Flux contained in solder paste significantly affects the process of solder joint creation during reflow soldering, including the creation of an intermetallic layer (IML). This work investigates the dependence of intermetallic layer thickness on ROL0/...
Viscosity is one of the most important physical characteristics of choosing a flux for solder paste. However, not in all cases do the producers give information about the viscosity of commercial flux. A recent promising trend is to mix various kinds...
Neural implants provide effective treatment and diagnosis options for diseases where pharmaceutical therapies are missing or ineffective. These active implantable medical devices (AIMDs) are designed to remain implanted and functional over decades. A...
This study systematically investigates the influence of Bi content on the electromigration (EM) lifetime of low-temperature Cu/Sn-xBi-1Ag (600 μm)/Cu interconnects, where x = 57, 47 and 40 wt.%. The intrinsically higher product of diffusivity and...
The aim of the research was to characterize the soldering alloy In–Ag–Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid poi...
Electrochemical migration (ECM) on the surface of printed circuit boards (PCBs) continues to pose a significant reliability risk in electronics. Nevertheless, the existing literature lacks studies that address the solder mask and solder pad design as...
This article researches the effect of Sn-based solder alloys on flip-chip light-emitting diode LED (FC-LED) filament properties. SEM images, shearing force, steady-state voltage, blue light luminous flux, and junction temperature were examined to dem...
This study investigated the microstructure and properties of soldered joints of AISI 304 stainless steel and PMMA thermoplastic or AW-1050A aluminum alloys made using Resistance Element Soldering (RES) technology. The bimetallic element used in RES p...
This study evaluates the applicability of lead-free SnAg5 solder in Resistance Element Soldering (RES) technology for joining an AISI 304 stainless steel sheet and a PMMA (polymethyl methacrylate) thermoplastic. The microstructure and properties of t...
Resistance Element Soldering (RES) is one of the new methods of joining dissimilar materials by resistance heating using an element. Sn60Pb40 solder, which has been used for decades in tin smithing and the electrical industry, has already been tested...
In this paper, we present a non-destructive testing (NDT) technique based on in situ detection of defects up to 100 °C by ultrasonic testing (UT) during construction of parts by a metal additive manufacturing technology known as wire arc additive...
In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system...
In order to meet the service requirements of electronic devices working at 300 °C in the fields of energy resource prospecting and space exploration, Cr element was added to modify AuGa solder to improve its high-temperature performance. The resu...
The properties of Sn99Ag0.3Cu0.7 (SACX0307) solder alloy reinforced with ZnO nanoparticles were investigated. The primary ZnO particle sizes were 50, 100, and 200 nm. They were added to a solder paste at a ratio of 1.0 wt %. The wettability, the void...
This work aims to evaluate the possibility of fabricating conductive paths for printed circuit boards from low-temperature melting metal alloys on low-temperature 3D printed substrates and mounting through-hole electronic components using the fused d...
Rapid development of additive manufacturing and new composites materials with unique properties are promising tools for fabricating structural electronics. However, according to the typical maximum resolution of additive manufacturing methods, there...
This study investigates the effect of SiC nanoparticle addition on the microstructure, interfacial reactions, and mechanical properties of Zn5Al3Ti active solder used for ultrasonic soldering of AlN ceramic to copper substrates. Composite solders con...
A suitable connection method to automatically produce E-textiles does not exist. Ultrasonic soldering could be a good solution for that since it works with flux-free solder, which avoids embrittlement of the textile integrated wires. This article des...
Cu is widely employed in power device packaging materials owing to its excellent electrical and thermal conductivity, coupled with economic viability. Sintered Cu currently stands as one of the representative interconnect materials in power device pa...
A ceramic-packaged, dual-layer-stacked System-in-Package (SiP) architecture combines the hermeticity of ceramic substrates with the superior radio frequency (RF) performance of organic substrates to meet the demands for high-density integration, cost...
Tin–silver–copper (SAC) solder alloys are the most promising candidates to replace Sn–Pb solder alloys. However, their application is still facing several challenges; one example is the electrochemical corrosion behaviour, which imp...
Developing a joining technology for 2G HTS tapes without significantly reducing their superconducting property is crucial for numerous applications (MRI, motor/generator, power transmission, etc.). In this study, low sintering temperature (~230 °...
To address solder paste drawbacks, such as die contamination and flux residue, a polymer-based sheet containing Sn-3.0 (wt%) Ag-0.5Cu solder particles as fillers was fabricated, and its bonding characteristics were analyzed. The reductant in the manu...
In this study, an interconnection was formed between a Cu/SnAg pillar bump and an Ni-less surface-treated Cu pad through laser-assisted bonding (LAB), and its bonding characteristics were evaluated. The LAB process influences the bond quality and mec...
With the increasing number of inputs and outputs, and the decreasing interconnection spacing, electrical interconnection failures caused by electromigration (EM) have attracted more and more attention. The electromigration reliability and failure mec...
The electromigration behavior of microbumps is inevitably altered under bidirectional currents. Herein, based on a designed test system, the effect of current direction and time proportion of forward current is investigated on Cu Pillar/Ni/Sn-1.8 Ag/...
The waveguides used in spacecraft antenna feeders are often assembled using external couplers or flanges subject to further welding or soldering. Making permanent joints by means of induction heating has proven to be the best solution in this context...
The reactive soldering of silicon-carbide (SiC) ceramics to a Ni-SiC composite was investigated using an Sn-5Sb-3Ti active solder and electron-beam heating at 750 °C, 850 °C and 950 °C. Wettability: The average contact angle decreased fro...
This study aims to characterize experimentally the heat transfer in micro-milled multi-microchannels copper heat sinks operating with flow boiling, in the attempt to contribute to the development of novel and high heat flux thermal management systems...
9 November 2023
Gum rosin is an important agricultural commodity which is widely used as a raw material for various industries. However, gum rosin has low stability, crystallizes easily, and tends to oxidize. This is due to carboxyl groups and conjugated double bond...