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25 March 2026
Acknowledging the Contributions of Our Reviewers in 2025


As a pioneer in open access publishing, MDPI maintains rigorous publication standards. This mission relies on the dedication and expertise of our reviewers, who invest their time and knowledge to ensure the quality and integrity of the research we publish.

In 2025, over 209,000 reviewers contributed to the peer-review process at MDPI, providing more than 1.3 million review reports for our journals. To express our gratitude, MDPI’s Reviewer Recognition Program highlights reviewers across over 400 journals, featuring those who have assessed at least one manuscript and agreed to be acknowledged.

In addition, MDPI has identified its Top 1000 Reviewers of 2024 to recognize those whose expertise, dedication, and thoughtful evaluations were particularly outstanding.

Many journals have also established Outstanding Reviewer Awards to honor our reviewers’ commitment to publication excellence. Together with the Exceptional Reviewer List, we showcase the importance of reviewers’ work and their time and dedication.

These initiatives serve to express our deepest appreciation and gratitude towards the whole reviewer community. In recognition of their contributions, we also welcome new researchers to join this community. If you would like to contribute to open access publishing, learn more about the reviewers’ benefits and sign up to join us.

17 March 2026
Electronics | Highly Cited Papers in 2025 in the “Systems & Control Engineering” Section


The “Systems & Control Engineering” Section comprehensively covers topics related to control systems, serving as a key platform for researchers, engineers, and students from both academia and industry to share innovative ideas and robust research on theoretical and practical aspects of the field.

The Section focuses on the analysis, design, and implementation of control systems, emphasizing both theoretical advances and practical applications in areas such as embedded control, mechatronics, smart systems, power systems, electrical circuits, and computer science. This expansion enables support for a wide range of sectors, including robotics, energy, transportation, manufacturing, defense, and biology.

Our readers enjoy free and unlimited access to the full texts of all open access articles published in the journal. We invite you to explore our most highly cited papers published in 2025, listed below:

1. “Vision-Language Models for Autonomous Driving: CLIP-Based Dynamic Scene Understanding”
by Mohammed Elhenawy, Huthaifa I. Ashqar, Andry Rakotonirainy, Taqwa I. Alhadidi,
Ahmed Jaber and Mohammad Abu Tami
Electronics 2025, 14(7), 1282; https://doi.org/10.3390/electronics14071282
Available online: https://www.mdpi.com/2079-9292/14/7/1282

2. “Human–Robot Interaction Using Dynamic Hand Gesture for Teleoperation of Quadruped Robots with a Robotic Arm”
by Jianan Xie, Zhen Xu, Jiayu Zeng, Yuyang Gao and Kenji Hashimoto
Electronics 2025, 14(5), 860; https://doi.org/10.3390/electronics14050860
Available online: https://www.mdpi.com/2079-9292/14/5/860

3. “Transforming Robots into Cobots: A Sustainable Approach to Industrial Automation”
by Michael Fernandez-Vega, David Alfaro-Viquez, Mauricio Zamora-Hernandez, Jose Garcia-Rodriguez and Jorge Azorin-Lopez
Electronics 2025, 14(11), 2275; https://doi.org/10.3390/electronics14112275
Available online: https://www.mdpi.com/2079-9292/14/11/2275

4. “Towards Dynamic Human–Robot Collaboration: A Holistic Framework for Assembly Planning”
by Fabian Schirmer, Philipp Kranz, Chad G. Rose, Jan Schmitt and Tobias Kaupp
Electronics 2025, 14(1), 190; https://doi.org/10.3390/electronics14010190
Available online: https://www.mdpi.com/2079-9292/14/1/190

5. “Advances in Autism Spectrum Disorder (ASD) Diagnostics: From Theoretical Frameworks to AI-Driven Innovations”
by Christine K. Syriopoulou-Delli
Electronics 2025, 14(5), 951; https://doi.org/10.3390/electronics14050951
Available online: https://www.mdpi.com/2079-9292/14/5/951

6. “Quantum Particle Swarm Optimisation Proportional–Derivative Control for Trajectory Tracking of a Car-like Mobile Robot”
by Joslin Numbi, Nadjet Zioui and Mohamed Tadjine
Electronics 2025, 14(5), 832; https://doi.org/10.3390/electronics14050832
Available online: https://www.mdpi.com/2079-9292/14/5/832

7. “A Class of Anti-Windup Controllers for Precise Positioning of an X-Y Platform with Input Saturations”
by Chung-Wei Chen, Hsiu-Ming Wu and Chau-Yih Nian
Electronics 2025, 14(3), 539; https://doi.org/10.3390/electronics14030539
Available online: https://www.mdpi.com/2079-9292/14/3/539

8. “Intelligent Human–Robot Interaction Assistant for Collaborative Robots”
by Oleksandr Sokolov, Vladyslav Andrusyshyn, Angelina Iakovets and Vitalii Ivanov
Electronics 2025, 14(6), 1160; https://doi.org/10.3390/electronics14061160
Available online: https://www.mdpi.com/2079-9292/14/6/1160

9. “Recursive PID-NT Estimation-Based Second-Order SMC Strategy for Knee Exoskeleton Robots: A Focus on Uncertainty Mitigation”
by Vahid Behnamgol, Mohamad Asadi, Sumeet S. Aphale and Behnaz Sohani
Electronics 2025, 14(7), 1455; https://doi.org/10.3390/electronics14071455
Available online: https://www.mdpi.com/2079-9292/14/7/1455

10. “Sound Source Localization Using Deep Learning for Human–Robot Interaction Under Intelligent Robot Environments”
by Hong-Min Jo, Tae-Wan Kim and Keun-Chang Kwak
Electronics 2025, 14(5), 1043; https://doi.org/10.3390/electronics14051043
Available online: https://www.mdpi.com/2079-9292/14/5/1043

16 March 2026
Meet Us at the Hilton Head Workshop 2026: A Solid-State Sensors, Actuators and Microsystems Workshop, 31 May–4 June 2026, Hilton Head Island, USA


Conference:
Hilton Head Workshop 2026: A Solid-State Sensors, Actuators and Microsystems Workshop
Date: 31 May–4 June 2026
Location: Hilton Head Island, USA

MDPI will be attending the Hilton Head Workshop 2026, which will be held on Hilton Head Island, South Carolina, from 31 May to 4 June 2026.

The Hilton Head Workshop is a long-established multidisciplinary event focused on the latest advances in solid-state sensors, actuators, and microsystems. Since 1984, it has provided an informal and collaborative environment for exchanging ideas, fostering discussion, and sharing emerging research.

This biennial workshop brings together researchers working across sensor and microsystem technologies. Originally established as a regional meeting for participants from the Americas, the event has been open to international attendees since 2020, and researchers worldwide are encouraged to participate and contribute.

The following MDPI journals will be represented at the conference:

If you are planning to attend this conference, please visit our booth. Our delegates look forward to meeting you in person and answering any questions that you may have.

For more information about this conference, please visit the following website: https://www.hh2026.org/.

13 March 2026
Entropy 2026 in Barcelona—Abstract Submission Extended

Due to a large amount of interest and numerous requests from the global academic community, we are pleased to announce that the abstract submission deadline for Entropy 2026: Exploring Complexity and Information in Science has been extended to 1 April 2026. This extension provides the last opportunity for scholars to present their latest research at this premier interdisciplinary event in Barcelona, Spain.

Updated important dates:
Abstract submission deadline:
1 April 2026;
Acceptance notification deadline: 17 April 2026;
Early Bird registration deadline: 22 April 2026;
Registration deadline: 15 June 2026;
Conference dates: 1–3 July 2026.

Why join Entropy 2026?

1. Renowned Chairs:
The conference is led by Prof. Dr. Miguel Rubi (University of Barcelona) and Prof. Dr. Kevin H. Knuth (University at Albany). 

2. Distinguished guests:
Supported by a Scientific Committee of 30+ international experts, the conference will feature a lineup of renowned speakers and pioneers in the field, including Prof. Dr. Ralf Metzler (University of Potsdam), Prof. Dr. Olivier Rioul (Institut Polytechnique de Paris), Prof. Dr. Signe Kjelstrup (NTNU), and many others from top-tier research centers worldwide. 

To view the full speaker lineup, please click here

3. A global academic hub:
This conference has already garnered submissions from world-leading institutions, including Harvard University, Princeton University, the University of Cambridge, Tsinghua University, and the Max Planck Institute, ensuring a substantive intellectual exchange.

4. Publication and recognition:

  • Special Issue: Full manuscripts may be submitted to a dedicated Special Issue of the journal Entropy (ISSN: 1099-4300; IF 2.0) with a 20% APC discount;
  • Proceedings: Extended papers (4–8 pages) can be published free of charge in the Physical Sciences Forum (ISSN: 2673-9984);
  • Awards: This conference will present Best Oral and Best Poster Awards to recognize outstanding scientific contributions.

Topics of interest:
S1. Complex Systems and Network Science;
S2. Information Theory, Data Science, and Artificial Intelligence;
S3. Quantum Information and Quantum Computing;
S4. Thermodynamics and Energy Systems;
S5. Non-Equilibrium Systems and Entropy Production;
S6. Statistical Physics and Stochastic Processes;
S7. Soft and Living Matter;
S8. Applications of Entropy in Science and Engineering.

For any enquiries, please contact the secretariat via entropy2026@mdpi.com. We look forward to welcoming you to Barcelona!

Submit Your Abstract here: https://sciforum.net/user/submission/create/1433.

To register now, please visit the following link: https://sciforum.net/event/Entropy2026?section=#registration.

 

12 March 2026
Meet Us at the 2026 ACM Conference on Intelligent User Interfaces, 23–26 March 2026, Paphos, Cyprus


Conference
: The 2026 ACM Conference on Intelligent User Interfaces
Date: 23–26 March 2026
Location: Paphos, Cyprus

MDPI will be attending the 2026 ACM Conference on Intelligent User Interfaces as an exhibitor. We welcome researchers from different backgrounds to visit and share their latest ideas with us.

The 2026 ACM Conference on Intelligent User Interfaces (ACM IUI) is the annual premier venue, where researchers and practitioners meet and discuss state-of-the-art advances at the intersection of Artificial Intelligence (AI) and Human-Computer Interaction (HCI). Ideal IUI submissions should address practical HCI challenges using machine intelligence and discuss both computational and human-centric aspects of such methodologies, techniques, and systems.

The following MDPI journals will be represented:

If you are planning to attend this conference, please do not hesitate to start an online conversation with us. Our delegates look forward to meeting you in person and answering any questions that you may have. For more information about the conference, please visit the following website: https://iui.acm.org/2026/.

10 March 2026
Electronics | Highly Cited Papers in 2025 in the “Microwave and Wireless Communications” Section


The “Microwave and Wireless Communications” Section provides full coverage of all topics of interest involved in the microwave and wireless communications area. The purpose of this Section is to bring together researchers, engineers, and students from academia and industry to present novel ideas and solid research about the theoretical and practical aspects in the application domains of computer communications and networks.

The primary focus of the Section is on advanced theories and technologies across a wide spectrum. These can be related to microwave and millimeter-wave communication, including radar sensors, etc., and can encompass fundamental research or applied work, elements or systems, hardware or software, methodology, theory, or measurement techniques.

You have free and unlimited access to the full texts of all of the open-access articles published in our journal. We welcome you to read our most cited papers published in 2025 below:

1. “Design and Analysis of Dual-Band Metasurface Filter for Pulse Waves Based on Capacitive Nonlinear Circuits”
by Wenliang Tian, Lingling Yang, Bin Cai, Yongzhi Cheng, Fu Chen, Hui Luo and Xiangcheng Li
Electronics 2024, 13(4), 687; https://doi.org/10.3390/electronics13040687
Available online: https://www.mdpi.com/2079-9292/13/4/687

2. “Advancements in Millimeter-Wave Radar Technologies for Automotive Systems: A Signal Processing Perspective”
by Boxun Yan and Ian P. Roberts
Electronics 2025, 14(7), 1436; https://doi.org/10.3390/electronics14071436
Available online: https://www.mdpi.com/2079-9292/14/7/1436

3. “Enhancing CubeSat Communication Through Beam-Steering Antennas: A Review of Technologies and Challenges”
by Tale Saeidi and Saeid Karamzadeh
Electronics 2025, 14(4), 754; https://doi.org/10.3390/electronics14040754
Available online: https://www.mdpi.com/2079-9292/14/4/754

4. “Multi-Agent Reinforcement Learning for Efficient Resource Allocation in Internet of Vehicles”
by Jun-Han Wang, He He, Jaesang Cha, Incheol Jeong and Chang-Jun Ahn
Electronics 2025, 14(1), 192; https://doi.org/10.3390/electronics14010192
Available online: https://www.mdpi.com/2079-9292/14/1/192

5. “Smart Wireless Sensor Networks with Virtual Sensors for Forest Fire Evolution Prediction Using Machine Learning”
by Ahshanul Haque and Hamdy Soliman
Electronics 2025, 14(2), 223; https://doi.org/10.3390/electronics14020223
Available online: https://www.mdpi.com/2079-9292/14/2/223

6. “Designs and Challenges in Fluid Antenna System Hardware”
by Kin-Fai Tong, Baiyang Liu and Kai-Kit Wong
Electronics 2025, 14(7), 1458; https://doi.org/10.3390/electronics14071458
Available online: https://www.mdpi.com/2079-9292/14/7/1458

7. “A Sub-6GHz Two-Port Crescent MIMO Array Antenna for 5G Applications”
by Heba Ahmed, Allam M. Ameen, Ahmed Magdy, Ahmed Nasser and Mohammed Abo-Zahhad
Electronics 2025, 14(3), 411; https://doi.org/10.3390/electronics14030411
Available online: https://www.mdpi.com/2079-9292/14/3/411

8. “Design and Optimization of an Internet of Things-Based Cloud Platform for Autonomous Agricultural Machinery Using Narrowband Internet of Things and 5G Dual-Channel Communication”
by Baidong Zhao, Dingkun Zheng, Chenghan Yang, Shuang Wang, Madina Mansurova, Sholpan Jomartova, Nadezhda Kunicina, Anatolijs Zabasta, Vladimir Beliaev, Jelena Caiko etc.
Electronics 2025, 14(8), 1672; https://doi.org/10.3390/electronics14081672
Available online: https://www.mdpi.com/2079-9292/14/8/1672

9. “Enhanced Anomaly Detection in IoT Through Transformer-Based Adversarial Perturbations Model”
by Saher Zia, Nargis Bibi, Samah Alhazmi, Nazeer Muhammad and Afnan Alhazmi
Electronics 2025, 14(6), 1094; https://doi.org/10.3390/electronics14061094
Available online: https://www.mdpi.com/2079-9292/14/6/1094

10. “Application of Optical Communication Technology for UAV Swarm”
by Shiqi Chen, Wentao Li, Weibo Zheng, Fangwu Liu, Shibing Zhou, Shulei Wang, Yongchun Yuan and Tao Zhang
Electronics 2025, 14(5), 994; https://doi.org/10.3390/electronics14050994
Available online: https://www.mdpi.com/2079-9292/14/5/994

28 February 2026
MDPI INSIGHTS: The CEO’s Letter #32 - MDPI China and Thailand, China Science Daily, 1,000 Partnerships, R2R

Welcome to the MDPI Insights: The CEO's Letter.

In these monthly letters, I will showcase two key aspects of our work at MDPI: our commitment to empowering researchers and our determination to facilitating open scientific exchange.


Opening Thoughts

Reflections from China: Year-End-Celebrations and Open Access Publishing

In February, I had the pleasure of joining over a thousand colleagues from our Tongzhou and Haidian offices at their end-of-year annual celebration in Beijing.

Spending time with our teams in China is also a powerful reminder of the scale and complexity of MDPI as a global organization. Our colleagues in Beijing, Wuhan, and across the country play a significant role in our day-to-day operations and long-term development. I’m grateful for the hospitality, collaboration, and commitment shown by our managers and teams in China, alongside colleagues worldwide, who have helped steadily build MDPI, brick by brick, over the years.

Below are some data on Open Access (OA) publishing in China and our collaboration in this important research market.

Open Access Publishing in China

China has been the world’s leading country in research and review article publication volume since 2019, exceeding one million publications in 2025. Over the past five years, the gap between China and the second-ranked country, the United States, has continued to widen.

In 2025:

  • 47% of China’s research output was published Open Access
  • Of those OA publications, 76% were Gold Open Access (approximately 382,930 articles)
  • The overall OA distribution remained stable compared with 2024, with Gold OA increasing by 1%

Over the past five years (2021–2025):

  • China published 4,398,050 research and review articles
  • Approximately 48% of this output was OA

According to Dimensions, when comparing the top 20 countries by publication volume (2021–2025):

  • China ranks 1st worldwide in publication volume
  • China ranks 9th in citation performance within this group (for comparison, the US ranks 2nd in publication volume and 10th in citation ranking)
  • Average citations per article: 12.51

Among the top 10 universities globally by publication volume, six are Chinese institutions, alongside Harvard University (USA), the University of São Paulo (Brazil), the University of Toronto (Canada), and the University of Oxford (UK).

MDPI and China

China is an important and long-standing part of MDPI’s global publishing ecosystem:

  • In 2025, MDPI was the largest fully Open Access publisher in China
  • MDPI published 22% of China’s Gold Open Access output (82,133 papers)
  • We received 290,999 submissions from China-affiliated authors and published 82,133 articles
  • There are 8,500+ active Editorial Board Members based in China
    • 64% (5,438) have an H-index above 26
  • MDPI works with:
    • 117 Editors-in-Chief
    • 103 Section Editors-in-Chief
  • 71 China-based institutions currently hold IOAP agreements with MDPI, seven of which rank among the top 10 Chinese institutions by publication volume

China's scale in research output means that the publishing platforms chosen by Chinese scholars will continue to influence the direction of scholarly publishing. At the same time, MDPI’s strength comes from its international collaboration, with colleagues, editors, reviewers, and authors working together across regions and disciplines.

Thank you to all our colleagues in China, and around the world, who support MDPI’s publishing activities across departments and help advance open access research every day.

Impactful Research

“Progress in open science is built through trust, dialogue, and relationships”

Behind the Scenes: A Conversation with China Science Daily

During my trip to Beijing, I also had the opportunity to visit China Science Daily and take part in an interview and broader exchange with their team in Beijing. Visits like this matter because progress in open science is built not only through platforms and infrastructure, but also through trust, dialogue, and relationships across research communities and regions.

China Science Daily: History Museum

As part of the visit, I was given a tour of their History Museum, which offers a thorough perspective on the evolution of China’s first science and technology newspaper, established in 1959. The exhibition highlights how the organization developed into a trusted institution connecting research with the public and policymakers. It was a helpful reminder that at the core of publishing is stewardship, credibility, and long-term public engagement with science.

An Open Exchange on Open Science

During the visit, I met with Dr. Zhao Yan, Editor-in-Chief of ScienceNet. We had an open and engaging conversation about MDPI’s role in Open Access, the evolution of open science globally, and the potential for more collaboration going forward. He especially appreciated the candid and personal nature of our exchange, noting that this kind of dialogue feels important in a landscape where trust and transparency matter.

Interview on Open Access

I also participated in an interview with Ms. Yan Jie, from the Online Media Center and Editor-in-Chief of ScienceNet, China Science Daily. Our discussion covered the growth of Open Access over the past 30 years, MDPI’s mission and values, academic integrity, collaboration with the Chinese research community, and MDPI’s own 30th anniversary milestone. It was a great opportunity to reflect on how open science has matured, and where shared responsibility across publishers, institutions, and researchers continues to matter most.

“Progress in open science is built by more than scale and infrastructure”

I’m sharing a few photos from the visit as a glimpse behind the scenes. The full interview will be published by China Science Daily in due course, and I look forward to sharing it when it is available.

More broadly, visits like this reinforce something I’ve always believed in: progress in open science is built not only through scale and infrastructure, but also through continued dialogue, mutual respect, collaboration, and a willingness to listen across regions and perspectives. That remains central to our work, especially as MDPI reflects on 30 years of publishing, built together.

Inside MDPI

Bangkok Visit: Growth, Partnership, and Local Impact

In February, I also had the opportunity to visit our Bangkok office for the second time in two years to support their local meetings and deliver a training session on how we present MDPI at a corporate level.

It’s easy to spend time with our colleagues in Thailand. From Editorial and Production to Conferences, Marketing, Design, and our Regional Journal Relations Specialist (RJRS), the team continues to grow in scale and professionalism. I’d also like to recognize our local management and admin teams, who have been steadily expanding our office and supporting more than 500 colleagues on the ground.

Academic Partnerships

During the visit, we met with the Engineering Department at King Mongkut’s Institute of Technology Ladkrabang (KMITL). Our discussion focused on the recent MDPI developments, Institutional Open Access Program (IOAP) opportunities, Author Publishing Workshops (APW), and the potential use of JAMS to support their institutional journal.

“MDPI is the third-largest OA publisher in Thailand”

We also shared insights into the growth of Open Access (OA) in Thailand and KMITL’s own publishing trends. These conversations matter because institutions are looking for sustainable ways to support their researchers. Our IOAP agreements are one simple example of how we can provide value in this area while maintaining accessibility for authors.

Thailand and MDPI: 2025 Snapshot

Our Bangkok office, officially launched in 2022, has been growing to support over 500 staff members while continuing to expand its engagement in scholar visits, workshops, and conference collaborations. As at 2025, Thailand submissions to MDPI have increased about 21% and publications by about 25%, maintaining a rejection rate close to the company average. MDPI is the third-largest OA publisher in Thailand, publishing 15% of all Gold OA output in 2025.

Representing MDPI Externally

During the visit, I delivered a training session on how we present MDPI at external events.

This session covered topics related to:

  • Our aim and guiding principles
  • High-level company milestones and Indexing facts and figures
  • Industry partnerships and collaborations
  • Market trends in OA and subscription publishing
  • Country-specific publishing data and collaborations with MDPI
  • Insights from our Voice of Community report

I find that while many colleagues are very familiar with the specific journal for which they have responsibility, fewer have visibility into the broader MDPI ecosystem and the company’s global positioning. These sessions help build alignment, confidence, and consistency in how we represent the company.

What stands out most is that MDPI’s growth is not abstract: it’s visible in the people, the partnerships, and the professionalism developing across our offices.

Coming Together for Science

1,000 Institutional Partners: A Milestone Built on Trust

This month, we reached an important milestone: more than 1,000 institutions worldwide are now part of MDPI’s Institutional Open Access Program (IOAP). On paper, that is a number. In practice, it represents trust.

This milestone symbolizes thousands of conversations with libraries and institutions. It stands for negotiations, renewals, consortium expansions, and, most importantly, relationships built over time. It reflects the work of colleagues across publishing, institutional partnerships, marketing, editorial, finance, and many other teams who contribute to making these agreements operational.

In 2025 alone, more than 61,300 research articles benefited from article processing charge (APC) discounts through IOAP agreements. Tens of thousands of authors were able to publish through a simplified and structured process. At the same time, institutional administrators gained clearer oversight and streamlined workflows.

Why IOAP Matters

When we launched IOAP, the objective was straightforward: to reduce barriers for researchers while supporting institutions in navigating the evolving OA landscape. Over the past decade, the research ecosystem has changed. Funder mandates, national policies, and Plan S–aligned requirements have accelerated the transition to OA.

Institutions need publishing partners who provide transparency, scalability, and operational efficiency. IOAP was designed to support that reality.

For colleagues who would like to better understand the program, this blog-post overview of MDPI’s IOAP provides additional context, including common questions around the transition to OA and how our institutional partnerships are structured.

“Institutions need publishing partners who provide transparency, scalability, and operational efficiency”

Recent Examples

Our agreements continue to evolve across regions:

These examples show that institutions seek structured, predictable models that support their researchers at scale.

Looking Ahead

Crossing the threshold of 1,000 partners tells us that institutions see MDPI not just as a publisher but as a reliable operational partner in advancing open science. This milestone is not a finish line. It is a reminder that the work continues.

Thank you to the entire IOAP team and to all colleagues who contributed to reaching this achievement.

P.S. You can read about this milestone across industry outlets, including STM Publishing News, ALPSP, Research Information, EurekAlert, Brightsurf, among others. You can also read about the coverage in Poland (e.g., media-room, bomega) Korea (newstap), and Romania (EduLike).

Closing Thoughts

Reflections from the Researcher to Reader Conference

During 24–25 February, I attended the 2026 Researcher to Reader Conference in London, UK. Leaders from across scholarly publishing, research infrastructure, libraries, and technology gathered to discuss AI and research integrity, peer review reform, metadata and infrastructure, community engagement, open research policy, and the evolving role of publishers in a rapidly shifting ecosystem.

The conversations were open and honest, and at times uncomfortable – exactly what we need at times. Below are a few reflections that stayed with me.

The Battle for Knowledge: What Becomes Accepted as ‘True’?

One recurring theme was not whether science evolves but whether our infrastructure is resilient enough to sustain trust at scale. Science does not promise certainty: it promises process. As publishing systems grow more complex and become more technologically mediated, the question is how intentionally we design, monitor, and strengthen that process.

Peer Review: Speed, Credentials, and Structural Loops

Researchers consistently call for faster peer review. At the same time, reviewer credentials are often tied to publication records. This creates a structural loop. Publishing history opens reviewing opportunities, reviewing strengthens credentials, and those without early access remain outside the cycle.

There is a need for us to reflect on how opportunity circulates within our systems: we should ask how we create more inclusive pathways for researchers globally to participate in peer review.

Community Engagement Workshop

One of the highlights of R2R was the workshop format, whereby small groups met repeatedly over two days and moved from ideas to tangible strategies.

I joined the Community Engagement workshop led by Lou Peck (CEO at The International Bunch) and Godwyns Onwuchekwa (Principal Consultant at Global Tapestry Consulting). We explored two deceptively simple questions: What is a community? and What does engagement truly mean?

“Engagement requires shared design and shared responsibility”

Too often, organizations equate communication with engagement. The framework discussed mapped a maturity spectrum – from enablement (broadcasting, informing and consulting) to true engagement (collaborating and co-creating).

It was a useful reminder of the fact that if we want trust and loyalty, engagement must go beyond announcements and surveys. It requires shared design and shared responsibility.

AI: Democratization or Digital Colonialism?

I especially enjoyed the thought-provoking presentation from Nikesh Gosalia (Chief Partnership Officer at Cactus Communications), which highlighted an uncomfortable reality:

  • 93% of AI-generated content is in English
  • Approximately 2% is in French
  • Approximately 2% is in German
  • More than 7,000 languages are represented in less than 5% of the content within large AI systems

The implications are profound. Is AI democratizing access to scholarly publishing (making it easier for researchers everywhere to participate in global knowledge production)? Or are we encoding colonialism at scale (entrenching linguistic and structural hierarchies, and making it harder for voices from the Global South to be heard)?

AI is already reshaping how research is created, reviewed, discovered, and shared. Its potential is enormous. But its impact depends not only on capability, but on governance, design, and intentionality. Publishers, funders, and researchers all share responsibility in shaping how these systems evolve.

Ethicality in practice (Lightening Talk)

It was also great to have our colleague Dr Miloš Čučulović (Head of Technology Innovation at MDPI) present MDPI’s Ethicality platform during a lightning talk.

“Technology alone is not the answer”

Ethicality embeds AI-driven checks directly into the submission workflow, supporting editors proactively rather than reacting after publication. As we scale, tools like this help balance trust, efficiency, and research integrity.

This goes back into the underlying theme of the conference that technology alone is not the answer. However, technology embedded thoughtfully within clear governance frameworks can strengthen confidence in the editorial process.

Final thought

The question is no longer whether technology will transform research infrastructure: it is already doing so. The real question is what role each of us will play in shaping that transformation deliberately, with structural maturity, inclusive governance, and engagement that moves from informing to co-creating.

Science needs to evolve, responsibly. And that responsibility extends not only to what we publish, but also to how the systems behind publication are designed. Some important topics to continue reflecting on both internally and within our broader community.

Stefan Tochev
Chief Executive Officer
MDPI AG

26 February 2026
Electronics | Editor’s Choice Articles from the “Artificial Intelligence” Section in the Second Half of 2025

1. “BASK: Backdoor Attack for Self-Supervised Encoders with Knowledge Distillation Survivability”
by Yihong Zhang, Guojia Li, Yihui Zhang, Yan Cao, Mingyue Cao and Chengyao Xue
Electronics 2025, 14(13), 2724; https://doi.org/10.3390/electronics14132724
Available online:
https://www.mdpi.com/2079-9292/14/13/2724

2. “Dual-Core Hierarchical Fuzzing Framework for Efficient and Secure Firmware Over-the-Air
by Na-Hyun Kim, Jin-Min Lee and Il-Gu Lee
Electronics 2025, 14(14), 2886; https://doi.org/10.3390/electronics14142886
Available online: https://www.mdpi.com/2079-9292/14/14/2886

3. “Federated Unlearning Framework for Digital Twin-Based Aviation Health Monitoring Under Sensor Drift and Data Corruption”
by Igor Kabashkin
Electronics 2025, 14(15), 2968; https://doi.org/10.3390/electronics14152968
Available online: https://www.mdpi.com/2079-9292/14/15/2968

4. “A Multimodal Deep Learning Framework for Consistency-Aware Review Helpfulness Prediction”
by Seonu Park, Xinzhe Li, Qinglong Li and Jaekyeong Kim
Electronics 2025, 14(15), 3089; https://doi.org/10.3390/electronics14153089
Available online: https://www.mdpi.com/2079-9292/14/15/3089

5. “A Deep Reinforcement Learning Approach for Energy Management in Low Earth Orbit Satellite Electrical Power Systems”
by Silvio Baccari, Elisa Mostacciuolo, Massimo Tipaldi and Valerio Mariani
Electronics 2025, 14(15), 3110; https://doi.org/10.3390/electronics14153110
Available online: https://www.mdpi.com/2079-9292/14/15/3110

6. “Towards Energy Efficiency of HPC Data Centers: A Data-Driven Analytical Visualization Dashboard Prototype Approach”
by Keith Lennor Veigas, Andrea Chinnici, Davide De Chiara and Marta Chinnici
Electronics 2025, 14(16), 3170; https://doi.org/10.3390/electronics14163170
Available online: https://www.mdpi.com/2079-9292/14/16/3170

7. “WTCMC: A Hyperspectral Image Classification Network Based on Wavelet Transform Combining Mamba and Convolutional Neural Networks”
by Guanchen Liu, Qiang Zhang, Xueying Sun and Yishuang Zhao
Electronics 2025, 14(16), 3301; https://doi.org/10.3390/electronics14163301
Available online: https://www.mdpi.com/2079-9292/14/16/3301

8. “Hardware Accelerator Design by Using RT-Level Power Optimization Techniques on FPGA for Future AI Mobile Applications”
by Achyuth Gundrapally, Yatrik Ashish Shah, Sai Manohar Vemuri and Kyuwon (Ken) Choi
Electronics 2025, 14(16), 3317; https://doi.org/10.3390/electronics14163317
Available online: https://www.mdpi.com/2079-9292/14/16/3317

9. “Enhancing Machine Learning-Based DDoS Detection Through Hyperparameter Optimization”
by Shao-Rui Chen, Shiang-Jiun Chen and Wen-Bin Hsieh
Electronics 2025, 14(16), 3319; https://doi.org/10.3390/electronics14163319
Available online: https://www.mdpi.com/2079-9292/14/16/3319

10. “AFCN: An Attention-Based Fusion Consistency Network for Facial Emotion Recognition”
by Qi Wei, Hao Pei and Shasha Mao
Electronics 2025, 14(17), 3523; https://doi.org/10.3390/electronics14173523
Available online: https://www.mdpi.com/2079-9292/14/17/3523

11. “Multi-Scale Dual Discriminator Generative Adversarial Network for Gas Leakage Detection”
by Saif H. A. Al-Khazraji, Hafsa Iqbal, Jesús Belmar Rubio, Fernando García and Abdulla Al-Kaff
Electronics 2025, 14(17), 3564; https://doi.org/10.3390/electronics14173564
Available online: https://www.mdpi.com/2079-9292/14/17/3564

12. “User Authentication Using Graph Neural Networks (GNNs) for Adapting to Dynamic and Evolving User Patterns”
by Hyun-Sik Choi
Electronics 2025, 14(18), 3570; https://doi.org/10.3390/electronics14183570
Available online: https://www.mdpi.com/2079-9292/14/18/3570

13. “A Survey of Large Language Models: Evolution, Architectures, Adaptation, Benchmarking, Applications, Challenges, and Societal Implications”
by Seyed Mahmoud Sajjadi Mohammadabadi, Burak Cem Kara, Can Eyupoglu, Can Uzay, Mehmet Serkan Tosun and Oktay Karakuş
Electronics 2025, 14(18), 3580; https://doi.org/10.3390/electronics14183580
Available online: https://www.mdpi.com/2079-9292/14/18/3580

14. “Strengthening Small Object Detection in Adapted RT-DETR Through Robust Enhancements”
by Manav Madan and Christoph Reich
Electronics 2025, 14(19), 3830; https://doi.org/10.3390/electronics14193830
Available online: https://www.mdpi.com/2079-9292/14/19/3830

15. “Cognitive Bias Mitigation in Executive Decision-Making: A Data-Driven Approach Integrating Big Data Analytics, AI, and Explainable Systems”
by Leonidas Theodorakopoulos, Alexandra Theodoropoulou and Constantinos Halkiopoulos
Electronics 2025, 14(19), 3930; https://doi.org/10.3390/electronics14193930
Available online: https://www.mdpi.com/2079-9292/14/19/3930

16. “Adapting a Previously Proposed Open-Set Recognition Method for Time-Series Data: A Biometric User Identification Case Study”
by András Pál Halász, Nawar Al Hemeary, Lóránt Szabolcs Daubner, János Juhász, Tamás Zsedrovits and Kálmán Tornai
Electronics 2025, 14(20), 3983; https://doi.org/10.3390/electronics14203983
Available online: https://www.mdpi.com/2079-9292/14/20/3983

17. “DataSense: A Real-Time Sensor-Based Benchmark Dataset for Attack Analysis in IIoT with Multi-Objective Feature Selection”
by Amir Firouzi, Sajjad Dadkhah, Sebin Abraham Maret and Ali A. Ghorbani
Electronics 2025, 14(20), 4095; https://doi.org/10.3390/electronics14204095
Available online: https://www.mdpi.com/2079-9292/14/20/4095

18. “Avocado: An Interpretable Fine-Grained Intrusion Detection Model for Advanced Industrial Control Network Attacks
by Xin Liu, Tao Liu and Ning Hu
Electronics 2025, 14(21), 4233; https://doi.org/10.3390/electronics14214233
Available online: https://www.mdpi.com/2079-9292/14/21/4233

19. “Degradation of Multi-Task Prompting Across Six NLP Tasks and LLM Families”
by Federico Di Maio and Manuel Gozzi
Electronics 2025, 14(21), 4349; https://doi.org/10.3390/electronics14214349
Available online: https://www.mdpi.com/2079-9292/14/21/4349

20. “A Flexible Multi-Core Hardware Architecture for Stereo-Based Depth Estimation CNNs”
by Steven Colleman, Andrea Nardi-Dei, Marc C. W. Geilen, Sander Stuijk and Toon Goedemé
Electronics 2025, 14(22), 4425; https://doi.org/10.3390/electronics14224425
Available online: https://www.mdpi.com/2079-9292/14/22/4425

21. “Lightweight AI for Sensor Fault Monitoring”
by Bektas Talayoglu, Jerome Vande Velde and Bruno da Silva
Electronics 2025, 14(22), 4532; https://doi.org/10.3390/electronics14224532
Available online: https://www.mdpi.com/2079-9292/14/22/4532

22. “From Vulnerability to Robustness: A Survey of Patch Attacks and Defenses in Computer Vision”
by Xinyun Liu and Ronghua Xu
Electronics 2025, 14(23), 4553; https://doi.org/10.3390/electronics14234553
Available online: https://www.mdpi.com/2079-9292/14/23/4553

23. “A Two-Stage End-to-End Framework for Robust Scene Text Spotting with Self-Calibrated Detection and Contextual Recognition”
by Yuning Cheng, Jinhong Huang, Io San Tai, Subrota Kumar Mondal, Tianqi Wang and Hussain Mohammed Dipu Kabir
Electronics 2025, 14(23), 4594; https://doi.org/10.3390/electronics14234594
Available online: https://www.mdpi.com/2079-9292/14/23/4594

24. “Geometry-Aware Cross-Modal Translation with Temporal Consistency for Robust Multi-Sensor Fusion in Autonomous Driving”
by Zhengyi Lu, Jinxiang Pang and Zhehai Zhou
Electronics 2025, 14(23), 4663; https://doi.org/10.3390/electronics14234663
Available online: https://www.mdpi.com/2079-9292/14/23/4663

25. “Exploring the Educational Applications of Large Language Models: A Systematic Review and Topic Analysis”
by Bianca-Raluca Cibu, Liliana Crăciun, Anca Gabriela Molănescu and Liviu-Adrian Cotfas
Electronics 2025, 14(23), 4683; https://doi.org/10.3390/electronics14234683
Available online: https://www.mdpi.com/2079-9292/14/23/4683

26. “Unleashing GHOST: An LLM-Powered Framework for Automated Hardware Trojan Design”
by Md Omar Faruque, Peter Jamieson, Ahmad Patooghy and Abdel-Hameed A. Badawy
Electronics 2025, 14(23), 4745; https://doi.org/10.3390/electronics14234745
Available online: https://www.mdpi.com/2079-9292/14/23/4745

27. “Communication-Efficient Federated Optimization with Gradient Clipping and Attention Aggregation for Data Analytics and Prediction”
by Shengyuan Tang, Linwan Zhang, Shengzhe Xu, Xinyue Zeng, Peng Hu, Xinyi Gong and Manzhou Li
Electronics 2025, 14(23), 4778; https://doi.org/10.3390/electronics14234778
Available online: https://www.mdpi.com/2079-9292/14/23/4778

28. “Ant Colony Optimization for CMOS Physical Design: Reducing Layout Area and Improving Aspect Ratio in VLSI Circuits”
by Arnab A. Purkayastha, Jay Tharwani and Shobhit Aggarwal
Electronics 2025, 14(24), 4825; https://doi.org/10.3390/electronics14244825
Available online: https://www.mdpi.com/2079-9292/14/24/4825

29. “Multi-Agent Coordination Strategies vs. Retrieval-Augmented Generation in LLMs: A Comparative Evaluation”
by Irina Radeva, Ivan Popchev, Lyubka Doukovska and Miroslava Dimitrova
Electronics 2025, 14(24), 4883; https://doi.org/10.3390/electronics14244883
Available online: https://www.mdpi.com/2079-9292/14/24/4883

30. “Optimizing EV Battery Charging Using Fuzzy Logic in the Presence of Uncertainties and Unknown Parameters”
by Minhaz Uddin Ahmed, Md Ohirul Qays, Stefan Lachowicz and Parvez Mahmud
Electronics 2026, 15(1), 177; https://doi.org/10.3390/electronics15010177
Available online: https://www.mdpi.com/2079-9292/15/1/177

We would like to invite you to explore our recent publications and submit your future work to Electronics.

Electronics Editorial Office

25 February 2026
Meet Us at the 73rd JSAP Spring Meeting 2026, 15–18 March 2026, Tokyo, Japan


The 73rd JSAP Spring Meeting 2026 will be held from 15 to 18 March 2026 in Tokyo, Japan. The conference will be hosted by the Japan Society of Applied Physics.

The areas of focus for the conference include the following:

  • Semiconductor and AI Convergence;
  • Quantum Science and Technologies;
  • Optics and Photonics;
  • Advanced Materials and Fabrication;
  • Biomedical and Applied Engineering;
  • Energy and Functional Electronics;
  • Interdisciplinary and Industrial Application.

The following MDPI journals will be represented at the conference:

If you are planning to attend the above conference, please feel free to get in touch via email. Our delegates also look forward to meeting you in person and answering any questions that you may have.

For more information about the conference, please visit the following link: https://meeting.jsap.or.jp/english.

25 February 2026
Electronics | Highly Cited Papers in 2025 in the “Industrial Electronics” Section

Industrial electronics play a vital role in improving the efficiency and productivity of industries like energy, transportation, petroleum, chemical, semiconductor, mining, agriculture, and others. As a branch of electronics dealing with power electronic switches, sensors, actuators, meters, intelligent electronic devices (IEDs), automation equipment, semiconductors, nanotechnology, etc., current emphasis is placed on power conditioning using power semiconductor devices in modernizing industry technology.

This Section of Electronics (ISSN: 2079-9292) is devoted to presenting the emerging technologies and trends in the industrial electronics sector, publishing original research and state-of-the-art review articles. The main research area includes applications of industrial electronics and its control, computation, and communication to enrich industrial systems and processes. All submissions are subject to a peer-review process. We encourage the submission of original contributions derived from theoretical- and/or application-oriented research studies.

You have free and unlimited access to the full texts of all of the open access articles published in our journal. We invite you to read our most highly cited papers published in 2025, listed below:

1. “Advancing Power Systems with Renewable Energy and Intelligent Technologies: A Comprehensive Review on Grid Transformation and Integration”
by Muhammed Cavus
Electronics 2025, 14(6), 1159; https://doi.org/10.3390/electronics14061159
Available online: https://www.mdpi.com/2079-9292/14/6/1159

2. “Review of Drone-Based Technologies for Wind Turbine Blade Inspection”
by Seong-Jun Heo and Wongi S. Na
Electronics 2025, 12(2), 227; https://doi.org/10.3390/electronics14020227
Available online: https://www.mdpi.com/2079-9292/14/2/227

3. “Trust by Design: An Ethical Framework for Collaborative Intelligence Systems in Industry 5.0”
by Emmanuel A. Merchán-Cruz, Ioseb Gabelaia, Mihails Savrasovs, Mark F. Hansen, Shwe Soe, Ricardo G. Rodriguez-Cañizo and Gerardo Aragón-Camarasa
Electronics 2025, 14(10), 1952; https://doi.org/10.3390/electronics14101952
Available online: https://www.mdpi.com/2079-9292/14/10/1952

4. “A Wavelet Transform-Based Transfer Learning Approach for Enhanced Shaft Misalignment Diagnosis in Rotating Machinery”
by Houssem Habbouche, Tarak Benkedjouh, Yassine Amirat and Mohamed Benbouzid
Electronics 2025, 14(2), 341; https://doi.org/10.3390/electronics14020341
Available online: https://www.mdpi.com/2079-9292/14/2/341

5. “Adaptive Neuro Fuzzy Inference System (ANFIS)-Based Control for Solving the Misalignment Problem in Vehicle-to-Vehicle Dynamic Wireless Charging Systems”
by Md Sadiqur Rahman and Mohd. Hasan Ali
Electronics 2025, 14(3), 507; https://doi.org/10.3390/electronics14030507
Available online: https://www.mdpi.com/2079-9292/14/3/507

6. “A Systematic Review of Energy Efficiency Metrics for Optimizing Cloud Data Center Operations and Management”
by Ashkan Safari, Hoda Sorouri, Afshin Rahimi and Arman Oshnoei
Electronics 2025, 14(11), 2214; https://doi.org/10.3390/electronics14112214
Available online: https://www.mdpi.com/2079-9292/14/11/2214

7. “5G-TSN Integrated Prototype for Reliable Industrial Communication Using Frame Replication and Elimination for Reliability”
by Pierre E. Kehl, Junaid Ansari, Mikael Lovrin, Praveen Mohanram, Chi-Chuan (Eric) Liu, Jun-Lin (Larry) Yeh and Robert H
Electronics 2025, 14(4), 758; https://doi.org/10.3390/electronics14040758
Available online: https://www.mdpi.com/2079-9292/14/4/758

8. “A Framework for Communication–Compute–Control Co-Design in Cyber–Physical Systems”
by Leefke Grosjean, Joachim Sachs, Junaid Ansari, Norbert Reider, Aitor Hernandez Herranz and Christer Holmberg
Electronics 2025, 14(5), 864; https://doi.org/10.3390/electronics14050864
Available online: https://www.mdpi.com/2079-9292/14/5/864

9. “A Lightweight Multi-Angle Feature Fusion CNN for Bearing Fault Diagnosis”
by Huanli Li, Guoqiang Wang, Nianfeng Shi, Yingying Li, Wenlu Hao and Chongwen Pang
Electronics 2025, 14(14), 2774; https://doi.org/10.3390/electronics14142774
Available online: https://www.mdpi.com/2079-9292/14/14/2774

10. “High Step-Up Interleaved DC–DC Converter with Voltage-Lift Capacitor and Voltage Multiplier Cell”
by Shin-Ju Chen, Sung-Pei Yang, Chao-Ming Huang and Po-Yuan Hu
Electronics 2025, 14(6), 1209; https://doi.org/10.3390/electronics14061209
Available online: https://www.mdpi.com/2079-9292/14/6/1209

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