Announcements

8 September 2022
Electronics | Highly Cited Papers in 2021 in the Section “Microelectronics”


The “Microelectronics” Section is dedicated to publishing original research articles and cutting-edge reviews for the applications of microelectronics in emerging, frontier, and challenging technologies. Electronics operating in extreme environments, such as vacuum, space, harsh radiation, extreme cold, and other niche applications, are today pushing microelectronic design beyond the frontier of standard electronics.

As our journal follows an open access format, you have free and unlimited access to the full text of all the articles published in it. We welcome you to read our most highly cited papers published in 2021 listed below:

1. “A Unified and Open LTSPICE Memristor Model Library”
by Valeri Mladenov
Electronics 2021, 10(13), 1594; https://doi.org/10.3390/electronics10131594
Available online: https://www.mdpi.com/2079-9292/10/13/1594

2. “Sheet Resistance Measurements of Conductive Thin Films: A Comparison of Techniques”
by Mira Naftaly et al.
Electronics 2021, 10(8), 960; https://doi.org/10.3390/electronics10080960
Available online: https://www.mdpi.com/2079-9292/10/8/960

3. “A New Cost-Efficient Design of a Reversible Gate Based on a Nano-Scale Quantum-Dot Cellular Automata Technology”
by Saeid Seyedi et al.
Electronics 2021, 10(15), 1806; https://doi.org/10.3390/electronics10151806
Available online: https://www.mdpi.com/2079-9292/10/15/1806

4. “AlGaN Channel High Electron Mobility Transistors with Regrown Ohmic Contacts”
by Idriss Abid et al.
Electronics 2021, 10(6), 635; https://doi.org/10.3390/electronics10060635
Available online: https://www.mdpi.com/2079-9292/10/6/635

5. “UV-Based Technologies for SARS-CoV2 Inactivation: Status and Perspectives”
by Nicola Trivellin et al.
Electronics 2021, 10(14), 1703; https://doi.org/10.3390/electronics10141703
Available online: https://www.mdpi.com/2079-9292/10/14/1703

6. “A Novel OTA Architecture Exploiting Current Gain Stages to Boost Bandwidth and Slew-Rate”
by Francesco Centurelli et al.
Electronics 2021, 10(14), 1638; https://doi.org/10.3390/electronics10141638
Available online: https://www.mdpi.com/2079-9292/10/14/1638

7. “Influence of Active Channel Layer Thickness on SnO2 Thin-Film Transistor Performance”
by Do Won Kim et al.
Electronics 2021, 10(2), 200; https://doi.org/10.3390/electronics10020200
Available online: https://www.mdpi.com/2079-9292/10/2/200

8. “A Triple-Cascode X-Band LNA Design with Modified Post-Distortion Network”
by Cheng Cao et al.
Electronics 2021, 10(5), 546; https://doi.org/10.3390/electronics10050546
Available online: https://www.mdpi.com/2079-9292/10/5/546 

9. “Effects of Active Layer Thickness on the Electrical Characteristics and Stability of High-Mobility Amorphous Indium–Gallium–Tin Oxide Thin-Film Transistors”
by Dae-Hwan Kim et al.
Electronics 2021, 10(11), 1295; https://doi.org/10.3390/electronics10111295
Available online: https://www.mdpi.com/2079-9292/10/11/1295

10. “All-Dielectric Metasurface for Sensing Microcystin-LR”
by Binze Ma et al.
Electronics 2021, 10(11), 1363; https://doi.org/10.3390/electronics10111363
Available online: https://www.mdpi.com/2079-9292/10/11/1363

8 September 2022
Electronics | Highly Cited Papers in 2021 in the Section “Electrical and Autonomous Vehicles”


The “Electrical and Autonomous Vehicles” Section addresses the different perspectives on the design, development, and usage of electric and autonomous vehicles, as well as their impact on people’s lives, on cities, and on power as well as energy systems. We welcome papers on innovative scientific and technical developments, sound case studies, and reviews which are relevant and/or related to “Electrical and Autonomous Vehicles”. As they are of an open access format, you have free and unlimited access to the full text of all the articles published in our journal. We welcome you to read our most highly cited papers published in 2021 listed below:

1. “Review of Electric Vehicle Technologies, Charging Methods, Standards and Optimization Techniques”
by Syed Muhammad Arif et al.
Electronics 2021, 10(16), 1910; https://doi.org/10.3390/electronics10161910
Available online: https://www.mdpi.com/2079-9292/10/16/1910

2. “Is There a Predisposition towards the Use of New Technologies within the Traffic Field of Emerging Countries? The Case of the Dominican Republic”
by Francisco Alonso et al.
Electronics 2021, 10(10), 1208; https://doi.org/10.3390/electronics10101208
Available online: https://www.mdpi.com/2079-9292/10/10/1208

3. “An Enhanced Multicell-to-Multicell Battery Equalizer Based on Bipolar-Resonant LC Converter”
by Xuan Luo et al.
Electronics 2021, 10(3), 293; https://doi.org/10.3390/electronics10030293
Available online: https://www.mdpi.com/2079-9292/10/3/293

4. “A Simulated Annealing Algorithm and Grid Map-Based UAV Coverage Path Planning Method for 3D Reconstruction”
by Sichen Xiao Azar et al.
Electronics 2021, 10(7), 853; https://doi.org/10.3390/electronics10070853
Available online: https://www.mdpi.com/2079-9292/10/7/853

5. “A Survey of Trust Management in the Internet of Vehicles”
by Sarah Ali Siddiqui et al.
Electronics 2021, 10(18), 2223; https://doi.org/10.3390/electronics10182223
Available online: https://www.mdpi.com/2079-9292/10/18/2223

6. “Ego-Motion Estimation Using Recurrent Convolutional Neural Networks through Optical Flow Learning”
by Baigan Zhao et al.
Electronics 2021, 10(3), 222; https://doi.org/10.3390/electronics10030222
Available online: https://www.mdpi.com/2079-9292/10/3/222

7. “Machine Learning-Based Vehicle Trajectory Prediction Using V2V Communications and On-Board Sensors”
by Dongho Choi et al.
Electronics 2021, 10(4), 420; https://doi.org/10.3390/electronics10040420
Available online: https://www.mdpi.com/2079-9292/10/4/420

8. “An Optimization Model for Energy Community Costs Minimization Considering a Local Electricity Market between Prosumers and Electric Vehicles”
by Ricardo Faia et al.
Electronics 2021, 10(2), 129; https://doi.org/10.3390/electronics10020129
Available online: https://www.mdpi.com/2079-9292/10/2/129

9. “Deep Feature-Level Sensor Fusion Using Skip Connections for Real-Time Object Detection in Autonomous Driving”
by Vijay John et al.
Electronics 2021, 10(4), 424; https://doi.org/10.3390/electronics10040424
Available online: https://www.mdpi.com/2079-9292/10/4/424

10. “A Survey on Deep Learning Based Approaches for Scene Understanding in Autonomous Driving”
by Zhiyang Guo et al.
Electronics 2021, 10(4), 471; https://doi.org/10.3390/electronics10040471
Available online: https://www.mdpi.com/2079-9292/10/4/471

7 September 2022
Electronics | Highly Cited Papers in 2021 in the Section “Bioelectronics”


The primary focus of the “Bioelectronics” Section are topics that seek to utilize electronic knowledge and execution in the field of biology and medicine for health wellness with research efforts that cross disciplines, such as chemistry, life science, physics, electrical engineering, and materials science. Bioelectronic research works in a wide context, encompassing, for example, biosensors, bionics and biomaterials, DNA chips, lab-on-a-chip, innovative devices or advanced signal processes for the prevention, diagnosis, and treatment of physical and mental diseases, robotic devices for patient rehabilitation, bioelectromagnetics, artificial intelligence for improving health, conductive polymers, organic semiconductors, carbon nanotubes, graphene, wearable electronics, and implantable electronics, just to cite a few.

As they are published in an open access format, you have free and unlimited access to the full text of all the articles in our journal. We welcome you to read our most highly cited papers published in 2021:

1. “CNN Variants for Computer Vision: History, Architecture, Application, Challenges and Future Scope”
by Dulari Bhatt et al.
Electronics 2021, 10(20), 2470; https://doi.org/10.3390/electronics10202470
Available online: https://www.mdpi.com/2079-9292/10/20/2470

2. “Automated Workers’ Ergonomic Risk Assessment in Manual Material Handling Using sEMG Wearable Sensors and Machine Learning”
by Srimantha E. Mudiyanselage et al.
Electronics 2021, 10(20), 2558; https://doi.org/10.3390/electronics10202558
Available online: https://www.mdpi.com/2079-9292/10/20/2558

3. “State-of-the-Art Optical Devices for Biomedical Sensing Applications—A Review”
by N. L. Kazanskiy et al.
Electronics 2021, 10(8), 973; https://doi.org/10.3390/electronics10080973
Available online: https://www.mdpi.com/2079-9292/10/8/973

4. “Multiclass ECG Signal Analysis Using Global Average-Based 2-D Convolutional Neural Network Modeling”
by Muhammad Wasimuddin et al.
Electronics 2021, 10(2), 170; https://doi.org/10.3390/electronics10020170
Available online: https://www.mdpi.com/2079-9292/10/2/170

5. “Integration and Applications of Fog Computing and Cloud Computing Based on the Internet of Things for Provision of Healthcare Services at Home”
by Muhammad Ijaz et al.
Electronics 2021, 10(9), 1077; https://doi.org/10.3390/electronics10091077
Available online: https://www.mdpi.com/2079-9292/10/9/1077

6. “An Overview of Wearable Piezoresistive and Inertial Sensors for Respiration Rate Monitoring”
by Roberto De Fazio et al.
Electronics 2021, 10(17), 2178; https://doi.org/10.3390/electronics10172178
Available online: https://www.mdpi.com/2079-9292/10/17/2178

7. “Generating Synthetic ECGs Using GANs for Anonymizing Healthcare Data”
by Esteban Piacentino et al.
Electronics 2021, 10(4), 389; https://doi.org/10.3390/electronics10040389
Available online: https://www.mdpi.com/2079-9292/10/4/389

8. “Deep Learning Methods for Classification of Certain Abnormalities in Echocardiography”
by Imayanmosha Wahlang et al.
Electronics 2021, 10(4), 495; https://doi.org/10.3390/electronics10040495
Available online: https://www.mdpi.com/2079-9292/10/4/495

9. “Bone Metastasis Detection in the Chest and Pelvis from a Whole-Body Bone Scan Using Deep Learning and a Small Dataset”
by Da-Chuan Cheng et al.
Electronics 2021, 10(10), 1201; https://doi.org/10.3390/electronics10101201
Available online: https://www.mdpi.com/2079-9292/10/10/1201

10. “GaborPDNet: Gabor Transformation and Deep Neural Network for Parkinson’s Disease Detection Using EEG Signals”
by Hui Wen Loh et al.
Electronics 2021, 10(14), 1740; https://doi.org/10.3390/electronics10141740
Available online: https://www.mdpi.com/2079-9292/10/14/1740

7 September 2022
Electronics | Highly Cited Papers in 2021 in the Section “Artificial Intelligence”


The Section “Artificial Intelligence” mainly covers topics of interest within unique hardware-based deep learning AI and algorithmic deep learning AI using machine learning. The purpose of this Section is to bring together researchers and engineers, from both academia and industry, to present novel ideas and solid research on the hardware and algorithmic aspects of advanced applications of deep-learning-based AI.

As they are published in an open access format, you have free and unlimited access to the full text of all of the articles published in our journal. We welcome you to read our most highly cited papers published in 2021 below:

1. “Biometric User Identification Based on Human Activity Recognition Using Wearable Sensors: An Experiment Using Deep Learning Models”
by Sakorn Mekruksavanich and Anuchit Jitpattanakul
Electronics 2021, 10(3), 308; https://doi.org/10.3390/electronics10030308
Available online: https://www.mdpi.com/2079-9292/10/3/308

2. “Novel Control Strategy for Enhancing Microgrid Operation Connected to Photovoltaic Generation and Energy Storage Systems”
by Dina Emara et al.
Electronics 2021, 10(11), 1261; https://doi.org/10.3390/electronics10111261
Available online: https://www.mdpi.com/2079-9292/10/11/1261

3. “Deep Convolutional Neural Network with RNNs for Complex Activity Recognition Using Wrist-Worn Wearable Sensor Data”
by Sakorn Mekruksavanich and Anuchit Jitpattanakul
Electronics 2021, 10(14), 1685; https://doi.org/10.3390/electronics10141685
Available online: https://www.mdpi.com/2079-9292/10/14/1685

4. “Artificial Neural Networks Based Optimization Techniques: A Review”
by Maher G. M. Abdolrasol et al.
Electronics 2021, 10(21), 2689; https://doi.org/10.3390/electronics10212689
Available online: https://www.mdpi.com/2079-9292/10/21/2689

5. “An Advanced CNN-LSTM Model for Cryptocurrency Forecasting”
by Ioannis E. Livieris et al.
Electronics 2021, 10(3), 287; https://doi.org/10.3390/electronics10030287
Available online: https://www.mdpi.com/2079-9292/10/3/287

6. “A Fuzzy Logic Model for Hourly Electrical Power Demand Modeling”
by Marco Antonio Islas et al.
Electronics 2021, 10(4), 448; https://doi.org/10.3390/electronics10040448
Available online: https://www.mdpi.com/2079-9292/10/4/448 

7. “A Survey on Machine Learning-Based Performance Improvement of Wireless Networks: PHY, MAC and Network Layer”
by Merima Kulin et al.
Electronics 2021, 10(3), 318; https://doi.org/10.3390/electronics10030318
Available online: https://www.mdpi.com/2079-9292/10/3/318

8. “Improved YOLOv3 Network for Insulator Detection in Aerial Images with Diverse Background Interference”
by Chuanyang Liu et al.
Electronics 2021, 10(7), 771; https://doi.org/10.3390/electronics10070771
Available online: https://www.mdpi.com/2079-9292/10/7/771

9. “Concrete Cracks Detection and Monitoring Using Deep Learning-Based Multiresolution Analysis”
by Ahcene Arbaoui et al.
Electronics 2021, 10(15), 1772; https://doi.org/10.3390/electronics10151772
Available online: https://www.mdpi.com/2079-9292/10/15/1772

10. “EWOA-OPF: Effective Whale Optimization Algorithm to Solve Optimal Power Flow Problem”
by Mohammad H. Nadimi-Shahraki et al.
Electronics 2021, 10(23), 2975; https://doi.org/10.3390/electronics10232975
Available online: https://www.mdpi.com/2079-9292/10/23/2975

5 September 2022
Electronics | Call for Special Issue Proposal

Electronics (ISSN 2079-9292) is an international, peer-reviewed, and open access journal on the science of electronics and its applications. It publishes reviews, research articles, short communications, and letters. Our aim is to encourage scientists to publish their experimental and theoretical results in as much detail as possible. There is no restriction on the length of the papers.

The Electronics editorial team is pleased to announce this open call for Special Issue proposals, which gives a group of authors the opportunity to work on an interconnected set of papers on an innovative topic. We would like to solicit high-quality proposals, which will be evaluated by a competitive procedure on a rolling basis throughout the year.

Proposals within the scope of the journal are welcome. For more details, please see the following link: https://www.mdpi.com/journal/electronics/about.

If you would like to propose a Special Issue topic for this journal, please click on the following link and complete and submit the form: https://www.mdpi.com/journalproposal/sendproposalspecialissue/electronics. Our editors will get back to you shortly.

The duties and benefits of acting as a Guest Editor are as follows:

  • Publishing both a review paper and a research paper free of charge in the Special Issue, in addition to a potential discount for additional papers that you invite;
  • Redefining the title and scope of the Special Issue;
  • Circulating the call for papers for the Special Issue and inviting submissions;
  • Making decisions on whether a manuscript can be accepted based on the reports that we collect;
  • Promoting the Special Issue and increasing its visibility at related academic conferences;
  • If ten or more papers are published in the Special Issue, we can make a Special Issue book and send a hard copy to each Guest Editor.

The Editorial Office will take care of setting up the Special Issue website, arrange the promotional materials, assist with invitations to contribute papers, and take care of the rest of the administrative tasks associated with peer review, including inviting reviewers, collating reports, contacting authors, and professional production before publication.

Please do not hesitate to contact the Editorial Office (electronics@mdpi.com) for further details and clarification.

We look forward to receiving your proposals.

Electronics Editorial Office

1 September 2022
Meet Us at the Seventh International Conference on Data Mining and Big Data (DMBD'2022), 21–24 November 2022, Beijing, China


The Seventh International Conference on Data Mining and Big Data
 (DMBD'2022) is an international forum allowing researchers and practitioners to exchange the latest theories, algorithms, models, and applications of data mining and big data, as well as artificial intelligence techniques. Data mining refers to examining big data sets to look for relevant or pertinent information. Big data contains huge amounts of data and information and is worthy of in-depth research.

DMBD'2022 is the seventh event, following the Guangzhou, Belgrade, Chiang Mai, Shanghai, Fukuoka and Bali events, at which hundreds of delegates from all over the world gathered to share their latest achievements, innovative ideas, and marvelous designs and their implementations.

This year's main theme is FinTech, and we will pay particular attention to technologies and applications in this area. We will also hold a quantitative trading competition.

The main topics of the conference are as follows:

1. FinTech
  • Quantitative investment;
  • Market microstructure;
  • Fraud detection;
  • Risk prediction;
  • Credit modeling;
  • Individual financing;
  • Financial theories;
  • Financial activities modeling;
  • Financial intelligent system.
2. Data mining
  • Machine learning;
  • Statistical learning;
  • Supervised learning;
  • Unsupervised, self-supervised learning;
  • Few-shot learning;
  • Transfer learning;
  • Reinforcement learning;
  • Meta learning;
  • Systems for data mining;
  • Mining text, semi-structured, spatiotemporal, streaming, graph, web, multimedia data;
  • Personalization and recommendation systems;
  • Case-based reasoning;
  • Similarity-based reasoning.
3. Big Data
  • Data models and architectures;
  • Security, privacy, and trust;
  • Data protection and integrity;
  • Identity theft, data loss and leakage;
  • Legal and ethical issues;
  • Data analytics and metrics;
  • Data representation and structures;
  • Data management and processing;
  • Data capturing and acquisition;
  • Tools and technologies QoS in big data.
4. Applications
  • Social networks analysis;
  • Data searching and mining;
  • Visualization of data;
  • Personal data logging and quantified self;
  • Context-aware data;
  • Data economics;
  • Applications of data mining and big data;
  • Methodologies and use cases;
  • Usability issues;
  • Storages and network requirements;
  • Network models and protocols;
  • Big data in cloud and IoT;
  • Techniques for big data processing.

28 July 2022
Meet Us at the 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE 2022), 26–29 August 2022, Chengdu, China


The 9th International Symposium on Microwave, Antenna, Propagation, and EMC Technologies for Wireless Communications
(MAPE 2022) will be held from 26 to 29 August 2022, in Chengdu, China. MAPE 2022 is sponsored by the University of Electronic Science and Technology of China and Beijing Jiaotong University and is technically supported by the IEEE Antennas and Propagation Society. MAPE was initiated to celebrate the 20th anniversary of the foundation of IEEE Beijing Section in 2005. After several years, it has become the flagship wireless event of the IEEE Beijing Section, geared toward wireless communication industry professionals interested in the latest research and design.

This symposium will provide a multi-discipline forum allowing researchers and technologists in the fields of microwave, antenna, propagation, and EMC technologies to present new ideas and contributions in the form of technical papers and panel discussions on applications in the ever-growing area of wireless communications, such as 6G, NB-IoT, and LoRa.

Scope:

The topics of the symposium will cover all aspects of the theory and techniques of microwaves, antennas, propagation, and EMC necessary for wireless communications. Potential topics include, but are not limited to, the following:

  1. Systems and Services:
  • Mobile Satellite Communication;
  • WLANs;
  • Wireless Sensors and Ad Hoc Networks;
  • MIMO Technologies;
  • UWB and Impulse Radio;
  • Space—Time Channel Characterization and Modeling;
  • Terahertz Imaging and Sources;
  • Cyber Electromagnetics;
  • Internet of Things;
  • High-Power Microwave Systems.
  1. Microwave Electronics:
  • Passive and Active Circuits;
  • Power Amplifiers, Linearization, and Active Components;
  • MMICs and Microwave Circuits;
  • Microwave and Millimeter Wave ICs;
  • Millimeter Wave and Sub-Millmeter Wave Components;
  • Circuits and Systems.
  1. Antennas:
  • Microstrip and Printed Antennas;
  • Active and Integrated Antennas;
  • Array Antennas, Phased Arrays, and Feeding Circuits;
  • Mobile and Base Station Antennas;
  • Adaptive and Smart Antennas;
  • Ultra-Wideband, Broadband, and Multi-band Antennas;
  • Reconfigurable Antennas and Arrays;
  • Millimeter Wave and Sub-Millimeter Wave Antennas;
  • MEMS/Nanotechnology for Antennas.
  1. Propagation:
  • Mobile and Indoor Propagation;
  • Millimeter and Optical Wave Propagation;
  • Earth-Space and Terrestrial Propagation;
  • Ionospheric Propagation;
  • Propagation and Channel Characterization;
  • Diversity Techniques and Fading Countermeasures;
  • Signal Separation and Interference Rejection;
  • Random Media and Rough Surfaces.
  1. Electromagnetics:
  • Electromagnetic Theory;
  • Complex Media and Artificial Media;
  • Computational Electromagnetics;
  • Biomedical Application of Electromagnetic Waves;
  • EM-Plasma Interaction;
  • Space–Time Modulated Electromagnetics.
  1. EMC Technologies:
  • EMC Sources: Electromagnetic Environment, Lightning, Intentional EMI and EMP, High Power Electromagnetics, ESD, and UWB;
  • EMC of Components and Integrated Circuits, PCB, Electronic Packaging and Integration;
  • EMC in Power Systems and Power Quality;
  • System Level EMC;
  • EMC in Power Electronics;
  • EMC in Smart Grids;
  • EMC in Internet of Things;
  • EMC in Communications: Wired and Wireless Communications, 6G, UWB, and Power Line Communications;
  • EMC Standards, Management, and Regulations;
  • EMC in Aerospace.

For further information, please refer to the conference website, or contact us via contact@ieee-mape.org.

11 July 2022
MDPI’s 2021 Best Paper Awards in “Engineering”—Winners Announced

The purpose of our Best Paper Awards is to promote and recognize the most impactful contributions published within MDPI journals.

The academic editors of each journal carefully selected reviews and research papers through a rigorous judging process based on criteria such as the scientific merit, overall impact, and the quality of presentation of the papers published in the journal.

We are honored to present the winners in the “Engineering” category, who were selected amongst extensive competition, and congratulate the authors for their outstanding scientific publications.

Actuators:

Batteries:

Chemosensors:

Journal of Marine Science and Engineering:

Lubricants:

Micromachines:

Processes:

Sensors:

World Electric Vehicle Journal:

11 July 2022
MDPI’s 2021 Young Investigator Awards in “Engineering—Winners Announced

MDPI’s Young Investigator Awards recognize promising junior researchers, acknowledge their contributions, and enhance communication among scientists. We are proud to present the winners for the year 2021 in the “Engineering” category. The winners were selected by the journals’ editors.

We warmly congratulate the awarded Young Investigators for their outstanding contributions. MDPI will continue to provide support and recognition to the academic community.

Biosensors:

  • Amay J. Bandodkar, North Carolina State University, USA.

ChemEngineering:

  • Andrew S. Paluch, Miami University, USA.

Chemosensors:

  • Mindy Levine, Ariel University, Israel.

Electronics:

  • Amir H. Gandomi, University of Technology Sydney, Australia.

Journal of Marine Science and Engineering:

  • Tiago Fazeres-Ferradosa, University of Porto, Portugal.

Machines:

  • Chen Lv, Nanyang Technological University (NTU), Singapore;
  • Ignacio Gonzalez-Prieto, University of Malaga (UMA), Spain;
  • Ning Sun, Nankai University, China.

Processes:

  • Anton Rassõlkin, Tallinn University of Technology, Estonia.

Sensors:

  • Qammer H. Abbasi, Queen Mary University of London, UK;
  • Chi Hwan Lee, Purdue University, USA.

11 July 2022
MDPI’s 2021 Travel Awards in “Engineering”—Winners Announced

We are proud to recognize the winners of MDPI’s 2021 Travel Awards in the “Engineering” category for their outstanding presentations and to present them with the prize.

MDPI journals regularly offer travel awards to encourage talented junior scientists to present their latest research at academic conferences in specific fields, which helps to increase their influence.

The winners mentioned below were carefully selected by the journal editors based on an outline of their research and the work to be presented at an academic conference.

We would like to warmly congratulate the winners of this year’s Travel Awards and wish them the greatest success with their future research endeavors. MDPI will continue to enhance communication among scientists.

Actuators:

  • Matthew Wei Ming Tan, Nanyang Technological University, Singapore.

Applied Sciences:

  • Márcia de Sousa Oliveira, University of León, Spain;
  • Caroline Sarah Taylor, University of Sheffield, UK;
  • Raquel Viveiros, NOVA University of Lisbon, Portugal;
  • Alfonso González Briones, University of Salamanca, Spain;
  • Alen Horvat, University Carlos III Madrid, Spain;
  • Marie Švecová, University of Chemistry and Technology, Czech Republic;
  • Venanzio Giannella, University of Salerno, Italy;
  • Michaël Lobet, University of Namur, Belgium;
  • Lam Thi Ngoc Tran, National Research Council, Italy;
  • Hanfei Mei, University of South Carolina, USA.

Applied System Innovation:

  • Mert Nakip, Polish Academy of Sciences, Poland.

Biosensors:

  • Mengdi Bao, Rochester Institute of Technology, USA;

Yichi Su, Stanford University, USA.

Buildings:

  • Karthik Panchabikesan, Concordia University, Canada;
  • Xiaolei Yuan, Tongji University, China.

Chemosensors:

  • Verónica Montes García, Université de Strasbourg & CNRS, France.

Electronics:

  • Peng Hang, Nanyang Technological University, Singapore;
  • Alfonso González Briones, University of Salamanca, Spain.

Fluids:

  • Alberto Zingaro, Politecnico di Milano, Italy;
  • Sarah E. Morris, Auburn University, USA.

Infrastructures:

  • Angelo Aloisio, University of L’Aquila, Italy;
  • André Filipe Castanheira Alves Furtado, University of Porto, Portugal.

Journal of Low Power Electronics and Applications:

  • Tommaso Zanotti, University of Modena and Reggio Emilia, Italy.

Journal of Manufacturing and Materials Processing:

  • Nagalingam Arun Prasanth, Rolls-Royce@NTU Corporate Lab, Singapore.

Machines:

  • Muhammad Jamil, Nanjing University of Aeronautics and Astronautics (NUAA), China;
  • Mariagrazia Tristano, Sheffield Hallam University, UK.

Processes:

  • Michele Schlich, University of Cagliari, Italy;
  • Álvaro Santana Mayor, University of La Laguna, Spain.

Sensors:

  • Eleonora Macchia, Åbo Akademi University, Finland;
  • Alfonso Gonzalez Briones, University of Salamanca, Spain;
  • Saúl Vallejos Calzada, University of Burgos, Spain;
  • Ana Novo, University of Vigo, Spain;
  • Yalin Liu, Macau University of Science and Technology, China;
  • Marilena Giglio, Politecnico of Bari, Italy;
  • Yuzhi Shi, Nanyang Technological University (NTU), Singapore.

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