A SiC fin-channel MOSFET structure (Fin-MOS) is proposed for an enhanced gate shielding effect. The gates are placed on each side of the narrow fin-channel region, while grounded p-shield regions below the gates provide a strong shielding effect. The...
Multiple-mesa-fin-channel array patterned by a laser interference photolithography system and gallium oxide (Ga2O3) gate oxide layer deposited by a vapor cooling condensation system were employed in double-channel Al0.83In0.17N/GaN/Al0.18Ga0.82N/GaN...
Using the SST k-ω turbulence model, a comprehensive numerical investigation was conducted to analyze the flow and heat transfer characteristics of steam within an isosceles trapezoidal cooling channel with pin-fin arrays modeled from the traili...
This paper presents the numerical simulation results of conjugate mixed convection in a three-dimensional channel with a heat-generating element and solid fins. It should be noted that the symmetrical location of fins has been studied. The system of...
Heat enhancement has been addressed by studying flow in channels with different shapes. The present paper investigates a particular channel shape with divergent and convergent forms. Two configurations are addressed: wall channels and pin-fin walls f...
The present study studied the flow boiling heat transfer performance of a mini channel with offset fins experimentally. The hydraulic diameter for it is 1.59 mm with 9 offset rectangular channels. The influences of saturation pressure, mass flux and...
Effective thermal management is critical for sustaining the performance, durability, and stability of a proton exchange membrane fuel cell (PEMFC). A thorough numerical investigation of six multi-fin zigzag cooling-channel geometries operating under...
Multi-gate field effect transistors (FETs) such as FinFETs are severely affected by short-channel effects (SCEs) below 14 nm technology nodes, with even taller fins incurring fringing capacitances. This leads to performance degradation of the devices...
The recent developments in the replacement of bulk MOSFETs with high-performance semiconductor devices create new opportunities in attaining the best device configuration with drive current, leakage current, subthreshold swing, Drain-Induced Barrier...
To get the maximum heat transfer in real applications, the surface area of the micro-features (micro-channels) needs to be large as possible. It can be achieved by producing a maximum number of micro-channels per unit area. Since each successive pair...
The prediction of the heat transfer coefficient commonly relies on the development of new empirical prediction equations when operating conditions and refrigerants change from the existing equations. Creating new prediction equations is expensive and...
This work used a porous approach model to numerically investigate the fluid flow and heat transfer characteristics of the pin-fin heat-sink array in a rectangular channel with in-line arrangement. The air flow through the channel was laminar. The pin...
Electronic devices are now ubiquitous across both professional and personal domains, often containing sensitive information that should remain undisclosed to untrustworthy third parties. Consequently, there is an increased demand for effective securi...
Pin-fins configurations have been investigated recently for different engineering applications and, in particular, for a cooling turbine. In the present study, we investigated the performance of three different pin-fins configurations: pin-fins formi...
In this work, Al0.83In0.17N/GaN/Al0.18Ga0.82N/GaN epitaxial layers used for the fabrication of double-channel metal–oxide–semiconductor high-electron mobility transistors (MOSHEMTs) were grown on silicon substrates using a metalorganic ch...
Efficient thermal management is critical for sustaining the performance and durability of Proton Exchange Membrane Fuel Cells (PEMFCs), where excessive operating temperatures accelerate material degradation and reduce power output. Previous studies h...
In this paper, we proposed a novel saddle type FinFET (S-FinFET) to effectively solve problems occurring under the capacitor node of a dynamic random-access memory (DRAM) cell and showed how its structure was superior to conventional S-FinFETs in ter...
The parasitic Sub-Fin, beneath the stacked nanosheet FETs, limits both leakage and heat dissipation, acting as the bottleneck for improving the performance of NS-FETs. A Sub-Fin edit technology based on remote plasma etching is proposed to modulate t...
The microchannel heat sink has been recognized as an excellent solution in high-density heat flux devices for its high efficiency in heat removal with limited spaces; however, the most effective structure of microchannels for heat dissipation is stil...
Owing to its relatively high heat transfer performance and simple configurations, liquid cooling remains the preferred choice for electronic cooling and other applications. In this cooling approach, channel design plays an important role in dictating...
This work performs a detailed comparison of the channel width folding effectiveness of the FinFET, vertically stacked nanosheet transistor (VNSFET), and vertically stacked nanowire transistor (VNWFET) under the constraints of the same vertical (fin)...
In practical engineering applications, natural air cooling is often utilized for photovoltaic (PV) facades. However, the natural-air-cooling method is not effective at cooling PV wall panels, and the high temperatures accumulated on the surface of PV...
In this work, we propose a vertical gate-all-around device architecture (GAA-FinFET) with the aim of simultaneously improving device performance as well as addressing the short channel effect (SCE). The GAA-FinFET was built using the technology compu...
Among multi-gate field effect transistor (FET) structures, FinFET has better short channel control and ease of manufacturability when compared to other conventional bulk devices. The radio frequency (RF) performance of FinFET is affected by gate-cont...
The surge in demand for 3D MOSFETs, such as FinFETs, driven by recent technological advances, is explored in this review. FinFETs, positioned as promising alternatives to bulk CMOS, exhibit favorable electrostatic characteristics and offer power/perf...
This paper proposes a new technique to engineer the Fin channel in vertical GaN FinFET toward a straight and smooth channel sidewall. Consequently, the GaN wet etching in the TMAH solution is detailed; we found that the m-GaN plane has lower surface...
The flow and heat transfer characteristics of a closed-loop cooling system with a mini-channel heat sink for thermal management of electronics is studied experimentally. The heat sink is designed with corrugated fins to improve its heat dissipation c...
Printed-circuit heat exchangers (PCHEs) are compact exchangers with exceptional heat-transfer properties that are important for supercritical CO2 technology. Recalculating the heat transfer under off-design conditions is a common task. Thus, in this...
Developmental patterning is essential for regulating cellular events such as axial patterning, segmentation, tissue formation, and organ size determination during embryogenesis. Understanding the patterning mechanisms remains a central challenge and...
NFinFET transistors with various fin widths (110 nm, 115 nm, and 120 nm) are put into measurements, and the data are collected. By using the modified model, the measure data is fitted. Several parameters in the formula of modified model are determine...
Three-dimensional bulk fin-type field-effect transistors (FinFETs) have been the dominant devices since the sub-22 nm technology node. Electrical characteristics of scaled devices suffer from different process variation effects. Owing to the trapping...
Owing to the recent increase in mobile banking customers, studies exploring self-service channels and customer responses as distribution channels in the retail banking industry are also rapidly expanding. Moreover, with the emergence of big data and...
The conversion efficiency of photovoltaic (PV) cells can be increased by reducing high temperatures with appropriate cooling. Passive cooling systems using air, water, ethylene glycol, and air/water+TiO2 nano bi-fluid froth in the duct channel have b...
The micro-channel heat sink (MCHS) is an excellent choice due to its exceptional cooling capabilities, surpassing those of its competitors. In this research paper, a computational fluid dynamics analysis was performed to investigate the laminar flow...
Three dimensional (3-D) FinFET devices with an ultra-high Si-fin aspect ratio have been developed after integrating a 14Å nitrided gate oxide upon the silicon on insulator (SOI) wafers through an advanced CMOS logic platform. Under the lower gate vol...
In this paper, to solve the epitaxial thickness limit and the high interface trap density of SiGe channel Fin field effect transistor (FinFET), a four-period vertically stacked SiGe/Si channel FinFET is presented. A high crystal quality of four-perio...
In this manuscript, the integration of a strained Ge channel with Si-based FinFETs was investigated. The main focus was the preparation of high-aspect-ratio (AR) fin structures, appropriate etching topography and the growth of germanium (Ge) as a cha...
This review presents the nucleate/convective boiling performance for a variety of important low global warming potential (LGWP) alternatives to commonly used high-global warming potential (GWP) refrigerants (such as R-134a, R404A, and R-410A, etc.)....
FinFET devices and Silicon-On-Insulator (SOI) devices are two mainstream technical routes after the planar MOSFET reached the limit for scaling. The SOI FinFET devices combine the benefits of FinFET and SOI devices, which can be further boosted by Si...
A water evaporator is a phase change heat exchanger, as a heat sink, especially for high-speed flight vehicles. It is composed of internal channels for convective cooling and external fins for boiling. In this paper, six water evaporators, Hex0&ndash...
To improve the convective heat transfer in internal cooling channels of heavy-duty gas turbine blades, this study experimentally and numerically investigates the thermal performance of rectangular channels with hybrid pin-fins and micro V-ribs turbul...
In this work, a discontinuous airfoil fin printed circuit heat exchanger (PCHE) was used as a recuperator in a micro gas turbine system. The effects of the airfoil fin geometry parameters (arc height, maximum arc height position, and airfoil thicknes...
In this study, the heat transfer augmentation and friction factor of a novel type of solar air heater (SAH), which incorporates longitudinal fins and rectangular turbulators, were investigated numerically with different arrangements of the turbulator...
Large-eddy simulations (LES) were performed to study the turbulent flow in a channel of height H with a staggered array of pin fins with diameter D = H/2 as a function of heating loads that are relevant to the cooling of turbine blades and vanes. The...
The acquirement of the flow information in plate-fin heat exchanger (PFHE) is limited by its metal structure and complex flow condition. This work develops a new distributed optical measurement system to obtain flow information and boiling intensity....
Non-invasive side-channel attacks (SCAs) based on leakage power analysis (LPA) have received more attention recently, since leakage current has gradually become more dominant with further scaled technologies. For SRAM cells, LPA exploits the correlat...
This paper confirms that the electrical characteristics of FinFETs such as the on/off ratio, drain-induced barrier lowering (DIBL), and sub-threshold slope (SS) can be improved by optimizing the FinFET spacer structure. An operating voltage that can...
Airfoil fin printed circuit heat exchangers (PCHEs) have broad application prospects in the naval, aerospace, electric power, and petrochemical industries. The channel structure is a critical factor affecting their thermal-hydraulic characteristics....
A comprehensive 3D Multiphysics model was developed to simulate a plate fin heat exchanger designed for hydrogen liquefaction, incorporating an ortho-para hydrogen conversion catalyst in the hot fin channel. The model encompassed the 3D serrate fin s...
The printed circuit heat exchanger (PCHE) with discontinuous fins is a novel type of compact and highly efficient plate heat exchanger, which has superior thermal hydraulic performance. The morphology and characteristics of the flow channel greatly a...
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