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Article

Effect of Cr Addition on Microstructure and Properties of AuGa Solder

by 1, 1,*, 1, 2,3 and 3
1
College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 211100, China
2
State Key Laboratory of Advanced Brazing Filler Metals and Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, China
3
Institute of Advanced Brazing Materials and Technology, China Innovation Academy of Intelligent Equipment Co., Ltd, Ningbo 315700, China
*
Author to whom correspondence should be addressed.
Metals 2020, 10(11), 1449; https://doi.org/10.3390/met10111449
Received: 26 September 2020 / Revised: 16 October 2020 / Accepted: 28 October 2020 / Published: 29 October 2020
In order to meet the service requirements of electronic devices working at 300 °C in the fields of energy resource prospecting and space exploration, Cr element was added to modify AuGa solder to improve its high-temperature performance. The results showed that the addition of 0.3 wt.% Cr element reduced the loss of Ga element in the smelting and casting process, and effectively improved the problem of the inhomogeneous microstructure of the solder matrix. On the basis of maintaining the good wettability of the solder, the addition of trace chromium effectively restrains the excessive flux of the solder, and the presence of chromium improves the oxidation resistance of the solder. Furthermore, Cr element optimized the interface morphology and improved the mechanical properties of the solder joint. The shear strength of the AuGa-0.3Cr/Ni joint was 87.2 MPa, which was 13.1% higher than that of the joint without Cr element. After 240 h of aging, the shear strength of the AuGa-0.3Cr joint was still the peak value at 84.1 MPa, which was 16.3% higher than that of the AuGa joint. View Full-Text
Keywords: Cr element; AuGa solder; microstructure; oxidation resistance; mechanical properties Cr element; AuGa solder; microstructure; oxidation resistance; mechanical properties
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MDPI and ACS Style

Tao, Y.; Xue, S.; Liu, H.; Long, W.; Wang, B. Effect of Cr Addition on Microstructure and Properties of AuGa Solder. Metals 2020, 10, 1449. https://doi.org/10.3390/met10111449

AMA Style

Tao Y, Xue S, Liu H, Long W, Wang B. Effect of Cr Addition on Microstructure and Properties of AuGa Solder. Metals. 2020; 10(11):1449. https://doi.org/10.3390/met10111449

Chicago/Turabian Style

Tao, Yu, Songbai Xue, Han Liu, Weimin Long, and Bo Wang. 2020. "Effect of Cr Addition on Microstructure and Properties of AuGa Solder" Metals 10, no. 11: 1449. https://doi.org/10.3390/met10111449

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