This paper presents the study of gold/gold thermocompression bonding at silicon wafer level. The first samples contains sealing rings and electrical pads, and are characterized on pull, and shear test showing bond strength similar to silicon/glass an...
The optimization of the autogenous diffusion copper bonding via thermocompression at vacuum environment was investigated. The influence of various bonding parameters on the interdiffusion efficiency was studied in detail at the micro (SEM-EBSD) and n...
Silicon-based microchannel technology offers unmatched performance in the cooling of silicon pixel detectors in high-energy physics. Although Si–Si direct bonding, used for the fabrication of cooling plates, also meets the stringent requirement...
Cu-Cu direct interconnects are highly desirable for the microelectronic industry as they allow for significant reductions in the size and spacing of microcontacts. The main challenge associated with using Cu is its tendency to rapidly oxidize in air....
To increase the yield of the wafer-level Cu-Cu thermo-compression bonding method, certain surface pre-treatment methods for Cu are studied which can be exposed to the atmosphere before bonding. To inhibit re-oxidation under atmospheric conditions, th...
Thermocompression bonding for wafer-level hermetic packaging was demonstrated at the lowest temperature of 370 to 390 °C ever reported using Al films with thin Sn capping or insertions as bonding layer. For shrinking the chip size of MEMS (micro elec...
Thermo-compression bonding (TCB) properties of Cu/SnAg pillar bumps on electroless palladium immersion gold (EPIG) were evaluated in this study. A test chip with Cu/SnAg pillar bumps was bonded on the surface-finished Cu pads with the TCB method. The...
Plasma- and water-assisted oxide-oxide thermocompression direct bonding for a self-assembly based multichip-to-wafer (MCtW) 3D integration approach was demonstrated. The bonding yields and bonding strengths of the self-assembled chips obtained by the...
The technology trends of next generation electronic packaging are moving toward heterogeneous 3D packaging systems. One of the key processes of 3D packaging system is Cu-to-Cu bonding, which is highly dependent on the planarized, activated, and oxyge...
Gold-to-gold (Au–Au) bonding forms an oxide-resistant metallic interface without solder or conductive adhesive, making it attractive for heterogeneous integration, MEMS sealing, optoelectronic packaging, and flexible hybrid electronics (FHEs)....
This research investigates resonator width optimization for simultaneously enhancing electrical performance and mechanical reliability in wideband RF MEMS filters through systematic evaluation of three configurations: 0% (L1), 60% (L2), and 100% (L3)...
This paper reports a 3-axis fully integrated differential capacitive tactile sensor surface-mountable on a bus line. The sensor integrates a flip-bonded complementary metal-oxide semiconductor (CMOS) with capacitive sensing circuits on a low temperat...
In soft electronics, anisotropic conductive adhesive films (ACFs) are the trending interconnecting approach due to their substantial softness and superior bondability to flexible substrates. However, low bonding pressure (≤1 MPa) and fine-pitch in...
This study demonstrates the achievement of robust Cu-Cu bonding strength through thermocompression bonding (TCB) under a formic acid (FA) atmosphere. When subjected to sintering at 300 °C for 1 min under FA, sintering joints exhibit an average sh...
To bond a semiconductor power chip on a substrate using the formation of bondlines exhibiting long-term mechanical durability at high temperatures such as 300 °C, compression-assisted sinter bonding between Cu finishes was carried out at 300&ndas...
Advanced packaging technology has become more and more important in the semiconductor industry because of the benefits of higher I/O density compared to conventional soldering technology. In advanced packaging technology, copper–copper (Cu-Cu)...
Reliable bonding of microstructured polymer parts is one of the major challenges in industrial fabrication of microfluidic devices. In the present work, the effects of a UV/ozone surface activation on the bonding process were investigated for the co...
A new and transformative era in semiconductor packaging is underway, wherein, there is a shift from transistor scaling to system scaling and integration through advanced packaging. For advanced packaging, interconnect scaling is a key driver, with in...
To investigate the influence of substrate curvature and process deviations on the bonding quality of microchips mounted on curved surfaces, a thermo–mechanical coupled finite element model was developed in ANSYS 19.2 using a 0402 microchip as a...
This article presents the results of research into the causes of the wear of the piston pin mounted in piston bosses by means of a hinge joint and in the connecting rod small end by means of the thermocompression bond. Changes in geometry and in the...
In this study, an interconnection was formed between a Cu/SnAg pillar bump and an Ni-less surface-treated Cu pad through laser-assisted bonding (LAB), and its bonding characteristics were evaluated. The LAB process influences the bond quality and mec...
The goal of the study was to prepare deep eutectic solvents (DESs) with different urea (U) contents and apply them as potato-starch plasticizers to investigate the influence of various DES compositions on the physicochemical properties of thermoplast...
Platinum is an ideal material for high-temperature resistant device packaging due to its higher melting point and good electrical properties. In this paper, the thermocompression bonding of Pt–Pt metal electrodes was successfully realized throu...
This study reports the fabrication and characterization of copper–silicon carbide (Cu–SiC) metal matrix composites produced using powder metallurgy (PM) combined with thermo-compression processing (TCP), a dual route that remains limited...
Alkali vapor cells are the core components of atomic sensing instruments such as atomic gyroscopes, atomic magnetometers, atomic clocks, etc. Emerging integrated atomic sensing devices require high-performance miniaturized alkali vapor cells, especia...
This article presents a single-crystal piezoelectric energy harvester (PEH) with a trapezoidal hollow hole that can obtain high energy density at low frequency. Harvesters with a hollow structure were fabricated through a series of manufacturing proc...
Brewer’s spent grain (BSG) is the main solid waste generated in beer production and primarily consists of barley malt husks. Based on the active promotion of circular economy practices aimed at recycling food industry by-products, this study as...