Delamination is a critical failure mode in power electronics packages that can significantly impact their reliability and performance, due to the large amounts of electrical power managed by the most recent devices which induce remarkable thermomecha...
One of the common reliability tests performed on power modules for automotive applications is passive thermal cycling, which is conventionally representative of the highly demanding thermomechanical loads typical of steady-state operating conditions....
In recent years, silver sintering has gained increasing attention in high-power density electronic packaging due to its characteristics such as a high melting point and excellent thermal and electrical conductivity. Micron-sized silver sintering offe...
In this article, an efficient die-bonding technology based on silver sintering due to induction heating is presented. By using this technology, the heat for the sintering reaction is locally limited to the bonding area and heating of the entire power...
Wide-Bandgap (WBG) semiconductors—silicon carbide (SiC) and gallium nitride (GaN)— enable high-power-density conversion, but performance is limited by where heat is generated and how it is removed. This review links device-level loss mech...
Wide band gap (WBG) power electronic devices, such as silicon carbide metal–oxide–semiconductor field-effect transistors (SiC MOSFETs) and gallium–nitride high-electron-mobility transistors (GaN HEMTs) have been widely used in vario...
Micro-Raman spectroscopy was carried out to evaluate the localized residual stresses in commercial Gallium-Nitride-based devices, specifically, AlGaN/GaN high-electron-mobility Transistors (HEMTs) with a novel packaging design provided by STMicroelec...
Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes, laser irradiation, and the removal of the sacrificial layers. In this review, we sys...
This paper examines the practical challenges of simplified setups aimed at achieving high-power IGBTs’ IC–VCE curve. The slope of this I–V curve (which is defined as on-resistance RCE) and the point where the VCE–VGE curve visibly bends (threshold ga...
This paper presents a vision for the future of 3D packaging and integration of silicon carbide (SiC) power modules. Several major achievements and novel architectures in SiC modules from the past and present have been highlighted. Having considered t...
The reliability and lifetime of insulated gate bipolar transistors (IGBTs) are critical to ensuring the stability and safety of power electronic systems. IGBTs are widely used in electric vehicles, renewable energy systems, and industrial automation....
Bonding wire is one of the main interconnection techniques. Thick bonding wire is widely used in power modules and other high power applications. This study examined the case for extending the use of traditional thin wire reliability criteria, namely...
Over the last several years, a significant advancement in high-voltage electronic packaging techniques has paved the way for next-generation power electronics. However, controlling the thermal properties of these new packaging solutions is still a ma...
The significant advance of power electronics in today’s market is calling for high-performance power conversion systems and MEMS devices that can operate reliably in harsh environments, such as high working temperature. Silicon-carbide (SiC) po...
Interconnect and packaging technologies are crucial aspects of modern electronics, and they are essential to achieve high performance, miniaturization and low power consumption of electronic equipment [...]
With the advancement of semiconductor technology, chip cooling has become a major obstacle to enhancing the capabilities of power electronic systems. Traditional electronic packaging materials are no longer able to meet the heat dissipation requireme...
Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper sinter paste materials to create top-side interconnects, which can su...
The growing interest towards thinner and conformable electronic systems has attracted significant attention towards flexible hybrid electronics (FHE). Thin chip-foil packages fabricated by integrating ultra-thin monocrystalline silicon integrated cir...
Three-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for achieving high-density integration, high-speed connectivity, and for downsizing of electronic devices. This paper describes recent developments in TSV fabrication and...
As the size of portable electronic devices, like tablet computers or smartphones, continues to decrease and their performance continues to increase, thermal management of the generated heat is becoming an ever more important issue. Phase change mater...
Advanced electronics technology is moving towards smaller footprints and higher computational power. In order to achieve this, advanced packaging techniques are currently being considered, including organic, glass, and semiconductor-based substrates...
High-power microelectronic packaging faces critical thermomechanical failures under rapid thermal cycling, primarily due to interfacial stress concentration and warping in conventional homogeneous heat sinks. To address this challenge, this study pro...
A critical aspect in the design of power electronics packages is the prediction of their mechanical response under severe thermomechanical loads and the consequent structural damage. For this purpose, finite element (FE) simulations are used to estim...
Transient liquid phase (TLP) bonding is a novel bonding process for the joining of metallic and ceramic materials using an interlayer. TLP bonding is particularly crucial for the joining of the semiconductor chips with expensive die-attached material...
Additive Manufacturing (AM) and printing-based fabrication technologies have emerged as powerful enablers for next-generation electronic integration and packaging, addressing the growing limitations of conventional subtractive manufacturing technique...
The application of wide band-gap power electronic devices brings more challenges to insulating packaging technology. Knowing the influence of applied voltage parameters on insulation performance is helpful to evaluate the insulation condition of elec...
As the performance requirements of insulated gate bipolar transistors (IGBTs) in various fields of power electronic systems are increasing, the IGBT power module package structure, aging mechanism analysis, and selection of health state characteristi...
The increasing demand for reliable and efficient power electronic systems in critical applications—such as renewable energy, electric vehicles, and aerospace—has intensified the need to understand and predict failure mechanisms in power d...
Power cycling tests (PCTs) assess the reliability of power devices by closely simulating their operating conditions. A PCT was performed on commercially available 1.2 kV 4H-SiC power metal–oxide–semiconductor field-effect transistors to o...
Wide bandgap gallium nitride (GaN)-based devices have attracted a lot of attention in optoelectronics, power electronics, and sensing applications. AlGaN/GaN based sensors, featuring high-density and high-mobility two-dimensional electron gas (2DEG),...
Modern high power electronics devices consists of a large amount of integrated circuits for switching and supply applications. Beside the benefits, the technology exhibits the problem of an ever increasing power density. Nowadays, heat sinks that are...
The interconnecting solder is a key control factor for the reliability of electronic power packaging because it highly affects the junction temperature of insulated-gate bipolar transistor (IGBT) modules and is prone to plasticity, creep, and other f...
Flexible electronics is a field gathering a growing interest among researchers and companies with widely varying applications, such as organic light emitting diodes, transistors as well as many different sensors. If the circuit should be portable or...
Metal–oxide–semiconductor field-effect transistors (MOSFETs) are critical in power electronic modules due to their high-power density and rapid switching capabilities. Therefore, effective thermal management is crucial for ensuring reliab...
Advanced packaging solutions require insulation and passivation materials with exceptional properties which can also fulfill the reliability needs of electronics devices such as MEMS, sensors or power modules. Since bonding (cohesive/adhesive) proper...
This article provides a comprehensive review of wide and ultrawide bandgap power electronic semiconductor devices, comparing silicon (Si), silicon carbide (SiC), gallium nitride (GaN), and the emerging device diamond technology. Key parameters examin...
In this paper, a novel power sintering technique, named fast hot-pressing sintering (FHP), which is able to achieve an ultrahigh heating rate similar to the spark plasma sintering (SPS) technique, but at a much lower cost, was applied to prepare a se...
The quad flat no-lead package (QFN) is widely used in integrated circuits due to its advantages in performance and cost. With the increasing power of electronic products, effective heat dissipation from QFN packages has become crucial to prevent prod...
Implantable electronic devices have been evolving at an astonishing pace, due to the development of fabrication techniques and consequent miniaturization, and a higher efficiency of sensors, actuators, processors and packaging. Implantable devices, w...
With the development of microelectronics products with high density and high power, it is urgent to improve the electrical and thermal conductivity of electronic paste to achieve the new requirements of packaging materials. In this work, a new synthe...
The continuous miniaturization of electronics, high processing capacity, compact microelectronic devices, and high circuit density contribute to an increasing demand for the efficient cooling of electronics. For aerospace and space applications, wher...
Bidirectional switches are highly required power electronics units for the design of power converters, especially for direct matrix converters. This article presents the design and implementation of a compact bidirectional switch based on SiC-MOSFET...
With the rapid development of information technology and semiconductor technology, the iteration speed of electronic devices has accelerated in an unprecedented manner, and the market demand for miniaturized, highly integrated, and highly intelligent...
Advanced packaging represents a crucial technological evolution aimed at overcoming limitations posed by Moore’s Law, driving the semiconductor industry from two-dimensional toward three-dimensional integrated structures. The increasing complex...
In this work, we demonstrated the thermal analysis of different flip-chip bonding designs for high power GaN HEMT developed for power electronics applications, such as power converters or photonic driver applications, with large gate periphery and ch...
The thermal management of power converters is not only crucial for their own optimal operation and reliability, but also for the overall system in which they are operating. Reliability is a very serious aspect because power electronics systems are be...
Silicone gel, used in the packaging of high-voltage, high-power semiconductor devices, generates bubbles during the packaging process, which accelerates the degradation of its insulation properties. This paper establishes a testing platform for elect...
AC/DC hybrid distribution networks with power electronic transformers (PETs) as distribution hubs are in line with the future development direction of the AC/DC hybrid distribution network. Unlike traditional transformers, power electronic transforme...
The application of a neural stimulator to small animals is highly desired for the investigation of electrophysiological studies and development of neuroprosthetic devices. For this purpose, it is essential for the device to be implemented with the ca...
This study reports the possibility of using biaxially oriented polyethylene terephthalate (BOPET) plastic packaging to convert mechanical energy into electrical energy. Electricity is generated due to the piezoelectricity of BOPET. Electricity genera...
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