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Materials 2018, 11(4), 618; https://doi.org/10.3390/ma11040618

Reliability Criteria for Thick Bonding Wire

1
Mechanical and Mechatronics Engineering, University of Waterloo, 200 University Ave W, Waterloo, ON N2L 3G1, Canada
2
System Design Engineering, University of Waterloo, 200 University Ave W, Waterloo, ON N2L 3G1, Canada
*
Author to whom correspondence should be addressed.
Received: 1 March 2018 / Revised: 9 April 2018 / Accepted: 12 April 2018 / Published: 17 April 2018
(This article belongs to the Special Issue Materials for Nano/Microelectronic Packaging Applications)
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Abstract

Bonding wire is one of the main interconnection techniques. Thick bonding wire is widely used in power modules and other high power applications. This study examined the case for extending the use of traditional thin wire reliability criteria, namely wire flexure and aspect ratio, to thick wires. Eleven aluminum (Al) and aluminum coated copper (CucorAl) wire samples with diameter 300 μm were tested experimentally. The wire response was measured using a novel non-contact method. High fidelity FEM models of the wire were developed and validated. We found that wire flexure is not correlated to its stress state or fatigue life. On the other hand, aspect ratio is a consistent criterion of thick wire fatigue life. Increasing the wire aspect ratio lowers its critical stress and increases its fatigue life. Moreover, we found that CucorAl wire has superior performance and longer fatigue life than Al wire. View Full-Text
Keywords: reliability; electronic packaging; power modules; wire bonding; heel stress reliability; electronic packaging; power modules; wire bonding; heel stress
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Dagdelen, T.; Abdel-Rahman, E.; Yavuz, M. Reliability Criteria for Thick Bonding Wire. Materials 2018, 11, 618.

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