Metallic substrates and polymer adhesive in composite-metal joints have a relatively large coefficient of thermal expansion (CTE) mismatch, which is a barrier in the growing market of electric vehicles and their battery structures. It is reported tha...
An optical fiber sensor surface bonded onto a host structure and subjected to a temperature change is analytically studied in this work. The analysis is developed in order to assess the thermal behavior of an optical fiber sensor designed for measuri...
Electrical resistance strain gauges are widely used in asymmetric structures for measurement and monitoring, but their thermal output in changing temperature environments has a significant impact on the measurement results. Since thermal output is re...
The periodic thermal loads to which electronic devices are exposed during operation induce alternating thermal stresses due to the mismatched coefficients of thermal expansion (CTE) between the solder joints and the surrounding materials. This leads...
Herein, we study electronic and thermoelectric transport in a type I Weyl semimetal nanojunction, with a torsional dislocation defect, in the presence of an external magnetic field parallel to the dislocation axis. The defect is modeled in a cylindri...
Interfacial stress between layers of thermal barrier coatings near free edges is a critical factor that may cause turbine blades to fail. This paper uses simulation methods to reveal the effects of variations in geometric and material parameters on t...
Thermal barrier coatings (TBCs) are commonly used to protect gas turbine components from high temperatures and oxidation. Such coatings consist of ceramic top coats and metallic bond coats. The mismatch in thermal expansion of the top coat, the bond...
The coupled thermo-mechanical response of a refined lined rock cavern (LRC) model for a real compressed air energy storage (CAES) plant is numerically investigated. The simulation captures inelastic mechanical behaviors of the steel liner, stiffening...
We have designed and then grown a simple structure for high electron mobility transistors (HEMTs) on silicon, where as usual two transitional layers of AlxGa1−xN (x = 0.35, x = 0.17) have been used in order to engineer the induced strain as a r...
Piezoelectric fiber composites (PFC) have shown excellent performance in the areas of vibration control and deformation control. The viscosity and rigidity of the epoxy resin before and after curing, respectively, were very important factors that aff...
Epitaxial thick films of yttrium iron garnet (YIG) are ideal for use in microwave devices due to their low losses at high frequencies. This report is on the growth of strain-engineered YIG films by liquid-phase epitaxy (LPE) on yttrium aluminum garne...
Wide-bandgap indium-oxide thermoelectric materials face a strong electrical–thermal transport trade-off and low structural reliability, limiting their thermoelectric efficiency and practical deployment on welding robots. To overcome these bottl...
GeSi alloy quantum dots (QDs) are a promising candidate for a light source implemented in Si-based monolithic optoelectronic integrated circuits (MOEICs) thanks to their telecom-wavelength emission and the compatibility with the Si integration techno...
A substantial contribution of the stresses that arise inside the Plasma-Facing Components (PFCs) when a heat load is applied is caused by the mismatch of the Coefficient of Thermal Expansion (CTE) between the armor, usually made of tungsten (W), and...
Advanced composite materials have been widely applied in aerospace structures owing to their low weight, high strength, excellent fatigue resistance, and corrosion resistance. However, during the curing and molding processes of carbon-fiber composite...
High-temperature operation service conditions can be used to evaluate the durability of Atmospheric Plasma-Sprayed Thermal Barrier Coating systems (APS-TBCs). To evaluate the durability of TBCs within their life span, two different thermal cycling te...
The main purpose of this study was to investigate the effects of 10, 20, and 40 wt% micron-sized particles (aluminum nitride, aluminum oxide, silicon nitride, and silicon oxide) on the thermal performance of an epoxy resin used in microelectronic dev...
The thermal through-silicon-via (TTSV) has a serious thermal stress problem due to the mismatch of the coefficient of thermal expansion between the Si substrate and filler metal. At present, the thermal stress characteristics and strain mechanism of...
Spacecraft and launch-vehicle structures require lightweight multipoint monitoring under combined mechanical, thermal, and environmental loads. This study presents an analytical fiber Bragg grating (FBG) sensor-network workflow integrating reference-...
Delamination is a critical failure mode in composite laminates that degrades the structural performance and load-carrying capacity. This study investigates the improvement of Mode I and Mode II interlaminar fracture toughness of carbon fiber-reinforc...
In this study, the AZ31 magnesium alloy was reinforced with tungsten disulfide (WS2) nanotubes to fabricate the nanocomposite using the stir casting method. The microstructural analysis, mechanical and wear behaviors were investigated with the effect...
The tremendous demand for low-cost, low-consumption and high-capacity optical transmitters in data centers challenges the current InP-photonics platform. The use of silicon (Si) photonics platform to fabricate photonic integrated circuits (PICs) is a...
three-dimensional integrated circuit (3D-IC) structure with a significant scale mismatch causes difficulty in analytic model construction. This paper proposes a simulation technique to introduce an equivalent material composed of microbumps and their...
Direct integration of III–V light emitting sources on Si substrates has attracted significant interest for addressing the growing limitations for Si-based electronics and allowing the realization of complex optoelectronics circuits. However, the high...
Residual stresses in multilayer thin coatings represent a complex multiscale phenomenon arising from the intricate interplay of multiple factors, including the number and thickness of layers, material properties of the layers and substrate, coefficie...
Si-based group III-V material enables a multitude of applications and functionalities of the novel optoelectronic integration chips (OEICs) owing to their excellent optoelectronic properties and compatibility with the mature Si CMOS process technolog...
Thermoplastic fiber-metal hybrid structures have attracted increasing attention for lightweight structure applications owing to their high specific strength and damage tolerance. Al/CF/PEEK hybrid components are promising lightweight structures in wh...
Polymer–ceramic piezoelectric composites are widely investigated to combine the high piezoelectric performance of ferroelectric ceramics with the flexibility and processability of electroactive polymers. However, achieving enhanced dielectric p...