Research Advances in Microelectronics Packaging and Devices: From Materials to Reliability
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".
Deadline for manuscript submissions: 10 December 2026 | Viewed by 3700
Special Issue Editor
Special Issue Information
Dear Colleagues,
The rapid evolution of integrated circuit technologies has elevated packaging to a pivotal role in enabling next-generation performance, miniaturization, and reliability. Concurrently, artificial intelligence (AI) is reshaping research paradigms, offering unprecedented opportunities for data-driven discovery and optimization. To address these transformative trends, MDPI Materials is pleased to announce a Special Issue titled “Research Advances in Microelectronics Packaging and Devices: From Materials to Reliability”.
This issue seeks high-quality contributions exploring cutting-edge developments across the packaging ecosystem—from process innovations to interconnect challenges and from atomic-scale material behavior to system-level reliability insights. Key topics include (but are not limited to):
- Three-dimensional heterogeneous integration and advanced interconnect solutions (e.g., hybrid bonding, TSV/TGV technologies);
- High-power device packaging for automotive, 5G/6G, and power electronics applications;
- Material-process-reliability relationships, including novel materials and failure mechanisms under extreme conditions;
- Physical and failure analysis of IC;
- Uncertainty quantification in reliability modeling and AI/ML-driven approaches for predictive design and accelerated testing.
We particularly encourage submissions addressing TSV/TGV fabrication challenges, emerging packaging architectures (e.g., chipsets, photonic integration), and studies leveraging data-centric methodologies (e.g., AI/ML, multiscale simulations) to unlock new insights into material behavior, process optimization, or lifetime prediction.
For author guidelines and additional details, please visit [https://www.mdpi.com/journal/materials/instructions].
Join us in advancing the frontiers of microelectronics packaging—a field where materials innovation, process precision, and intelligent analytics converge to redefine the future of ICs.
Dr. Zhiheng Huang
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- microelectronic packaging
- high-power device packaging
- materials and device reliability
- TSV/TGV
- hybrid bonding
- AI/ML
- microstructure
- uncertainty quantification
- physical and failure analysis
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