Next Article in Journal
The Influence of Quench Interruption and Direct Artificial Aging on the Hardening Response in AA6082 during Hot Deformation and In-Die Quenching
Next Article in Special Issue
Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO2 Nanoparticles
Previous Article in Journal
Effect of Backing Plate Materials in Micro-Friction Stir Butt Welding of Dissimilar AA6061-T6 and AA5052-H32 Aluminum Alloys
Review

Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

1
Department of Materials Science and Engineering, University of Seoul, 163 Seoulsiripdae-ro, Dongdaemun-gu, Seoul 02504, Korea
2
Department of Energy Systems Research and Department of Materials Science and Engineering, Ajou University, Suwon 16499, Korea
*
Author to whom correspondence should be addressed.
Metals 2020, 10(7), 934; https://doi.org/10.3390/met10070934
Received: 8 June 2020 / Revised: 5 July 2020 / Accepted: 7 July 2020 / Published: 11 July 2020
Transient liquid phase (TLP) bonding is a novel bonding process for the joining of metallic and ceramic materials using an interlayer. TLP bonding is particularly crucial for the joining of the semiconductor chips with expensive die-attached materials during low-temperature sintering. Moreover, the transient TLP bonding occurs at a lower temperature, is cost-effective, and causes less joint porosity. Wire bonding is also a common process to interconnect between the power module package to direct bonded copper (DBC). In this context, we propose to review the challenges and advances in TLP and ultrasonic wire bonding technology using Sn-based solders for power electronics packaging. View Full-Text
Keywords: power module; TLP bonding; wire bonding; brazing; die-attached materials power module; TLP bonding; wire bonding; brazing; die-attached materials
Show Figures

Figure 1

MDPI and ACS Style

Kang, H.; Sharma, A.; Jung, J.P. Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics. Metals 2020, 10, 934. https://doi.org/10.3390/met10070934

AMA Style

Kang H, Sharma A, Jung JP. Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics. Metals. 2020; 10(7):934. https://doi.org/10.3390/met10070934

Chicago/Turabian Style

Kang, Hyejun, Ashutosh Sharma, and Jae P. Jung 2020. "Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics" Metals 10, no. 7: 934. https://doi.org/10.3390/met10070934

Find Other Styles
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Article Access Map by Country/Region

1
Back to TopTop