CRI). However, their working lifetime is severely limited by the poor rel...
The die-bonding layer between chips and substrate determinates the heat conduction efficiency of high-power LED. Sn-based solder, AuSn20 eutectic, and nano-Ag paste were widely applied to LED interconnection. In this paper, the optical–thermal...
This study investigates supervised learning to improve LED classification. A hardware system for testing was built. The data for learning were acquired and then analyzed to show their characteristics. An LED was tested, and the results were categoriz...
The COVID-19 pandemic started toward the end of 2019 and social distancing requirements imposed worldwide led to the rapid growth of online shopping, adversely impacted the global efforts for environmental protection. This study examines packaging an...
The preservative properties of waste liquor obtained from octopus (Octopus vulgaris) cooking were investigated. Three different concentrations (high, medium, and low) of octopus cooking liquor (OCL) were included, respectively, in the aqueous packagi...
Light-emitting diodes (LED) fixtures and lamps have emerged as leading technologies for general illumination and are a well-established energy efficiency retrofit measure in commercial buildings (from around 2% of installed fixtures and lamps in 2013...
Policies to require front-of-package labels (FOPLs) on packaged foods may help Indian consumers to better identify foods high in nutrients of concern, including sugar, saturated fat, and sodium, and discourage their consumption, which are outcomes th...
This study aims to systematically investigate packaging waste repurposing in humanitarian logistics. It aims to bridge the theory–practice gap by providing a consolidated evidence-based analysis of how packaging is repurposed, the driving motiv...
This report outlines a proposed method of packaging wide-angle (WA) mini-light-emitting diode (mini-LED) devices without optical lenses to create a highly efficient, ultrathin, flexible planar backlight for portable quantum dot light-emitting diode (...
Nanotechnology has provided new opportunities for the food industry with its applications in food packaging. The addition of nanoparticles, such as clay, silver and copper, can improve the mechanical and antimicrobial properties of food packaging. Ho...
3D printing is regarded as a useful tool for the fabrication of microfluidic connectors to overcome the challenges of time consumption, clogging, poor alignment and bulky fixtures existing for current interconnections. 3D-printed connectors without a...
Demand for sustainable packaging in the global market has led to the development of environmentally friendly alternatives to conventional plastic materials [...]
UV-C LED systems have emerged as a chemical-free alternative to hydrogen peroxide (H2O2) mist-based technologies. This study assesses the sporicidal efficacy of a UV-C LED HLD system under clinically relevant conditions using performance qualificatio...
The advancement of intelligent packaging technologies has emerged as a pivotal innovation in the food industry, significantly enhancing food safety and preservation. This review explores the latest developments in the fabrication of intelligent packa...
In this report, to tackle the thermal fluorescent quenching issue of II-VI semiconductor quantum dots (QDs), which hinders their on-chip packaging application to light-emitting diodes (LEDs), a QD-ZnS nanosheet inorganic assembly monolith (QD-ZnS NIA...
In e-commerce transactions, the packaging level of porcelain, to a certain extent, determines the loss rate of goods in the transportation process. Therefore, encouraging decisionmakers to improve the packaging level is key to coordinating the supply...
This review explores the field of hybrid materials in the context of bio-based aerogels for the development of sustainable packaging solutions. Increasing global concern over environmental degradation and the growing demand for environmentally friend...
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