Special Issue "Hybrid and Heterogeneous Integration on Photonic Circuits: New Opportunities for Multifunctional Photonic Platforms"

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Optics and Lasers".

Deadline for manuscript submissions: closed (20 October 2020).

Special Issue Editor

Dr. Joan Manel Ramírez
Guest Editor
Nokia Bell Labs France, III-V Lab, 1 Avenue Augustin Fresnel, 91767 Palaiseau, France
Interests: hybrid III-V/Si photonic integrated circuits for high-speed optical communication; sensing and optical computing

Special Issue Information

Dear Colleagues,

The field of Silicon Photonics has rapidly evolved over the last few years, supported by the gain in maturity of the technology, design tools, and methods employed. The quest for new ideas and concepts to deploy low-cost, compact, and power-efficient photonic circuits with a high wafer yield and robustness that are able to meet the requirements in several application domains has triggered a frenetic activity worldwide. Presently, photonic circuit technology has diversified its number of available platforms. Despite the fact that indium phosphide (InP) and silicon-on-insulator (SOI) platforms are still considered as the warhorses of integrated photonics in terms of maturity and deployment of active (InP) and passive (SOI) components, other alternatives such as germanium-on-silicon, silicon nitride-on-insulator or hybrid solutions combining different functional materials and Si are gaining momentum. A representative example is the hybrid III-V/Si platform, which has been used to develop on-chip tunable lasers for wavelength division multiplexing purposes.

Indeed, the possibility to integrate several materials in a single photonic technology represents an attractive playground scenario to explore novel functionalities not available before in monolithic approaches. In this regard, the implementation of multifunctional photonic circuits that collect, transmit or reconfigure data in real-time conditions while interacting with their environment may open the route for a new class of photonic circuits with a wide range of possibilities and applications.  

This Special Issue will focus on recent advancements on hybrid and heterogeneous photonic circuits spanning from materials, processing techniques, and implementation of novel components, devices, and circuits employing diverse materials to enable multifunctional photonic platforms. With a combination of invited and contributed papers, this issue will survey the state-of-the-art of hybrid and heterogeneous photonic circuit technology.

Dr. Joan Manel Ramírez
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • Silicon photonics
  • Photonic integrated circuits (PICs)
  • Heterogeneous integration
  • Multifunctional photonics
  • Reconfigurable photonics
  • Waveguides
  • Integrated lasers and semiconductor optical amplifiers (SOAs)
  • Indium phosphide photonics
  • Wafer bonding, die bonding
  • Optical communications
  • Sensors and actuators
  • High-speed optical components
  • 3D Photonics
  • Functional materials for photonics

Published Papers

There is no accepted submissions to this special issue at this moment.
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