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Special Issue "Thermal and Electro-thermal System Simulation"

A special issue of Energies (ISSN 1996-1073). This special issue belongs to the section "Thermal Management".

Deadline for manuscript submissions: closed (1 April 2019)

Special Issue Editors

Guest Editor
Prof. Márta Rencz

Department of Electron Devices, Budapest University of Technology and Economics, Magyar tudósok krt. 2, Bld. Q, 3rd floor, Budapest H-1117, Hungary
Website | E-Mail
Interests: thermal investigation of ICs and MEMS; thermal sensors; thermal testing; thermal simulation; thermal model generation; electro-thermal simulation; CPS systems
Guest Editor
Prof. Lorenzo Codecasa

Department of Electronics, Information and Bioengineering, Politecnico di Milano, Milan, Italy
Website | E-Mail
Interests: electric engineering; electro-thermal circuit modeling and simulation; electromagnetic simulation

Special Issue Information

Dear Colleagues,

As a follow-up to the 25th THERMINIC Workshop, held in Stockholm in September 2018, a Special Issue of energies about thermal and multi-physical investigations electronics systems will be edited by Prof. Marta Rencz.

This Special Issue will target the presentation of the newest research results of thermal effects in electronics today, from characterization to through multi-physics simulation to cooling solutions and reliability assessment.

This special issue is not only collecting papers from the 25th THERMINIC Workshop, but also will containing papers from other scholars who interested in this topic. Papers that were presented at THERMINIC must be revised and contain at least 40% new material that has never been presented before.

Prof. Márta Rencz
Prof. Lorenzo Codecasa
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Energies is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • multi physics simulation and field coupling
  • thermal modelling and investigation of packages
  • thermal interface materials and their characterization
  • thermal management and characterization of electronic components and systems
  • high temperature electronics
  • thermal issues in power electronics
  • thermal issues in solid state lighting
  • CFD modelling and benchmarking
  • thermal performance of interconnects
  • electro-thermal interactions
  • temperature mapping
  • 3D integration and cooling concepts
  • thermo-mechanical reliability
  • lifetime modelling and prediction
  • prognostics and health monitoring

Published Papers (2 papers)

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Research

Open AccessArticle TRAC: A Thermal Resistance Advanced Calculator for Electronic Packages
Energies 2019, 12(6), 1050; https://doi.org/10.3390/en12061050
Received: 13 February 2019 / Revised: 15 March 2019 / Accepted: 17 March 2019 / Published: 19 March 2019
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Abstract
This paper presents a novel simulation tool named thermal resistance advanced calculator (TRAC). Such a tool allows the straightforward definition of a parametric detailed thermal model of electronic packages with Manhattan geometry, in which the key geometrical details and thermal properties can vary [...] Read more.
This paper presents a novel simulation tool named thermal resistance advanced calculator (TRAC). Such a tool allows the straightforward definition of a parametric detailed thermal model of electronic packages with Manhattan geometry, in which the key geometrical details and thermal properties can vary in a chosen set. Additionally, it can apply a novel model-order reduction-based approach for the automatic and fast extraction of a parametric compact thermal model of such packages. Furthermore, it is suited to automatically determine the joint electron device engineering council (JEDEC) thermal metrics for any choice of parameters in a negligible amount of time. The tool was validated through the analysis of two families of quad flat packages. Full article
(This article belongs to the Special Issue Thermal and Electro-thermal System Simulation)
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Open AccessArticle Structure Function Analysis of Temperature-Dependent Thermal Properties of Nm-Thin Nb2O5
Energies 2019, 12(4), 610; https://doi.org/10.3390/en12040610
Received: 29 December 2018 / Revised: 8 February 2019 / Accepted: 14 February 2019 / Published: 15 February 2019
PDF Full-text (4584 KB) | HTML Full-text | XML Full-text | Supplementary Files
Abstract
A 166-nm-thick amorphous Niobium pentoxide layer (Nb2O5) on a silicon substrate was investigated by using time domain thermoreflectance at ambient temperatures from 25 °C to 500 °C. In the time domain thermoreflectance measurements, thermal transients with a time resolution [...] Read more.
A 166-nm-thick amorphous Niobium pentoxide layer (Nb2O5) on a silicon substrate was investigated by using time domain thermoreflectance at ambient temperatures from 25 °C to 500 °C. In the time domain thermoreflectance measurements, thermal transients with a time resolution in (sub-)nanoseconds can be obtained by a pump-probe laser technique. The analysis of the thermal transient was carried out via the established analytical approach, but also by a numerical approach. The analytical approach showed a thermal diffusivity and thermal conductivity from 0.43 mm2/s to 0.74 mm2/s and from 1.0 W/mK to 2.3 W/mK, respectively to temperature. The used numerical approach was the structure function approach to map the measured heat path in terms of a RthCth-network. The structure function showed a decrease of Rth with increasing temperature according to the increasing thermal conductivity of Nb2O5. The combination of both approaches contributes to an in-depth thermal analysis of Nb2O5 film. Full article
(This article belongs to the Special Issue Thermal and Electro-thermal System Simulation)
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