- Review
Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review
- Yongkun Wang,
- Haozheng Liu,
- Linghua Huo,
- Haobin Li,
- Wenchao Tian,
- Haoyue Ji and
- Si Chen
With the advancement of Moore’s Law reaching its limits, advanced packaging technologies represented by Flip Chip (FC), Wafer-Level Packaging (WLP), System in Package (SiP), and 3D packaging have received significant attention. While advanced p...